DE60120147D1 - Härtbare silikonharz-zusammensetzung und reaktive siliziumverbindungen - Google Patents
Härtbare silikonharz-zusammensetzung und reaktive siliziumverbindungenInfo
- Publication number
- DE60120147D1 DE60120147D1 DE60120147T DE60120147T DE60120147D1 DE 60120147 D1 DE60120147 D1 DE 60120147D1 DE 60120147 T DE60120147 T DE 60120147T DE 60120147 T DE60120147 T DE 60120147T DE 60120147 D1 DE60120147 D1 DE 60120147D1
- Authority
- DE
- Germany
- Prior art keywords
- silicone resin
- resin composition
- group
- silicon compounds
- reactive silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920002050 silicone resin Polymers 0.000 title abstract 4
- 239000011342 resin composition Substances 0.000 title abstract 2
- 150000003377 silicon compounds Chemical class 0.000 title 1
- 150000002430 hydrocarbons Chemical group 0.000 abstract 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 229910008051 Si-OH Inorganic materials 0.000 abstract 1
- 229910006358 Si—OH Inorganic materials 0.000 abstract 1
- 229910014307 bSiO Inorganic materials 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0836—Compounds with one or more Si-OH or Si-O-metal linkage
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00401160 | 2000-04-27 | ||
EP00401160 | 2000-04-27 | ||
PCT/EP2001/004606 WO2001083608A1 (en) | 2000-04-27 | 2001-04-24 | Curable silicone resin composition and reactive silicon compounds |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60120147D1 true DE60120147D1 (de) | 2006-07-06 |
DE60120147T2 DE60120147T2 (de) | 2006-09-28 |
Family
ID=8173660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60120147T Expired - Fee Related DE60120147T2 (de) | 2000-04-27 | 2001-04-24 | Härtbare silikonharz-zusammensetzung und reaktive siliziumverbindungen |
Country Status (7)
Country | Link |
---|---|
US (1) | US6780471B2 (de) |
EP (1) | EP1276807B1 (de) |
JP (1) | JP2003531942A (de) |
AT (1) | ATE306518T1 (de) |
AU (1) | AU2001273963A1 (de) |
DE (1) | DE60120147T2 (de) |
WO (1) | WO2001083608A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5246607B2 (ja) * | 2008-05-07 | 2013-07-24 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物、硬化膜、保護膜及び絶縁膜、並びにそれを用いた半導体装置及び表示体装置 |
KR101266290B1 (ko) * | 2008-12-30 | 2013-05-22 | 제일모직주식회사 | 레지스트 하층막용 하드마스크 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법 |
KR101266291B1 (ko) * | 2008-12-30 | 2013-05-22 | 제일모직주식회사 | 레지스트 하층막용 조성물 및 이를 이용한 반도체 집적회로디바이스의 제조방법 |
JP7406300B2 (ja) | 2018-11-12 | 2023-12-27 | 信越化学工業株式会社 | ヨウ素含有ケイ素化合物の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA691206A (en) | 1964-07-21 | Dow Corning Corporation | Method of damping vibration | |
GB1119666A (en) | 1965-08-06 | 1968-07-10 | Ici Ltd | Organosilicon polymers |
GB1101589A (en) | 1965-09-09 | 1968-01-31 | Ici Ltd | Organosilicon resins |
JPS6131461A (ja) * | 1984-07-24 | 1986-02-13 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノシロキサン組成物 |
JPS6164753A (ja) * | 1984-09-06 | 1986-04-03 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノシロキサン組成物 |
US5034061A (en) * | 1990-03-15 | 1991-07-23 | General Electric Company | Transparent shatter-resistant silicone coating |
KR960706537A (ko) * | 1993-12-17 | 1996-12-09 | 네일 울프만 | 고내열성의 가공가능한 실리콘 복합재료[silicone composite materials having high temperature resistance] |
JP3277749B2 (ja) * | 1995-04-03 | 2002-04-22 | 信越化学工業株式会社 | シリコーンゲル組成物及びポッティング材 |
US5747608A (en) * | 1996-12-31 | 1998-05-05 | Dow Corning Corporation | Rubber-modified rigid silicone resins and composites produced therefrom |
US5830950A (en) * | 1996-12-31 | 1998-11-03 | Dow Corning Corporation | Method of making rubber-modified rigid silicone resins and composites produced therefrom |
JP3518399B2 (ja) * | 1999-03-12 | 2004-04-12 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
-
2001
- 2001-04-24 AT AT01940358T patent/ATE306518T1/de not_active IP Right Cessation
- 2001-04-24 WO PCT/EP2001/004606 patent/WO2001083608A1/en active IP Right Grant
- 2001-04-24 DE DE60120147T patent/DE60120147T2/de not_active Expired - Fee Related
- 2001-04-24 JP JP2001580225A patent/JP2003531942A/ja active Pending
- 2001-04-24 AU AU2001273963A patent/AU2001273963A1/en not_active Abandoned
- 2001-04-24 US US10/258,722 patent/US6780471B2/en not_active Expired - Fee Related
- 2001-04-24 EP EP01940358A patent/EP1276807B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20030130389A1 (en) | 2003-07-10 |
WO2001083608A1 (en) | 2001-11-08 |
DE60120147T2 (de) | 2006-09-28 |
AU2001273963A1 (en) | 2001-11-12 |
US6780471B2 (en) | 2004-08-24 |
JP2003531942A (ja) | 2003-10-28 |
EP1276807B1 (de) | 2005-10-12 |
ATE306518T1 (de) | 2005-10-15 |
EP1276807A1 (de) | 2003-01-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |