AU2001273963A1 - Curable silicone resin composition and reactive silicon compounds - Google Patents
Curable silicone resin composition and reactive silicon compoundsInfo
- Publication number
- AU2001273963A1 AU2001273963A1 AU2001273963A AU7396301A AU2001273963A1 AU 2001273963 A1 AU2001273963 A1 AU 2001273963A1 AU 2001273963 A AU2001273963 A AU 2001273963A AU 7396301 A AU7396301 A AU 7396301A AU 2001273963 A1 AU2001273963 A1 AU 2001273963A1
- Authority
- AU
- Australia
- Prior art keywords
- silicone resin
- resin composition
- group
- curable silicone
- silicon compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920002050 silicone resin Polymers 0.000 title abstract 4
- 239000011342 resin composition Substances 0.000 title abstract 2
- 150000003377 silicon compounds Chemical class 0.000 title 1
- 150000002430 hydrocarbons Chemical group 0.000 abstract 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 229910008051 Si-OH Inorganic materials 0.000 abstract 1
- 229910006358 Si—OH Inorganic materials 0.000 abstract 1
- 229910014307 bSiO Inorganic materials 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0836—Compounds with one or more Si-OH or Si-O-metal linkage
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP00401160 | 2000-04-27 | ||
| EP00401160 | 2000-04-27 | ||
| PCT/EP2001/004606 WO2001083608A1 (en) | 2000-04-27 | 2001-04-24 | Curable silicone resin composition and reactive silicon compounds |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001273963A1 true AU2001273963A1 (en) | 2001-11-12 |
Family
ID=8173660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001273963A Abandoned AU2001273963A1 (en) | 2000-04-27 | 2001-04-24 | Curable silicone resin composition and reactive silicon compounds |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6780471B2 (enExample) |
| EP (1) | EP1276807B1 (enExample) |
| JP (1) | JP2003531942A (enExample) |
| AT (1) | ATE306518T1 (enExample) |
| AU (1) | AU2001273963A1 (enExample) |
| DE (1) | DE60120147T2 (enExample) |
| WO (1) | WO2001083608A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8492469B2 (en) | 2008-05-07 | 2013-07-23 | Sumitomo Bakelite Co., Ltd. | Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film |
| KR101266290B1 (ko) * | 2008-12-30 | 2013-05-22 | 제일모직주식회사 | 레지스트 하층막용 하드마스크 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법 |
| KR101266291B1 (ko) * | 2008-12-30 | 2013-05-22 | 제일모직주식회사 | 레지스트 하층막용 조성물 및 이를 이용한 반도체 집적회로디바이스의 제조방법 |
| JP7406300B2 (ja) * | 2018-11-12 | 2023-12-27 | 信越化学工業株式会社 | ヨウ素含有ケイ素化合物の製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA691206A (en) | 1964-07-21 | Dow Corning Corporation | Method of damping vibration | |
| GB1119666A (en) | 1965-08-06 | 1968-07-10 | Ici Ltd | Organosilicon polymers |
| GB1101589A (en) | 1965-09-09 | 1968-01-31 | Ici Ltd | Organosilicon resins |
| JPS6131461A (ja) * | 1984-07-24 | 1986-02-13 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノシロキサン組成物 |
| JPS6164753A (ja) * | 1984-09-06 | 1986-04-03 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノシロキサン組成物 |
| US5034061A (en) | 1990-03-15 | 1991-07-23 | General Electric Company | Transparent shatter-resistant silicone coating |
| JP2001506283A (ja) * | 1993-12-17 | 2001-05-15 | ハイトコ カーボン コンポジッツ インコーポレイテッド | 高温抵抗性を有するシリコーン複合体 |
| JP3277749B2 (ja) * | 1995-04-03 | 2002-04-22 | 信越化学工業株式会社 | シリコーンゲル組成物及びポッティング材 |
| US5747608A (en) | 1996-12-31 | 1998-05-05 | Dow Corning Corporation | Rubber-modified rigid silicone resins and composites produced therefrom |
| US5830950A (en) | 1996-12-31 | 1998-11-03 | Dow Corning Corporation | Method of making rubber-modified rigid silicone resins and composites produced therefrom |
| JP3518399B2 (ja) * | 1999-03-12 | 2004-04-12 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
-
2001
- 2001-04-24 AU AU2001273963A patent/AU2001273963A1/en not_active Abandoned
- 2001-04-24 US US10/258,722 patent/US6780471B2/en not_active Expired - Fee Related
- 2001-04-24 JP JP2001580225A patent/JP2003531942A/ja active Pending
- 2001-04-24 AT AT01940358T patent/ATE306518T1/de not_active IP Right Cessation
- 2001-04-24 EP EP01940358A patent/EP1276807B1/en not_active Expired - Lifetime
- 2001-04-24 DE DE60120147T patent/DE60120147T2/de not_active Expired - Fee Related
- 2001-04-24 WO PCT/EP2001/004606 patent/WO2001083608A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20030130389A1 (en) | 2003-07-10 |
| EP1276807A1 (en) | 2003-01-22 |
| DE60120147T2 (de) | 2006-09-28 |
| EP1276807B1 (en) | 2005-10-12 |
| WO2001083608A1 (en) | 2001-11-08 |
| DE60120147D1 (de) | 2006-07-06 |
| JP2003531942A (ja) | 2003-10-28 |
| ATE306518T1 (de) | 2005-10-15 |
| US6780471B2 (en) | 2004-08-24 |
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