JP2003512618A - 金属メッキ槽内の添加物濃度を判定するための方法及び装置 - Google Patents
金属メッキ槽内の添加物濃度を判定するための方法及び装置Info
- Publication number
- JP2003512618A JP2003512618A JP2001532089A JP2001532089A JP2003512618A JP 2003512618 A JP2003512618 A JP 2003512618A JP 2001532089 A JP2001532089 A JP 2001532089A JP 2001532089 A JP2001532089 A JP 2001532089A JP 2003512618 A JP2003512618 A JP 2003512618A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solution
- potential
- concentration
- additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 298
- 239000000654 additive Substances 0.000 title claims abstract description 186
- 230000000996 additive effect Effects 0.000 title claims abstract description 138
- 238000000034 method Methods 0.000 title claims abstract description 136
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 98
- 239000002184 metal Substances 0.000 title claims abstract description 98
- 239000000243 solution Substances 0.000 claims abstract description 148
- 239000003112 inhibitor Substances 0.000 claims abstract description 123
- 239000010949 copper Substances 0.000 claims abstract description 91
- 238000012360 testing method Methods 0.000 claims abstract description 87
- 230000006911 nucleation Effects 0.000 claims abstract description 76
- 238000010899 nucleation Methods 0.000 claims abstract description 76
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910052802 copper Inorganic materials 0.000 claims abstract description 71
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 45
- 238000009713 electroplating Methods 0.000 claims abstract description 43
- 230000008569 process Effects 0.000 claims abstract description 40
- 239000006259 organic additive Substances 0.000 claims abstract description 28
- 239000012482 calibration solution Substances 0.000 claims abstract description 21
- 239000011259 mixed solution Substances 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 229910052728 basic metal Inorganic materials 0.000 claims abstract description 10
- 150000003818 basic metals Chemical class 0.000 claims abstract description 10
- 239000010953 base metal Substances 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 238000005259 measurement Methods 0.000 claims description 158
- 239000000523 sample Substances 0.000 claims description 80
- 239000002585 base Substances 0.000 claims description 58
- 239000000203 mixture Substances 0.000 claims description 34
- 239000012488 sample solution Substances 0.000 claims description 34
- 238000004458 analytical method Methods 0.000 claims description 25
- 239000003637 basic solution Substances 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 13
- 238000013213 extrapolation Methods 0.000 claims description 13
- 230000000977 initiatory effect Effects 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000002441 reversible effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 230000001133 acceleration Effects 0.000 claims description 3
- 238000012512 characterization method Methods 0.000 claims description 2
- 229910021397 glassy carbon Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910000510 noble metal Inorganic materials 0.000 claims 2
- 230000001154 acute effect Effects 0.000 claims 1
- 238000001465 metallisation Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000004044 response Effects 0.000 description 31
- 229940021013 electrolyte solution Drugs 0.000 description 28
- 238000007792 addition Methods 0.000 description 27
- 230000008021 deposition Effects 0.000 description 11
- 239000003792 electrolyte Substances 0.000 description 11
- 239000012470 diluted sample Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000011088 calibration curve Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010926 purge Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011067 equilibration Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 238000000611 regression analysis Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000004832 voltammetry Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012491 analyte Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 238000013501 data transformation Methods 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- 239000013026 undiluted sample Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
- G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
- G01N27/4161—Systems measuring the voltage and using a constant current supply, e.g. chronopotentiometry
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/421,658 | 1999-10-20 | ||
| US09/421,658 US6280602B1 (en) | 1999-10-20 | 1999-10-20 | Method and apparatus for determination of additives in metal plating baths |
| PCT/US2000/041202 WO2001029548A1 (en) | 1999-10-20 | 2000-10-17 | Method and apparatus for determination of additives in metal plating baths |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003512618A true JP2003512618A (ja) | 2003-04-02 |
| JP2003512618A5 JP2003512618A5 (enExample) | 2007-12-06 |
Family
ID=23671482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001532089A Pending JP2003512618A (ja) | 1999-10-20 | 2000-10-17 | 金属メッキ槽内の添加物濃度を判定するための方法及び装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US6280602B1 (enExample) |
| EP (1) | EP1226426A4 (enExample) |
| JP (1) | JP2003512618A (enExample) |
| KR (1) | KR20020060716A (enExample) |
| AU (1) | AU1966701A (enExample) |
| WO (1) | WO2001029548A1 (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2004085715A1 (ja) * | 2003-03-25 | 2006-06-29 | 凸版印刷株式会社 | 電気銅めっき液の分析方法、その分析装置及び半導体製品の製造方法 |
| JP2008537782A (ja) * | 2005-04-08 | 2008-09-25 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | めっき浴およびエッチング浴を監視する方法 |
| JP2011105968A (ja) * | 2009-11-13 | 2011-06-02 | Renesas Electronics Corp | 半導体集積回路装置の製造方法 |
| JP2012507693A (ja) * | 2008-11-05 | 2012-03-29 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 金属被膜を検査する方法と、前記金属被膜を析出するために用いる沈着性電解質の分析管理方法 |
| KR101691949B1 (ko) * | 2016-10-28 | 2017-01-02 | 서울대학교 산학협력단 | 도금액 내 요오드화물 농도 측정방법 |
| KR101725456B1 (ko) * | 2016-10-28 | 2017-04-10 | 서울대학교 산학협력단 | 도금액 내 감속제의 평균 분자량 측정방법 |
| KR20210083020A (ko) * | 2019-12-26 | 2021-07-06 | 서울대학교산학협력단 | 도금액 내 브롬화물 농도 측정방법 |
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| US6365033B1 (en) * | 1999-05-03 | 2002-04-02 | Semitoof, Inc. | Methods for controlling and/or measuring additive concentration in an electroplating bath |
| US6899805B2 (en) * | 1998-05-01 | 2005-05-31 | Semitool, Inc. | Automated chemical management system executing improved electrolyte analysis method |
| US6814855B2 (en) * | 1998-05-01 | 2004-11-09 | Semitool, Inc. | Automated chemical management system having improved analysis unit |
| JP2000277478A (ja) * | 1999-03-25 | 2000-10-06 | Canon Inc | 陽極化成装置、陽極化成システム、基板の処理装置及び処理方法、並びに基板の製造方法 |
| US6280602B1 (en) * | 1999-10-20 | 2001-08-28 | Advanced Technology Materials, Inc. | Method and apparatus for determination of additives in metal plating baths |
| TW500923B (en) * | 1999-10-20 | 2002-09-01 | Adbanced Technology Materials | Method and apparatus for determination of additives in metal plating baths |
| KR100474418B1 (ko) * | 2000-09-19 | 2005-03-08 | 주식회사 포스코 | 염화물계 도금액 중의 유기첨가제 정량방법 |
| US6974951B1 (en) * | 2001-01-29 | 2005-12-13 | Metara, Inc. | Automated in-process ratio mass spectrometry |
| US6592747B2 (en) * | 2001-06-18 | 2003-07-15 | International Business Machines Corporation | Method of controlling additives in copper plating baths |
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| US20040040842A1 (en) * | 2002-09-03 | 2004-03-04 | King Mackenzie E. | Electrochemical analytical apparatus and method of using the same |
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| US6758955B2 (en) * | 2002-12-06 | 2004-07-06 | Advanced Technology Materials, Inc. | Methods for determination of additive concentration in metal plating baths |
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| JP2004325441A (ja) * | 2003-04-25 | 2004-11-18 | Rohm & Haas Electronic Materials Llc | 分析方法 |
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| CN116297782A (zh) * | 2023-03-20 | 2023-06-23 | 厦门大学 | 一种基于超微电极测定酸性镀铜液中添加剂浓度的方法、装置、设备及介质 |
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| US5324400A (en) * | 1992-12-04 | 1994-06-28 | Hughes Aircraft Company | Electrode preconditioning method for a plating bath monitoring process |
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- 2000-10-17 EP EP00982666A patent/EP1226426A4/en not_active Withdrawn
- 2000-10-17 WO PCT/US2000/041202 patent/WO2001029548A1/en not_active Ceased
- 2000-10-17 KR KR1020027004993A patent/KR20020060716A/ko not_active Withdrawn
- 2000-10-17 US US09/690,770 patent/US6592737B1/en not_active Expired - Lifetime
- 2000-10-17 JP JP2001532089A patent/JP2003512618A/ja active Pending
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| JPS59137853A (ja) * | 1983-01-21 | 1984-08-08 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 銅電気めつき浴中の有機添加剤の濃度を決定するための方法 |
| JPH0580028A (ja) * | 1991-03-08 | 1993-03-30 | Shipley Co Inc | 電気メツキ浴中の有機添加剤を分析するための方法 |
| US5635043A (en) * | 1994-12-19 | 1997-06-03 | Turyan; Yakov | Device comprising microcell for batch injection stripping voltammetric analysis of metal traces |
| WO1999057549A1 (en) * | 1998-05-01 | 1999-11-11 | Semitool, Inc. | Measuring additive concentration in an electroplating bath |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2004085715A1 (ja) * | 2003-03-25 | 2006-06-29 | 凸版印刷株式会社 | 電気銅めっき液の分析方法、その分析装置及び半導体製品の製造方法 |
| JP4534983B2 (ja) * | 2003-03-25 | 2010-09-01 | 凸版印刷株式会社 | 電気銅めっき液の分析方法、その分析装置 |
| JP2008537782A (ja) * | 2005-04-08 | 2008-09-25 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | めっき浴およびエッチング浴を監視する方法 |
| JP2012507693A (ja) * | 2008-11-05 | 2012-03-29 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 金属被膜を検査する方法と、前記金属被膜を析出するために用いる沈着性電解質の分析管理方法 |
| KR101513333B1 (ko) | 2008-11-05 | 2015-04-21 | 아토테크더치랜드게엠베하 | 금속 코팅 검사 방법 및 상기 금속 코팅의 증착을 실행하는 증착 전해질의 분석 제어 방법 |
| JP2011105968A (ja) * | 2009-11-13 | 2011-06-02 | Renesas Electronics Corp | 半導体集積回路装置の製造方法 |
| KR101691949B1 (ko) * | 2016-10-28 | 2017-01-02 | 서울대학교 산학협력단 | 도금액 내 요오드화물 농도 측정방법 |
| KR101725456B1 (ko) * | 2016-10-28 | 2017-04-10 | 서울대학교 산학협력단 | 도금액 내 감속제의 평균 분자량 측정방법 |
| KR20210083020A (ko) * | 2019-12-26 | 2021-07-06 | 서울대학교산학협력단 | 도금액 내 브롬화물 농도 측정방법 |
| KR102274872B1 (ko) * | 2019-12-26 | 2021-07-07 | 서울대학교산학협력단 | 도금액 내 브롬화물 농도 측정방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6592737B1 (en) | 2003-07-15 |
| KR20020060716A (ko) | 2002-07-18 |
| AU1966701A (en) | 2001-04-30 |
| WO2001029548A1 (en) | 2001-04-26 |
| EP1226426A4 (en) | 2004-04-07 |
| US20010042694A1 (en) | 2001-11-22 |
| EP1226426A1 (en) | 2002-07-31 |
| US6495011B2 (en) | 2002-12-17 |
| US6280602B1 (en) | 2001-08-28 |
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