AU1966701A - Method and apparatus for determination of additives in metal plating baths - Google Patents

Method and apparatus for determination of additives in metal plating baths

Info

Publication number
AU1966701A
AU1966701A AU19667/01A AU1966701A AU1966701A AU 1966701 A AU1966701 A AU 1966701A AU 19667/01 A AU19667/01 A AU 19667/01A AU 1966701 A AU1966701 A AU 1966701A AU 1966701 A AU1966701 A AU 1966701A
Authority
AU
Australia
Prior art keywords
additives
determination
metal plating
plating baths
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU19667/01A
Other languages
English (en)
Inventor
Peter M. Robertson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Technology Materials Inc
Original Assignee
Advanced Technology Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Technology Materials Inc filed Critical Advanced Technology Materials Inc
Publication of AU1966701A publication Critical patent/AU1966701A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/4161—Systems measuring the voltage and using a constant current supply, e.g. chronopotentiometry

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Molecular Biology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Sampling And Sample Adjustment (AREA)
AU19667/01A 1999-10-20 2000-10-17 Method and apparatus for determination of additives in metal plating baths Abandoned AU1966701A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/421,658 US6280602B1 (en) 1999-10-20 1999-10-20 Method and apparatus for determination of additives in metal plating baths
US09421658 1999-10-20
PCT/US2000/041202 WO2001029548A1 (en) 1999-10-20 2000-10-17 Method and apparatus for determination of additives in metal plating baths

Publications (1)

Publication Number Publication Date
AU1966701A true AU1966701A (en) 2001-04-30

Family

ID=23671482

Family Applications (1)

Application Number Title Priority Date Filing Date
AU19667/01A Abandoned AU1966701A (en) 1999-10-20 2000-10-17 Method and apparatus for determination of additives in metal plating baths

Country Status (6)

Country Link
US (3) US6280602B1 (enExample)
EP (1) EP1226426A4 (enExample)
JP (1) JP2003512618A (enExample)
KR (1) KR20020060716A (enExample)
AU (1) AU1966701A (enExample)
WO (1) WO2001029548A1 (enExample)

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US6986835B2 (en) * 2002-11-04 2006-01-17 Applied Materials Inc. Apparatus for plating solution analysis
US6758955B2 (en) * 2002-12-06 2004-07-06 Advanced Technology Materials, Inc. Methods for determination of additive concentration in metal plating baths
US20060266648A1 (en) * 2002-12-17 2006-11-30 King Mackenzie E Process analyzer for monitoring electrochemical deposition solutions
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US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US20050236280A1 (en) * 2004-04-27 2005-10-27 Jianwen Han Methods for analyzing inorganic components of an electrolytic solution, and /or cleaning an electrochemical analytical cell
US7141156B2 (en) * 2004-04-27 2006-11-28 Advanced Technology Materials, Inc. One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
US7435320B2 (en) * 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US7186326B2 (en) * 2004-05-27 2007-03-06 Eci Technology, Inc. Efficient analysis of organic additives in an acid copper plating bath
US8496799B2 (en) * 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
US8529738B2 (en) * 2005-02-08 2013-09-10 The Trustees Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
WO2006110437A1 (en) * 2005-04-08 2006-10-19 The Trustees Of Columbia University In The City Of New York Systems and methods for monitoring plating and etching baths
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
WO2007027907A2 (en) * 2005-09-02 2007-03-08 The Trustees Of Columbia University In The City Of New York A system and method for obtaining anisotropic etching of patterned substrates
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US8398582B2 (en) * 2005-10-27 2013-03-19 Novartis Ag Fluid pressure sensing chamber
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US20070261963A1 (en) * 2006-02-02 2007-11-15 Advanced Technology Materials, Inc. Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions
WO2007103946A2 (en) * 2006-03-07 2007-09-13 Metara, Inc. Module for automated matrix removal in acidic plating solutions
KR100788279B1 (ko) 2006-09-20 2008-01-02 재단법인서울대학교산학협력재단 구리 무전해 도금에서의 단차평탄화 방법
WO2008070786A1 (en) * 2006-12-06 2008-06-12 The Trustees Of Columbia University In The City Of New York Microfluidic systems and methods for screening plating and etching bath compositions
US7879222B2 (en) * 2007-08-27 2011-02-01 Eci Technology, Inc. Detection of additive breakdown products in acid copper plating baths
DE102008056470B3 (de) * 2008-11-05 2010-04-22 Atotech Deutschland Gmbh Verfahren zum Untersuchen einer Metallschicht und Verfahren zur analytischen Kontrolle eines zum Abscheiden der Metallschicht dienenden Abscheideelektrolyten
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
KR101274363B1 (ko) * 2009-05-27 2013-06-13 노벨러스 시스템즈, 인코포레이티드 얇은 시드층 상의 도금을 위한 펄스 시퀀스
US8372258B2 (en) * 2009-08-03 2013-02-12 Novellus Systems, Inc. Monitoring of electroplating additives
US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating
JP5442400B2 (ja) * 2009-11-13 2014-03-12 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
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TWI649459B (zh) * 2013-01-07 2019-02-01 美商諾發系統有限公司 用於電鍍之基板的電流斜坡修整及電流脈動進入
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US10508357B2 (en) * 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
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KR101725456B1 (ko) * 2016-10-28 2017-04-10 서울대학교 산학협력단 도금액 내 감속제의 평균 분자량 측정방법
KR101691949B1 (ko) * 2016-10-28 2017-01-02 서울대학교 산학협력단 도금액 내 요오드화물 농도 측정방법
KR102274872B1 (ko) * 2019-12-26 2021-07-07 서울대학교산학협력단 도금액 내 브롬화물 농도 측정방법
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CN112164805B (zh) * 2020-09-25 2024-07-16 西南交通大学 一种液流电池用催化剂原位制备装置及催化剂制备方法
CN116297782A (zh) * 2023-03-20 2023-06-23 厦门大学 一种基于超微电极测定酸性镀铜液中添加剂浓度的方法、装置、设备及介质

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Also Published As

Publication number Publication date
US6280602B1 (en) 2001-08-28
US20010042694A1 (en) 2001-11-22
WO2001029548A1 (en) 2001-04-26
EP1226426A1 (en) 2002-07-31
US6592737B1 (en) 2003-07-15
KR20020060716A (ko) 2002-07-18
JP2003512618A (ja) 2003-04-02
EP1226426A4 (en) 2004-04-07
US6495011B2 (en) 2002-12-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase