AU2002230558A1 - Method and apparatus for electrolytic deposition of copper - Google Patents

Method and apparatus for electrolytic deposition of copper

Info

Publication number
AU2002230558A1
AU2002230558A1 AU2002230558A AU3055802A AU2002230558A1 AU 2002230558 A1 AU2002230558 A1 AU 2002230558A1 AU 2002230558 A AU2002230558 A AU 2002230558A AU 3055802 A AU3055802 A AU 3055802A AU 2002230558 A1 AU2002230558 A1 AU 2002230558A1
Authority
AU
Australia
Prior art keywords
copper
electrolytic deposition
electrolytic
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002230558A
Inventor
Michael A. Steward
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Galvan Industries Inc
Original Assignee
Galvan Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Galvan Industries Inc filed Critical Galvan Industries Inc
Publication of AU2002230558A1 publication Critical patent/AU2002230558A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
AU2002230558A 2000-10-31 2001-10-31 Method and apparatus for electrolytic deposition of copper Abandoned AU2002230558A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09703113 2000-10-31
US09/703,113 US6527934B1 (en) 2000-10-31 2000-10-31 Method for electrolytic deposition of copper
PCT/US2001/045713 WO2002036860A1 (en) 2000-10-31 2001-10-31 Method and apparatus for electrolytic deposition of copper

Publications (1)

Publication Number Publication Date
AU2002230558A1 true AU2002230558A1 (en) 2002-05-15

Family

ID=24824065

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002230558A Abandoned AU2002230558A1 (en) 2000-10-31 2001-10-31 Method and apparatus for electrolytic deposition of copper

Country Status (3)

Country Link
US (1) US6527934B1 (en)
AU (1) AU2002230558A1 (en)
WO (1) WO2002036860A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3819840B2 (en) * 2002-07-17 2006-09-13 大日本スクリーン製造株式会社 Plating apparatus and plating method
US20040026255A1 (en) * 2002-08-06 2004-02-12 Applied Materials, Inc Insoluble anode loop in copper electrodeposition cell for interconnect formation
US7273537B2 (en) * 2002-09-12 2007-09-25 Teck Cominco Metals, Ltd. Method of production of metal particles through electrolysis
US20050274620A1 (en) * 2004-06-15 2005-12-15 Kovarsky Nicolay Y Copper replenishment system for interconnect applications
TWI259538B (en) * 2004-11-22 2006-08-01 Au Optronics Corp Thin film transistor and fabrication method thereof
JP5795965B2 (en) * 2011-05-30 2015-10-14 株式会社荏原製作所 Plating equipment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3884782A (en) * 1974-04-08 1975-05-20 Tobe A Pittman Electrolytic copper recovery method and electrolyte
US4189356A (en) 1976-12-17 1980-02-19 Whittaker Corporation Method for plating copper on steel rods
JPS6021240B2 (en) 1980-01-12 1985-05-25 株式会社小糸製作所 Method and apparatus for replenishing plating solution with deposited copper
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
JPH08501827A (en) 1992-09-15 1996-02-27 エイティアール ワイアー アンド ケーブル カンパニー，インコーポレイテッド Copper electroplating method and apparatus
US5242571A (en) 1992-10-26 1993-09-07 Asarco Incorporated Method and apparatus for the electrolytic production of copper wire
CN1084803C (en) 1993-04-19 2002-05-15 Ga-Tek公司 Process for making copper metal powder, copper oxides and copper foil
US5516408A (en) 1993-04-19 1996-05-14 Magma Copper Company Process for making copper wire
US5366612A (en) 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
US5670033A (en) 1993-04-19 1997-09-23 Electrocopper Products Limited Process for making copper metal powder, copper oxides and copper foil
DE4344387C2 (en) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper and arrangement for carrying out the process
US5582737A (en) 1995-11-07 1996-12-10 Eichrom Industries, Inc. Ion exchange and regeneration process for separation and removal of iron (III) ions from aqueous sulfuric acid metal ion-containing solutions
CN1074465C (en) 1997-03-27 2001-11-07 比利顿股份有限公司 Copper recovery
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
US5997712A (en) 1998-03-30 1999-12-07 Cutek Research, Inc. Copper replenishment technique for precision copper plating system

Also Published As

Publication number Publication date
US6527934B1 (en) 2003-03-04
WO2002036860A1 (en) 2002-05-10

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