JP2003508891A - 有機電子デバイスの封入 - Google Patents
有機電子デバイスの封入Info
- Publication number
- JP2003508891A JP2003508891A JP2001522203A JP2001522203A JP2003508891A JP 2003508891 A JP2003508891 A JP 2003508891A JP 2001522203 A JP2001522203 A JP 2001522203A JP 2001522203 A JP2001522203 A JP 2001522203A JP 2003508891 A JP2003508891 A JP 2003508891A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- manufacturing
- desiccant
- polymer
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005538 encapsulation Methods 0.000 title description 12
- 239000002274 desiccant Substances 0.000 claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 29
- 229920000642 polymer Polymers 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 30
- 239000007787 solid Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 11
- 239000007767 bonding agent Substances 0.000 claims description 11
- 239000010457 zeolite Substances 0.000 claims description 9
- 229920000620 organic polymer Polymers 0.000 claims description 8
- 229910021536 Zeolite Inorganic materials 0.000 claims description 7
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 7
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 6
- 229910052788 barium Inorganic materials 0.000 claims description 6
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052791 calcium Inorganic materials 0.000 claims description 6
- 239000011575 calcium Substances 0.000 claims description 6
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 5
- 229910052712 strontium Inorganic materials 0.000 claims description 5
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000002808 molecular sieve Substances 0.000 claims description 2
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical group [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- 239000011343 solid material Substances 0.000 claims 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 claims 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims 1
- 239000000292 calcium oxide Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 31
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 abstract description 10
- 239000001301 oxygen Substances 0.000 abstract description 10
- 230000009931 harmful effect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 description 11
- 229920000547 conjugated polymer Polymers 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000010406 cathode material Substances 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000005424 photoluminescence Methods 0.000 description 3
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 229920003319 Araldite® Polymers 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- 229910001948 sodium oxide Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- JCYZMTMYPZHVBF-UHFFFAOYSA-N Melarsoprol Chemical compound NC1=NC(N)=NC(NC=2C=CC(=CC=2)[As]2SC(CO)CS2)=N1 JCYZMTMYPZHVBF-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229920000292 Polyquinoline Polymers 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920000109 alkoxy-substituted poly(p-phenylene vinylene) Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 229920000775 emeraldine polymer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000397 poly[2,5-bis(cholestanoxy)-1,4-phenylenevinylene] polymer Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15253699P | 1999-09-03 | 1999-09-03 | |
| US60/152,536 | 1999-09-03 | ||
| PCT/US2000/024126 WO2001019142A1 (en) | 1999-09-03 | 2000-09-01 | Encapsulation of organic electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003508891A true JP2003508891A (ja) | 2003-03-04 |
| JP2003508891A5 JP2003508891A5 (enExample) | 2007-11-01 |
Family
ID=22543345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001522203A Pending JP2003508891A (ja) | 1999-09-03 | 2000-09-01 | 有機電子デバイスの封入 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1208726A1 (enExample) |
| JP (1) | JP2003508891A (enExample) |
| KR (1) | KR20020066321A (enExample) |
| CN (1) | CN1385053A (enExample) |
| CA (1) | CA2381230A1 (enExample) |
| TW (1) | TW508970B (enExample) |
| WO (1) | WO2001019142A1 (enExample) |
Families Citing this family (96)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4526682B2 (ja) * | 2000-03-28 | 2010-08-18 | 日東電工株式会社 | エレクトロルミネッセンス素子 |
| US7026758B2 (en) | 2001-09-28 | 2006-04-11 | Osram Opto Semiconductors Gmbh | Reinforcement of glass substrates in flexible devices |
| DE10236855B4 (de) * | 2002-08-07 | 2006-03-16 | Samsung SDI Co., Ltd., Suwon | Gehäuseeinheit zur Verkapselung von Bauelementen und Verfahren zu deren Herstellung |
| GB0219223D0 (en) * | 2002-08-17 | 2002-09-25 | Cambridge Display Tech Ltd | Organic optoelectronic device encapsulation package |
| US7531377B2 (en) | 2002-09-03 | 2009-05-12 | Cambridge Display Technology Limited | Optical device |
| US6887733B2 (en) | 2002-09-11 | 2005-05-03 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Method of fabricating electronic devices |
| US7224116B2 (en) | 2002-09-11 | 2007-05-29 | Osram Opto Semiconductors Gmbh | Encapsulation of active electronic devices |
| US7193364B2 (en) | 2002-09-12 | 2007-03-20 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Encapsulation for organic devices |
| EP1416028A1 (en) | 2002-10-30 | 2004-05-06 | Covion Organic Semiconductors GmbH | New method for the production of monomers useful in the manufacture of semiconductive polymers |
| CN100334718C (zh) * | 2002-12-03 | 2007-08-29 | 铼宝科技股份有限公司 | 有机电激发光元件的封装结构及其制作工艺 |
| GB0306409D0 (en) | 2003-03-20 | 2003-04-23 | Cambridge Display Tech Ltd | Electroluminescent device |
| JP2004311246A (ja) * | 2003-04-08 | 2004-11-04 | Tohoku Pioneer Corp | 有機ｅｌパネル及びその製造方法 |
| JP2007504342A (ja) | 2003-05-30 | 2007-03-01 | メルク パテント ゲーエムベーハー | ポリマー |
| EP1491568A1 (en) | 2003-06-23 | 2004-12-29 | Covion Organic Semiconductors GmbH | Semiconductive Polymers |
| US7135357B2 (en) | 2003-10-06 | 2006-11-14 | E. I. Du Pont De Nemours And Company | Process for making an organic electronic device having a roughened surface heat sink |
| US7438829B2 (en) | 2003-11-13 | 2008-10-21 | E.I. Du Pont De Nemours And Company | Thick film getter paste compositions for use in moisture control |
| GB0329364D0 (en) | 2003-12-19 | 2004-01-21 | Cambridge Display Tech Ltd | Optical device |
| WO2005078458A1 (en) | 2004-02-05 | 2005-08-25 | Analog Devices, Inc. | Capped sensor |
| GB0411572D0 (en) | 2004-05-24 | 2004-06-23 | Cambridge Display Tech Ltd | Light-emitting device |
| GB0411582D0 (en) | 2004-05-24 | 2004-06-23 | Cambridge Display Tech Ltd | Metal complex |
| WO2006016153A1 (en) | 2004-08-10 | 2006-02-16 | Cambridge Display Technology Limited | Light emissive device |
| GB0427266D0 (en) | 2004-12-13 | 2005-01-12 | Cambridge Display Tech Ltd | Phosphorescent OLED |
| US9179518B2 (en) | 2004-12-24 | 2015-11-03 | Cambridge Display Technology Limited | Light emissive device |
| GB2436996B8 (en) | 2004-12-29 | 2013-12-11 | Cambridge Display Tech Ltd | Rigid amines |
| GB0428445D0 (en) | 2004-12-29 | 2005-02-02 | Cambridge Display Tech Ltd | Blue-shifted triarylamine polymer |
| GB0428444D0 (en) | 2004-12-29 | 2005-02-02 | Cambridge Display Tech Ltd | Conductive polymer compositions in opto-electrical devices |
| US7576426B2 (en) | 2005-04-01 | 2009-08-18 | Skyworks Solutions, Inc. | Wafer level package including a device wafer integrated with a passive component |
| GB0507684D0 (en) | 2005-04-15 | 2005-05-25 | Cambridge Display Tech Ltd | Pulsed driven displays |
| GB0514476D0 (en) | 2005-07-14 | 2005-08-17 | Cambridge Display Tech Ltd | Conductive polymer compositions in opto-electrical devices |
| US20070013305A1 (en) | 2005-07-18 | 2007-01-18 | Wang Carl B | Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control |
| GB0518968D0 (en) | 2005-09-16 | 2005-10-26 | Cdt Oxford Ltd | Organic light-emitting device |
| CN100508241C (zh) * | 2005-11-10 | 2009-07-01 | 铼宝科技股份有限公司 | 顶部发光型有机发光二极管显示装置 |
| GB2432256B (en) | 2005-11-14 | 2009-12-23 | Cambridge Display Tech Ltd | Organic optoelectrical device |
| GB2433509A (en) | 2005-12-22 | 2007-06-27 | Cambridge Display Tech Ltd | Arylamine polymer |
| GB0526185D0 (en) | 2005-12-22 | 2006-02-01 | Cambridge Display Tech Ltd | Electronic device |
| GB0526393D0 (en) | 2005-12-23 | 2006-02-08 | Cdt Oxford Ltd | Light emissive device |
| GB2433833A (en) | 2005-12-28 | 2007-07-04 | Cdt Oxford Ltd | Micro-cavity OLED layer structure with transparent electrode |
| GB2434915A (en) | 2006-02-03 | 2007-08-08 | Cdt Oxford Ltd | Phosphoescent OLED for full colour display |
| GB2440934B (en) | 2006-04-28 | 2009-12-16 | Cdt Oxford Ltd | Opto-electrical polymers and devices |
| WO2008015422A2 (en) | 2006-08-01 | 2008-02-07 | Cambridge Display Technology Limited | Methods of manufacturing opto-electrical devices |
| US7635606B2 (en) | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
| GB0617167D0 (en) | 2006-08-31 | 2006-10-11 | Cdt Oxford Ltd | Compounds for use in opto-electrical devices |
| GB0620045D0 (en) | 2006-10-10 | 2006-11-22 | Cdt Oxford Ltd | Otpo-electrical devices and methods of making the same |
| GB2448175B (en) | 2007-04-04 | 2009-07-22 | Cambridge Display Tech Ltd | Thin film transistor |
| GB2454890B (en) | 2007-11-21 | 2010-08-25 | Limited Cambridge Display Technology | Light-emitting device and materials therefor |
| CN101878527B (zh) | 2007-11-30 | 2012-09-26 | 斯盖沃克斯瑟路申斯公司 | 使用倒装芯片安装的晶片级封装 |
| GB2455747B (en) | 2007-12-19 | 2011-02-09 | Cambridge Display Tech Ltd | Electronic devices and methods of making the same using solution processing techniques |
| US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
| GB2456788B (en) | 2008-01-23 | 2011-03-09 | Cambridge Display Tech Ltd | White light emitting material |
| GB0803950D0 (en) | 2008-03-03 | 2008-04-09 | Cambridge Display Technology O | Solvent for printing composition |
| GB2458454B (en) | 2008-03-14 | 2011-03-16 | Cambridge Display Tech Ltd | Electronic devices and methods of making the same using solution processing techniques |
| GB2459895B (en) | 2008-05-09 | 2011-04-27 | Cambridge Display Technology Limited | Organic light emissive device |
| GB2462410B (en) | 2008-07-21 | 2011-04-27 | Cambridge Display Tech Ltd | Compositions and methods for manufacturing light-emissive devices |
| GB2462122B (en) | 2008-07-25 | 2013-04-03 | Cambridge Display Tech Ltd | Electroluminescent materials |
| GB2462314B (en) | 2008-08-01 | 2011-03-16 | Cambridge Display Tech Ltd | Organic light-emiting materials and devices |
| GB0814161D0 (en) | 2008-08-01 | 2008-09-10 | Cambridge Display Tech Ltd | Blue-light emitting material |
| GB0814971D0 (en) | 2008-08-15 | 2008-09-24 | Cambridge Display Tech Ltd | Opto-electrical devices and methods of manufacturing the same |
| GB2462688B (en) | 2008-08-22 | 2012-03-07 | Cambridge Display Tech Ltd | Opto-electrical devices and methods of manufacturing the same |
| GB2463040B (en) | 2008-08-28 | 2012-10-31 | Cambridge Display Tech Ltd | Light-emitting material |
| GB2463077B (en) | 2008-09-02 | 2012-11-07 | Sumitomo Chemical Co | Electroluminescent material and device |
| GB0819449D0 (en) | 2008-10-23 | 2008-12-03 | Cambridge Display Tech Ltd | Display drivers |
| EP2192636A1 (en) | 2008-11-26 | 2010-06-02 | Rijksuniversiteit Groningen | Modulatable light-emitting diode |
| GB2466842B (en) | 2009-01-12 | 2011-10-26 | Cambridge Display Tech Ltd | Interlayer formulation for flat films |
| GB2466843A (en) | 2009-01-12 | 2010-07-14 | Cambridge Display Tech Ltd | Interlayer formulation for flat films |
| GB0906554D0 (en) | 2009-04-16 | 2009-05-20 | Cambridge Display Tech Ltd | Organic electroluminescent device |
| GB2469500B (en) | 2009-04-16 | 2012-06-06 | Cambridge Display Tech Ltd | Method of forming a polymer |
| GB2469497B (en) | 2009-04-16 | 2012-04-11 | Cambridge Display Tech Ltd | Polymers comprising fluorene derivative repeat units and their preparation |
| GB2469498B (en) | 2009-04-16 | 2012-03-07 | Cambridge Display Tech Ltd | Polymer and polymerisation method |
| US20110025196A1 (en) * | 2009-07-31 | 2011-02-03 | General Electric Company | Hermetic package with getter materials |
| GB2475247B (en) | 2009-11-10 | 2012-06-13 | Cambridge Display Tech Ltd | Organic optoelectronic device and method |
| GB2475246B (en) | 2009-11-10 | 2012-02-29 | Cambridge Display Tech Ltd | Organic opto-electronic device and method |
| GB2480323A (en) | 2010-05-14 | 2011-11-16 | Cambridge Display Tech Ltd | OLED hole transport layer |
| GB2484253B (en) | 2010-05-14 | 2013-09-11 | Cambridge Display Tech Ltd | Organic light-emitting composition and device |
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| KR100500078B1 (ko) * | 1996-02-26 | 2005-07-18 | 이데미쓰 고산 가부시키가이샤 | 유기 전자 발광 소자 및 그의 제조방법 |
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- 2000-09-01 WO PCT/US2000/024126 patent/WO2001019142A1/en not_active Ceased
- 2000-09-01 EP EP00957945A patent/EP1208726A1/en not_active Withdrawn
- 2000-09-01 KR KR1020027002839A patent/KR20020066321A/ko not_active Ceased
- 2000-09-01 JP JP2001522203A patent/JP2003508891A/ja active Pending
- 2000-09-01 CA CA002381230A patent/CA2381230A1/en not_active Abandoned
- 2000-09-01 CN CN00815087A patent/CN1385053A/zh active Pending
- 2000-09-15 TW TW089117977A patent/TW508970B/zh not_active IP Right Cessation
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| JPH06176867A (ja) * | 1992-12-10 | 1994-06-24 | Denki Kagaku Kogyo Kk | 電界発光素子 |
| JPH10153967A (ja) * | 1996-11-25 | 1998-06-09 | Seiko Epson Corp | フルカラー有機ｅｌ表示装置およびその製造方法 |
| JPH10275679A (ja) * | 1997-03-31 | 1998-10-13 | Toyota Central Res & Dev Lab Inc | 有機ｅｌ素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1385053A (zh) | 2002-12-11 |
| TW508970B (en) | 2002-11-01 |
| CA2381230A1 (en) | 2001-03-15 |
| EP1208726A1 (en) | 2002-05-29 |
| KR20020066321A (ko) | 2002-08-14 |
| WO2001019142A1 (en) | 2001-03-15 |
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