JP2003505329A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003505329A5 JP2003505329A5 JP2001512469A JP2001512469A JP2003505329A5 JP 2003505329 A5 JP2003505329 A5 JP 2003505329A5 JP 2001512469 A JP2001512469 A JP 2001512469A JP 2001512469 A JP2001512469 A JP 2001512469A JP 2003505329 A5 JP2003505329 A5 JP 2003505329A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- filler
- group
- permeable mass
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 239000000945 filler Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 13
- 229910010271 silicon carbide Inorganic materials 0.000 description 13
- 239000002131 composite material Substances 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 230000008595 infiltration Effects 0.000 description 6
- 238000001764 infiltration Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- -1 mirror stage Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US1999/016449 WO2001007377A1 (en) | 1999-07-23 | 1999-07-23 | Silicon carbide composites and methods for making same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003505329A JP2003505329A (ja) | 2003-02-12 |
| JP2003505329A5 true JP2003505329A5 (enExample) | 2006-09-14 |
| JP4691293B2 JP4691293B2 (ja) | 2011-06-01 |
Family
ID=22273244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001512469A Expired - Lifetime JP4691293B2 (ja) | 1999-07-23 | 1999-07-23 | 改善された炭化ケイ素複合体及びその製造方法 |
Country Status (10)
| Country | Link |
|---|---|
| EP (1) | EP1200370B1 (enExample) |
| JP (1) | JP4691293B2 (enExample) |
| KR (1) | KR20020073328A (enExample) |
| CN (1) | CN1216830C (enExample) |
| AT (1) | ATE307100T1 (enExample) |
| AU (1) | AU777124B2 (enExample) |
| CA (1) | CA2380288A1 (enExample) |
| DE (1) | DE69927854T2 (enExample) |
| IL (1) | IL147600A (enExample) |
| WO (1) | WO2001007377A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4136380B2 (ja) | 2001-12-21 | 2008-08-20 | 日本碍子株式会社 | 高熱伝導性含Ｓｉ材料及びその製造方法 |
| US20030198749A1 (en) * | 2002-04-17 | 2003-10-23 | Applied Materials, Inc. | Coated silicon carbide cermet used in a plasma reactor |
| JP4261130B2 (ja) | 2002-06-18 | 2009-04-30 | 株式会社東芝 | シリコン／炭化ケイ素複合材料 |
| US20030233977A1 (en) * | 2002-06-20 | 2003-12-25 | Yeshwanth Narendar | Method for forming semiconductor processing components |
| JP3960933B2 (ja) * | 2003-03-18 | 2007-08-15 | 日本碍子株式会社 | 高熱伝導性放熱材及びその製造方法 |
| JP4552103B2 (ja) * | 2003-04-21 | 2010-09-29 | Ｔｏｔｏ株式会社 | 窒化珪素コンポジット、及び窒化珪素コンポジットの製造方法 |
| JP4577639B2 (ja) * | 2003-09-29 | 2010-11-10 | Ｔｏｔｏ株式会社 | シリコンセラミックスコンポジットおよびシリコンセラミックスコンポジットの製造方法 |
| US7335331B1 (en) | 2005-03-01 | 2008-02-26 | Husnay Dana M | Method for making ceramic plates |
| EP1996530B1 (en) | 2006-02-24 | 2012-12-19 | M Cubed Technologies Inc. | Method for making intermetallic-containing composite bodies |
| JP5300493B2 (ja) * | 2006-02-24 | 2013-09-25 | エム キューブド テクノロジーズ， インコーポレイテッド | 金属間化合物含有複合体、及びそれを製造するための方法 |
| JP2009113477A (ja) | 2007-10-15 | 2009-05-28 | Taiheiyo Randamu Kk | セラミックス成形体とその製造方法 |
| JP5177793B2 (ja) * | 2007-12-27 | 2013-04-10 | 独立行政法人物質・材料研究機構 | 炭化ケイ素の製造方法 |
| JP6132586B2 (ja) * | 2013-02-22 | 2017-05-24 | 株式会社フジコー | ＳｉＣ成形体の製造方法 |
| EP2963002A4 (en) * | 2013-02-27 | 2016-10-26 | Kyocera Corp | CERAMICLY CONNECTED BODY AND CHANNEL BODY |
| FR3008968B1 (fr) | 2013-07-23 | 2016-12-09 | Herakles | Procede de fabrication de pieces en materiau composite par impregnation a basse temperature de fusion |
| US9123661B2 (en) | 2013-08-07 | 2015-09-01 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
| DE102014216433A1 (de) | 2014-08-19 | 2016-02-25 | Schunk Kohlenstofftechnik Gmbh | Verfahren zur Herstellung eines Formkörpers sowie Formkörper |
| JP6489775B2 (ja) * | 2014-08-21 | 2019-03-27 | 株式会社フジコー | ＳｉＣ成形体の製造方法及びＳｉＣ成形体の加工方法 |
| CN105349827A (zh) * | 2015-10-30 | 2016-02-24 | 苏州列治埃盟新材料技术转移有限公司 | 一种碳化硅增强无铅锡铜合金棒及其制备方法 |
| CN109153106B (zh) * | 2016-04-06 | 2022-05-13 | M丘比德技术公司 | 金刚石复合物cmp垫调节器 |
| DE102017217292A1 (de) * | 2017-09-28 | 2019-03-28 | Sgl Carbon Se | Keramisches Bauteil |
| CN109748595B (zh) * | 2017-11-01 | 2021-10-22 | 航天特种材料及工艺技术研究所 | 一种混合渗剂、用途及反应熔渗制备方法 |
| CN113185297B (zh) * | 2021-04-27 | 2023-06-27 | 湖北中烟工业有限责任公司 | 电加热用陶瓷材料及其应用 |
| CN114031415B (zh) * | 2021-10-29 | 2022-08-02 | 中广核研究院有限公司 | 碳化硅接头及其金属渗透连接方法 |
| CN114180967B (zh) * | 2021-12-30 | 2023-01-31 | 浙江立泰复合材料股份有限公司 | 一种中空陶瓷材料及其制备方法 |
| CN117945771A (zh) * | 2023-12-28 | 2024-04-30 | 西安鑫垚陶瓷复合材料股份有限公司 | 一种rmi缓冲层和陶瓷基复合材料反应熔渗方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5079195A (en) * | 1988-01-15 | 1992-01-07 | Massachusetts Institute Of Technology | Method of preparing refractory silicon carbide composites and coatings |
| JP2973762B2 (ja) * | 1993-01-18 | 1999-11-08 | 住友金属工業株式会社 | 半導体製造用炭化珪素焼結体の製造方法 |
| US5509555A (en) * | 1994-06-03 | 1996-04-23 | Massachusetts Institute Of Technology | Method for producing an article by pressureless reactive infiltration |
| DE69706587T2 (de) * | 1996-03-29 | 2002-07-11 | Kabushiki Kaisha Toshiba, Kawasaki | Keramikmatrix-Verbundwerkstoff und Verfahren zur Herstellung desselben |
| DE19711831C2 (de) * | 1997-03-21 | 2000-07-13 | Daimler Chrysler Ag | Schmelzinfiltrierte faserverstärkte Verbundkeramik und Verfahren zur Herstellung einer solchen |
-
1999
- 1999-07-23 CN CN998168130A patent/CN1216830C/zh not_active Expired - Fee Related
- 1999-07-23 EP EP99938772A patent/EP1200370B1/en not_active Expired - Lifetime
- 1999-07-23 AU AU53185/99A patent/AU777124B2/en not_active Ceased
- 1999-07-23 CA CA002380288A patent/CA2380288A1/en not_active Abandoned
- 1999-07-23 IL IL14760099A patent/IL147600A/xx not_active IP Right Cessation
- 1999-07-23 WO PCT/US1999/016449 patent/WO2001007377A1/en not_active Ceased
- 1999-07-23 AT AT99938772T patent/ATE307100T1/de not_active IP Right Cessation
- 1999-07-23 DE DE69927854T patent/DE69927854T2/de not_active Expired - Lifetime
- 1999-07-23 JP JP2001512469A patent/JP4691293B2/ja not_active Expired - Lifetime
- 1999-07-23 KR KR1020027000927A patent/KR20020073328A/ko not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003505329A5 (enExample) | ||
| JP4862169B2 (ja) | 熱伝導性材料 | |
| CN1026337C (zh) | 一种整体式粘结基体及其制造方法 | |
| AU777124B2 (en) | Silicon carbide composites and methods for making same | |
| JPH0395288A (ja) | 耐火金属酸化物被覆研摩材、および該研摩材より製作した砥石車 | |
| JP2001520973A (ja) | 複合材料及びその製造方法 | |
| JP2000256706A (ja) | 多孔質体溶浸方法 | |
| IE871456L (en) | Ceramic abrasive material. | |
| EP0012966B1 (en) | Integral composite of polycristalline diamond and/or cubic boron nitride body phase and substrate phase and process for making it | |
| US7959887B2 (en) | Method for manufacturing a diamond composite | |
| US5667742A (en) | Methods for making preforms for composite formation processes | |
| CN1042498A (zh) | 使用合金阴模制备金属复合体的方法及由该方法生产的产品 | |
| JPH06503523A (ja) | 成形のための成形用具の材料 | |
| US4793859A (en) | Infiltration of mo-containing material with silicon | |
| US6355340B1 (en) | Low expansion metal matrix composites | |
| NZ227919A (en) | Production of a self-supporting ceramic body which is subsequently coated with a protective layer | |
| KR950008595B1 (ko) | 자립성 다결정 재료로 된 세라믹과 금속의 복합재료 제조방법 | |
| JPH03138329A (ja) | マクロ複合体の製造方法 | |
| JP4653922B2 (ja) | ダイアモンドまたはダイアモンド含有材料で構成されている基質に被膜を付着させる方法 | |
| JPS6042819A (ja) | フオ−ム半導体ド−ピング剤担体 | |
| JPS6379768A (ja) | セラミック複合物物体の製造方法 | |
| JP2009527456A5 (enExample) | ||
| US5436208A (en) | Silicon carbide bodies and methods of making the same | |
| RU2002104704A (ru) | Композиционные материалы, содержащие карбид кремния, и способы их получения | |
| JPH05163065A (ja) | ケイ素を含有しない炭化ケイ素およびケイ化モリブデンの溶浸形成性複合材 |