DE69927854T2 - Verfahren zur herstellung eines siliziumkarbid-komposits - Google Patents
Verfahren zur herstellung eines siliziumkarbid-komposits Download PDFInfo
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- DE69927854T2 DE69927854T2 DE69927854T DE69927854T DE69927854T2 DE 69927854 T2 DE69927854 T2 DE 69927854T2 DE 69927854 T DE69927854 T DE 69927854T DE 69927854 T DE69927854 T DE 69927854T DE 69927854 T2 DE69927854 T2 DE 69927854T2
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- silicon
- infiltrant
- infiltration
- silicon carbide
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- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/82—Two substrates not completely covering each other, e.g. two plates in a staggered position
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- Chemical Kinetics & Catalysis (AREA)
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US1999/016449 WO2001007377A1 (en) | 1999-07-23 | 1999-07-23 | Silicon carbide composites and methods for making same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69927854D1 DE69927854D1 (de) | 2005-11-24 |
| DE69927854T2 true DE69927854T2 (de) | 2006-07-06 |
Family
ID=22273244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69927854T Expired - Lifetime DE69927854T2 (de) | 1999-07-23 | 1999-07-23 | Verfahren zur herstellung eines siliziumkarbid-komposits |
Country Status (10)
| Country | Link |
|---|---|
| EP (1) | EP1200370B1 (enExample) |
| JP (1) | JP4691293B2 (enExample) |
| KR (1) | KR20020073328A (enExample) |
| CN (1) | CN1216830C (enExample) |
| AT (1) | ATE307100T1 (enExample) |
| AU (1) | AU777124B2 (enExample) |
| CA (1) | CA2380288A1 (enExample) |
| DE (1) | DE69927854T2 (enExample) |
| IL (1) | IL147600A (enExample) |
| WO (1) | WO2001007377A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11505500B2 (en) * | 2017-09-28 | 2022-11-22 | Sgl Carbon Se | Ceramic component |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4136380B2 (ja) | 2001-12-21 | 2008-08-20 | 日本碍子株式会社 | 高熱伝導性含Si材料及びその製造方法 |
| US20030198749A1 (en) * | 2002-04-17 | 2003-10-23 | Applied Materials, Inc. | Coated silicon carbide cermet used in a plasma reactor |
| JP4261130B2 (ja) | 2002-06-18 | 2009-04-30 | 株式会社東芝 | シリコン/炭化ケイ素複合材料 |
| US20030233977A1 (en) * | 2002-06-20 | 2003-12-25 | Yeshwanth Narendar | Method for forming semiconductor processing components |
| JP3960933B2 (ja) * | 2003-03-18 | 2007-08-15 | 日本碍子株式会社 | 高熱伝導性放熱材及びその製造方法 |
| JP4552103B2 (ja) * | 2003-04-21 | 2010-09-29 | Toto株式会社 | 窒化珪素コンポジット、及び窒化珪素コンポジットの製造方法 |
| JP4577639B2 (ja) * | 2003-09-29 | 2010-11-10 | Toto株式会社 | シリコンセラミックスコンポジットおよびシリコンセラミックスコンポジットの製造方法 |
| US7335331B1 (en) | 2005-03-01 | 2008-02-26 | Husnay Dana M | Method for making ceramic plates |
| WO2007100698A2 (en) | 2006-02-24 | 2007-09-07 | M Cubed Technologies, Inc. | Intermetallic-containing composite bodies, and methods for making same |
| JP5300493B2 (ja) * | 2006-02-24 | 2013-09-25 | エム キューブド テクノロジーズ, インコーポレイテッド | 金属間化合物含有複合体、及びそれを製造するための方法 |
| JP2009113477A (ja) | 2007-10-15 | 2009-05-28 | Taiheiyo Randamu Kk | セラミックス成形体とその製造方法 |
| JP5177793B2 (ja) * | 2007-12-27 | 2013-04-10 | 独立行政法人物質・材料研究機構 | 炭化ケイ素の製造方法 |
| JP6132586B2 (ja) * | 2013-02-22 | 2017-05-24 | 株式会社フジコー | SiC成形体の製造方法 |
| EP2963002A4 (en) * | 2013-02-27 | 2016-10-26 | Kyocera Corp | CERAMICLY CONNECTED BODY AND CHANNEL BODY |
| FR3008968B1 (fr) * | 2013-07-23 | 2016-12-09 | Herakles | Procede de fabrication de pieces en materiau composite par impregnation a basse temperature de fusion |
| US9123661B2 (en) | 2013-08-07 | 2015-09-01 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
| DE102014216433A1 (de) | 2014-08-19 | 2016-02-25 | Schunk Kohlenstofftechnik Gmbh | Verfahren zur Herstellung eines Formkörpers sowie Formkörper |
| JP6489775B2 (ja) * | 2014-08-21 | 2019-03-27 | 株式会社フジコー | SiC成形体の製造方法及びSiC成形体の加工方法 |
| CN105349827A (zh) * | 2015-10-30 | 2016-02-24 | 苏州列治埃盟新材料技术转移有限公司 | 一种碳化硅增强无铅锡铜合金棒及其制备方法 |
| WO2017177072A1 (en) * | 2016-04-06 | 2017-10-12 | M Cubed Technologies, Inc. | Diamond composite cmp pad conditioner |
| CN109748595B (zh) * | 2017-11-01 | 2021-10-22 | 航天特种材料及工艺技术研究所 | 一种混合渗剂、用途及反应熔渗制备方法 |
| CN113185297B (zh) * | 2021-04-27 | 2023-06-27 | 湖北中烟工业有限责任公司 | 电加热用陶瓷材料及其应用 |
| CN114031415B (zh) * | 2021-10-29 | 2022-08-02 | 中广核研究院有限公司 | 碳化硅接头及其金属渗透连接方法 |
| CN114180967B (zh) * | 2021-12-30 | 2023-01-31 | 浙江立泰复合材料股份有限公司 | 一种中空陶瓷材料及其制备方法 |
| CN117945771A (zh) * | 2023-12-28 | 2024-04-30 | 西安鑫垚陶瓷复合材料股份有限公司 | 一种rmi缓冲层和陶瓷基复合材料反应熔渗方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5079195A (en) * | 1988-01-15 | 1992-01-07 | Massachusetts Institute Of Technology | Method of preparing refractory silicon carbide composites and coatings |
| JP2973762B2 (ja) * | 1993-01-18 | 1999-11-08 | 住友金属工業株式会社 | 半導体製造用炭化珪素焼結体の製造方法 |
| US5509555A (en) * | 1994-06-03 | 1996-04-23 | Massachusetts Institute Of Technology | Method for producing an article by pressureless reactive infiltration |
| EP0798280B1 (en) * | 1996-03-29 | 2001-09-12 | Kabushiki Kaisha Toshiba | Ceramic matrix composite and method of manufacturing the same |
| DE19711831C2 (de) * | 1997-03-21 | 2000-07-13 | Daimler Chrysler Ag | Schmelzinfiltrierte faserverstärkte Verbundkeramik und Verfahren zur Herstellung einer solchen |
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1999
- 1999-07-23 JP JP2001512469A patent/JP4691293B2/ja not_active Expired - Lifetime
- 1999-07-23 IL IL14760099A patent/IL147600A/xx not_active IP Right Cessation
- 1999-07-23 CA CA002380288A patent/CA2380288A1/en not_active Abandoned
- 1999-07-23 CN CN998168130A patent/CN1216830C/zh not_active Expired - Fee Related
- 1999-07-23 AU AU53185/99A patent/AU777124B2/en not_active Ceased
- 1999-07-23 KR KR1020027000927A patent/KR20020073328A/ko not_active Withdrawn
- 1999-07-23 EP EP99938772A patent/EP1200370B1/en not_active Expired - Lifetime
- 1999-07-23 WO PCT/US1999/016449 patent/WO2001007377A1/en not_active Ceased
- 1999-07-23 DE DE69927854T patent/DE69927854T2/de not_active Expired - Lifetime
- 1999-07-23 AT AT99938772T patent/ATE307100T1/de not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11505500B2 (en) * | 2017-09-28 | 2022-11-22 | Sgl Carbon Se | Ceramic component |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001007377A1 (en) | 2001-02-01 |
| EP1200370B1 (en) | 2005-10-19 |
| IL147600A (en) | 2005-11-20 |
| CN1216830C (zh) | 2005-08-31 |
| DE69927854D1 (de) | 2005-11-24 |
| CA2380288A1 (en) | 2001-02-01 |
| JP4691293B2 (ja) | 2011-06-01 |
| IL147600A0 (en) | 2002-08-14 |
| KR20020073328A (ko) | 2002-09-23 |
| AU777124B2 (en) | 2004-09-30 |
| JP2003505329A (ja) | 2003-02-12 |
| CN1361755A (zh) | 2002-07-31 |
| AU5318599A (en) | 2001-02-13 |
| EP1200370A1 (en) | 2002-05-02 |
| ATE307100T1 (de) | 2005-11-15 |
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