JP2003502634A - 可変角度のデザインを用いた光検査の方法及び装置 - Google Patents

可変角度のデザインを用いた光検査の方法及び装置

Info

Publication number
JP2003502634A
JP2003502634A JP2001503510A JP2001503510A JP2003502634A JP 2003502634 A JP2003502634 A JP 2003502634A JP 2001503510 A JP2001503510 A JP 2001503510A JP 2001503510 A JP2001503510 A JP 2001503510A JP 2003502634 A JP2003502634 A JP 2003502634A
Authority
JP
Japan
Prior art keywords
light
angle
image
collected
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001503510A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003502634A5 (enExample
Inventor
ボリス ゴルバーグ，
アミール コメム，
ロン ナフタリ，
ギラド アルモギー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2003502634A publication Critical patent/JP2003502634A/ja
Publication of JP2003502634A5 publication Critical patent/JP2003502634A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2001503510A 1999-06-10 2000-06-09 可変角度のデザインを用いた光検査の方法及び装置 Pending JP2003502634A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/330,249 US6366352B1 (en) 1999-06-10 1999-06-10 Optical inspection method and apparatus utilizing a variable angle design
US09/330,249 1999-06-10
PCT/US2000/016020 WO2000077500A1 (en) 1999-06-10 2000-06-09 Optical inspection method and apparatus utilizing a variable angle design

Publications (2)

Publication Number Publication Date
JP2003502634A true JP2003502634A (ja) 2003-01-21
JP2003502634A5 JP2003502634A5 (enExample) 2010-09-24

Family

ID=23288944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001503510A Pending JP2003502634A (ja) 1999-06-10 2000-06-09 可変角度のデザインを用いた光検査の方法及び装置

Country Status (5)

Country Link
US (2) US6366352B1 (enExample)
EP (1) EP1185855A1 (enExample)
JP (1) JP2003502634A (enExample)
KR (1) KR100861604B1 (enExample)
WO (1) WO2000077500A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008519245A (ja) * 2003-07-23 2008-06-05 ケーエルエー−テンカー テクノロジィース コーポレイション プログラム可能な光選択アレイを有する暗視野検査システム
WO2012086142A1 (ja) * 2010-12-24 2012-06-28 株式会社 日立ハイテクノロジーズ 検査装置
JP2022502696A (ja) * 2018-10-12 2022-01-11 エーエスエムエル ネザーランズ ビー．ブイ． アライメントセンサの検出システム

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WO1996039619A1 (en) 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
US6288780B1 (en) 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
US6774991B1 (en) * 1999-05-27 2004-08-10 Inspex Incorporated Method and apparatus for inspecting a patterned semiconductor wafer
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
JP3996728B2 (ja) * 2000-03-08 2007-10-24 株式会社日立製作所 表面検査装置およびその方法
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US7196782B2 (en) 2000-09-20 2007-03-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thin film characteristic and an electrical property of a specimen
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US7349090B2 (en) 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
DE10115578A1 (de) * 2001-03-29 2002-10-10 Leica Microsystems Verfahren und Anordnung zum Ausgleichen von Abbildungsfehlern
US6538730B2 (en) * 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
US6657714B2 (en) 2001-09-24 2003-12-02 Applied Materials, Inc. Defect detection with enhanced dynamic range
US6906305B2 (en) * 2002-01-08 2005-06-14 Brion Technologies, Inc. System and method for aerial image sensing
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
US6861660B2 (en) * 2002-07-29 2005-03-01 Applied Materials, Inc. Process and assembly for non-destructive surface inspection
US7433053B2 (en) * 2002-08-08 2008-10-07 Applied Materials, Israel, Ltd. Laser inspection using diffractive elements for enhancement and suppression of surface features
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US7030978B2 (en) 2003-04-25 2006-04-18 Applied Materials, Israel, Ltd System and method for inspection of a substrate that has a refractive index
AU2003290785A1 (en) * 2003-02-11 2004-09-06 Applied Materials Israel, Ltd. System and method for inspection of a substrate that has a refractive index
US7180658B2 (en) 2003-02-21 2007-02-20 Kla-Tencor Technologies Corporation High performance catadioptric imaging system
US7053355B2 (en) 2003-03-18 2006-05-30 Brion Technologies, Inc. System and method for lithography process monitoring and control
US20050122508A1 (en) * 2003-10-31 2005-06-09 Sachio Uto Method and apparatus for reviewing defects
JP4996856B2 (ja) * 2006-01-23 2012-08-08 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
JP4876019B2 (ja) * 2007-04-25 2012-02-15 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US8605275B2 (en) * 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
US8223327B2 (en) 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
JP5687014B2 (ja) * 2010-09-24 2015-03-18 株式会社日立ハイテクノロジーズ 光学式表面欠陥検査装置及び光学式表面欠陥検査方法
US10156527B2 (en) * 2014-04-24 2018-12-18 Asml Holding N.V. Compact two-sided reticle inspection system
US10887580B2 (en) * 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection
US11536792B2 (en) 2020-04-30 2022-12-27 Applied Materials Israel Ltd. Test of an examination tool

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603457U (ja) * 1983-06-21 1985-01-11 株式会社安川電機 欠点検出装置
US4898471A (en) * 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
JPH05118994A (ja) * 1991-05-17 1993-05-14 Internatl Business Mach Corp <Ibm> 繰返しパターンをもつ表面の欠陥検査方法及び装置
JPH06167458A (ja) * 1992-11-30 1994-06-14 Hitachi Ltd 異物検査装置
JPH07506676A (ja) * 1992-05-12 1995-07-20 テンコール・インスツルメンツ 表面検査のための適応型空間フィルタ
JPH102864A (ja) * 1996-06-13 1998-01-06 Nikon Corp 異物検査装置

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US3813172A (en) 1972-01-03 1974-05-28 Kollmorgen Corp Photometric device with a plurality of measuring fields
JPS5324301B2 (enExample) * 1974-09-09 1978-07-20
US4669875A (en) * 1982-11-04 1987-06-02 Hitachi, Ltd. Foreign particle detecting method and apparatus
KR910000794B1 (ko) 1985-03-28 1991-02-08 가부시끼가이샤 도오시바 기판의 표면검사방법 및 장치
USRE33956F1 (en) 1987-06-08 1994-06-07 Optical Specialties Inc Inspection system for array of microcircuit dies having redundant circuit patterns
US5046847A (en) * 1987-10-30 1991-09-10 Hitachi Ltd. Method for detecting foreign matter and device for realizing same
US5172000A (en) 1990-11-02 1992-12-15 Insystems, Inc. Spatial filter for optically based defect inspection system
JP3314440B2 (ja) * 1993-02-26 2002-08-12 株式会社日立製作所 欠陥検査装置およびその方法
US5479252A (en) * 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
US5471066A (en) * 1993-08-26 1995-11-28 Nikon Corporation Defect inspection apparatus of rotary type
JPH07229844A (ja) * 1994-02-22 1995-08-29 Nikon Corp 異物検査装置
US5712701A (en) * 1995-03-06 1998-01-27 Ade Optical Systems Corporation Surface inspection system and method of inspecting surface of workpiece
US5604585A (en) 1995-03-31 1997-02-18 Tencor Instruments Particle detection system employing a subsystem for collecting scattered light from the particles
JPH09178563A (ja) 1995-12-21 1997-07-11 Shimadzu Corp 分光測定装置
US6034776A (en) * 1997-04-16 2000-03-07 The United States Of America As Represented By The Secretary Of Commerce Microroughness-blind optical scattering instrument

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603457U (ja) * 1983-06-21 1985-01-11 株式会社安川電機 欠点検出装置
US4898471A (en) * 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
JPH05118994A (ja) * 1991-05-17 1993-05-14 Internatl Business Mach Corp <Ibm> 繰返しパターンをもつ表面の欠陥検査方法及び装置
JPH07506676A (ja) * 1992-05-12 1995-07-20 テンコール・インスツルメンツ 表面検査のための適応型空間フィルタ
JPH06167458A (ja) * 1992-11-30 1994-06-14 Hitachi Ltd 異物検査装置
JPH102864A (ja) * 1996-06-13 1998-01-06 Nikon Corp 異物検査装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008519245A (ja) * 2003-07-23 2008-06-05 ケーエルエー−テンカー テクノロジィース コーポレイション プログラム可能な光選択アレイを有する暗視野検査システム
JP4825423B2 (ja) * 2003-07-23 2011-11-30 ケーエルエー−テンカー コーポレイション プログラム可能な光選択アレイを有する暗視野検査システム
WO2012086142A1 (ja) * 2010-12-24 2012-06-28 株式会社 日立ハイテクノロジーズ 検査装置
JP2022502696A (ja) * 2018-10-12 2022-01-11 エーエスエムエル ネザーランズ ビー．ブイ． アライメントセンサの検出システム
JP7144605B2 (ja) 2018-10-12 2022-09-29 エーエスエムエル ネザーランズ ビー．ブイ． アライメントセンサの検出システム
US11556068B2 (en) 2018-10-12 2023-01-17 Asml Netherlands B.V. Detection system for an alignment sensor

Also Published As

Publication number Publication date
EP1185855A1 (en) 2002-03-13
US6469784B2 (en) 2002-10-22
US6366352B1 (en) 2002-04-02
KR20020019073A (ko) 2002-03-09
US20020005947A1 (en) 2002-01-17
KR100861604B1 (ko) 2008-10-07
WO2000077500A1 (en) 2000-12-21

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