JP2003502634A5 - - Google Patents

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Publication number
JP2003502634A5
JP2003502634A5 JP2001503510A JP2001503510A JP2003502634A5 JP 2003502634 A5 JP2003502634 A5 JP 2003502634A5 JP 2001503510 A JP2001503510 A JP 2001503510A JP 2001503510 A JP2001503510 A JP 2001503510A JP 2003502634 A5 JP2003502634 A5 JP 2003502634A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001503510A
Other languages
Japanese (ja)
Other versions
JP2003502634A (ja
Filing date
Publication date
Priority claimed from US09/330,249 external-priority patent/US6366352B1/en
Application filed filed Critical
Publication of JP2003502634A publication Critical patent/JP2003502634A/ja
Publication of JP2003502634A5 publication Critical patent/JP2003502634A5/ja
Pending legal-status Critical Current

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JP2001503510A 1999-06-10 2000-06-09 可変角度のデザインを用いた光検査の方法及び装置 Pending JP2003502634A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/330,249 US6366352B1 (en) 1999-06-10 1999-06-10 Optical inspection method and apparatus utilizing a variable angle design
US09/330,249 1999-06-10
PCT/US2000/016020 WO2000077500A1 (en) 1999-06-10 2000-06-09 Optical inspection method and apparatus utilizing a variable angle design

Publications (2)

Publication Number Publication Date
JP2003502634A JP2003502634A (ja) 2003-01-21
JP2003502634A5 true JP2003502634A5 (enExample) 2010-09-24

Family

ID=23288944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001503510A Pending JP2003502634A (ja) 1999-06-10 2000-06-09 可変角度のデザインを用いた光検査の方法及び装置

Country Status (5)

Country Link
US (2) US6366352B1 (enExample)
EP (1) EP1185855A1 (enExample)
JP (1) JP2003502634A (enExample)
KR (1) KR100861604B1 (enExample)
WO (1) WO2000077500A1 (enExample)

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US6774991B1 (en) * 1999-05-27 2004-08-10 Inspex Incorporated Method and apparatus for inspecting a patterned semiconductor wafer
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
JP3996728B2 (ja) * 2000-03-08 2007-10-24 株式会社日立製作所 表面検査装置およびその方法
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US6917433B2 (en) 2000-09-20 2005-07-12 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US7349090B2 (en) 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
DE10115578A1 (de) * 2001-03-29 2002-10-10 Leica Microsystems Verfahren und Anordnung zum Ausgleichen von Abbildungsfehlern
US6538730B2 (en) * 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
US6657714B2 (en) * 2001-09-24 2003-12-02 Applied Materials, Inc. Defect detection with enhanced dynamic range
US6906305B2 (en) * 2002-01-08 2005-06-14 Brion Technologies, Inc. System and method for aerial image sensing
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
US6861660B2 (en) * 2002-07-29 2005-03-01 Applied Materials, Inc. Process and assembly for non-destructive surface inspection
US7433053B2 (en) * 2002-08-08 2008-10-07 Applied Materials, Israel, Ltd. Laser inspection using diffractive elements for enhancement and suppression of surface features
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US7030978B2 (en) 2003-04-25 2006-04-18 Applied Materials, Israel, Ltd System and method for inspection of a substrate that has a refractive index
AU2003290785A1 (en) * 2003-02-11 2004-09-06 Applied Materials Israel, Ltd. System and method for inspection of a substrate that has a refractive index
US7180658B2 (en) 2003-02-21 2007-02-20 Kla-Tencor Technologies Corporation High performance catadioptric imaging system
US7053355B2 (en) 2003-03-18 2006-05-30 Brion Technologies, Inc. System and method for lithography process monitoring and control
US7002677B2 (en) * 2003-07-23 2006-02-21 Kla-Tencor Technologies Corporation Darkfield inspection system having a programmable light selection array
US20050122508A1 (en) * 2003-10-31 2005-06-09 Sachio Uto Method and apparatus for reviewing defects
JP4996856B2 (ja) * 2006-01-23 2012-08-08 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
JP4876019B2 (ja) * 2007-04-25 2012-02-15 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US8223327B2 (en) 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
US8605275B2 (en) * 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
JP5687014B2 (ja) * 2010-09-24 2015-03-18 株式会社日立ハイテクノロジーズ 光学式表面欠陥検査装置及び光学式表面欠陥検査方法
JP5593213B2 (ja) * 2010-12-24 2014-09-17 株式会社日立ハイテクノロジーズ 検査装置
US10156527B2 (en) * 2014-04-24 2018-12-18 Asml Holding N.V. Compact two-sided reticle inspection system
US10887580B2 (en) 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection
WO2020074250A1 (en) 2018-10-12 2020-04-16 Asml Netherlands B.V. Detection system for an alignment sensor
US11536792B2 (en) 2020-04-30 2022-12-27 Applied Materials Israel Ltd. Test of an examination tool

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USRE33956F1 (en) 1987-06-08 1994-06-07 Optical Specialties Inc Inspection system for array of microcircuit dies having redundant circuit patterns
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US5177559A (en) * 1991-05-17 1993-01-05 International Business Machines Corporation Dark field imaging defect inspection system for repetitive pattern integrated circuits
US5276498A (en) 1992-05-12 1994-01-04 Tencor Instruments Adaptive spatial filter for surface inspection
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JP3319790B2 (ja) * 1992-11-30 2002-09-03 株式会社日立製作所 異物検査方法及びその装置
US5479252A (en) * 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
US5471066A (en) * 1993-08-26 1995-11-28 Nikon Corporation Defect inspection apparatus of rotary type
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