JP2003338666A5 - - Google Patents

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Publication number
JP2003338666A5
JP2003338666A5 JP2002143609A JP2002143609A JP2003338666A5 JP 2003338666 A5 JP2003338666 A5 JP 2003338666A5 JP 2002143609 A JP2002143609 A JP 2002143609A JP 2002143609 A JP2002143609 A JP 2002143609A JP 2003338666 A5 JP2003338666 A5 JP 2003338666A5
Authority
JP
Japan
Prior art keywords
solid pattern
opened
disposed
solder resist
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002143609A
Other languages
English (en)
Japanese (ja)
Other versions
JP3889311B2 (ja
JP2003338666A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002143609A priority Critical patent/JP3889311B2/ja
Priority claimed from JP2002143609A external-priority patent/JP3889311B2/ja
Publication of JP2003338666A publication Critical patent/JP2003338666A/ja
Publication of JP2003338666A5 publication Critical patent/JP2003338666A5/ja
Application granted granted Critical
Publication of JP3889311B2 publication Critical patent/JP3889311B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002143609A 2002-05-17 2002-05-17 プリント配線板 Expired - Fee Related JP3889311B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002143609A JP3889311B2 (ja) 2002-05-17 2002-05-17 プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002143609A JP3889311B2 (ja) 2002-05-17 2002-05-17 プリント配線板

Publications (3)

Publication Number Publication Date
JP2003338666A JP2003338666A (ja) 2003-11-28
JP2003338666A5 true JP2003338666A5 (enExample) 2005-08-11
JP3889311B2 JP3889311B2 (ja) 2007-03-07

Family

ID=29703566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002143609A Expired - Fee Related JP3889311B2 (ja) 2002-05-17 2002-05-17 プリント配線板

Country Status (1)

Country Link
JP (1) JP3889311B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5186741B2 (ja) * 2006-08-18 2013-04-24 富士通セミコンダクター株式会社 回路基板及び半導体装置
DE102008054932B4 (de) * 2008-12-18 2011-12-01 Infineon Technologies Ag Leistungshalbleitermodul mit versteifter Bodenplatte
KR102059478B1 (ko) * 2017-09-15 2019-12-26 스템코 주식회사 회로 기판 및 그 제조 방법

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