JP2003243780A5 - - Google Patents

Download PDF

Info

Publication number
JP2003243780A5
JP2003243780A5 JP2002040957A JP2002040957A JP2003243780A5 JP 2003243780 A5 JP2003243780 A5 JP 2003243780A5 JP 2002040957 A JP2002040957 A JP 2002040957A JP 2002040957 A JP2002040957 A JP 2002040957A JP 2003243780 A5 JP2003243780 A5 JP 2003243780A5
Authority
JP
Japan
Prior art keywords
pattern
wiring board
connector
substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002040957A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003243780A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002040957A priority Critical patent/JP2003243780A/ja
Priority claimed from JP2002040957A external-priority patent/JP2003243780A/ja
Publication of JP2003243780A publication Critical patent/JP2003243780A/ja
Publication of JP2003243780A5 publication Critical patent/JP2003243780A5/ja
Pending legal-status Critical Current

Links

JP2002040957A 2002-02-19 2002-02-19 配線基板及びそれを用いた電子装置 Pending JP2003243780A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002040957A JP2003243780A (ja) 2002-02-19 2002-02-19 配線基板及びそれを用いた電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002040957A JP2003243780A (ja) 2002-02-19 2002-02-19 配線基板及びそれを用いた電子装置

Publications (2)

Publication Number Publication Date
JP2003243780A JP2003243780A (ja) 2003-08-29
JP2003243780A5 true JP2003243780A5 (enExample) 2005-08-25

Family

ID=27781488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002040957A Pending JP2003243780A (ja) 2002-02-19 2002-02-19 配線基板及びそれを用いた電子装置

Country Status (1)

Country Link
JP (1) JP2003243780A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106851982A (zh) * 2017-03-21 2017-06-13 深圳华麟电路技术有限公司 一体式双摄像头电路基板及其制作方法

Similar Documents

Publication Publication Date Title
CA2355037A1 (en) Circuit board assembly with heat sinking
JP2008016519A5 (enExample)
EP1601017A4 (en) MULTILAYER PRINTED PCB
WO2008146603A1 (ja) 半導体装置およびその製造方法、ならびにディスプレイ装置およびその製造方法
TW200507218A (en) Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module
TW200512894A (en) Intermediate chip module, semiconductor device, circuit board, and electronic device
WO2002047163A3 (en) Semiconductor device having a ball grid array and method therefor
DK1467407T3 (da) Effekthalvledermodul
TW200742524A (en) Multilayer printed circuit board
JP2004179232A5 (enExample)
FI20075593A7 (fi) Menetelmä valmistaa komponenttiin upotettu piirilevy
KR880010641A (ko) 양면메모리 보드
WO2008087851A1 (ja) フレキシブル基板及び半導体装置
DE50002850D1 (de) Intelligentes leistungsmodul
TW200742518A (en) Flexible printed circuit board and method for manufacturing the same
JP2003243780A5 (enExample)
JP2005150283A5 (enExample)
MY128626A (en) Semiconductor device
CN211062704U (zh) 芯片模组和电子设备
JP2008041953A5 (enExample)
CN205051965U (zh) 一种复合导热电路板
JP2008010615A5 (enExample)
KR100810896B1 (ko) 스마트 카드 모듈의 스마트 ic 컨택 구조
CN205051963U (zh) 一种复合电路板
JP2004006454A (ja) 回路基板のランド構造