JP3889311B2 - プリント配線板 - Google Patents

プリント配線板 Download PDF

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Publication number
JP3889311B2
JP3889311B2 JP2002143609A JP2002143609A JP3889311B2 JP 3889311 B2 JP3889311 B2 JP 3889311B2 JP 2002143609 A JP2002143609 A JP 2002143609A JP 2002143609 A JP2002143609 A JP 2002143609A JP 3889311 B2 JP3889311 B2 JP 3889311B2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
solder
solid pattern
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002143609A
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English (en)
Japanese (ja)
Other versions
JP2003338666A5 (enExample
JP2003338666A (ja
Inventor
剛 羽立
高宏 長嶺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2002143609A priority Critical patent/JP3889311B2/ja
Publication of JP2003338666A publication Critical patent/JP2003338666A/ja
Publication of JP2003338666A5 publication Critical patent/JP2003338666A5/ja
Application granted granted Critical
Publication of JP3889311B2 publication Critical patent/JP3889311B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2002143609A 2002-05-17 2002-05-17 プリント配線板 Expired - Fee Related JP3889311B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002143609A JP3889311B2 (ja) 2002-05-17 2002-05-17 プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002143609A JP3889311B2 (ja) 2002-05-17 2002-05-17 プリント配線板

Publications (3)

Publication Number Publication Date
JP2003338666A JP2003338666A (ja) 2003-11-28
JP2003338666A5 JP2003338666A5 (enExample) 2005-08-11
JP3889311B2 true JP3889311B2 (ja) 2007-03-07

Family

ID=29703566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002143609A Expired - Fee Related JP3889311B2 (ja) 2002-05-17 2002-05-17 プリント配線板

Country Status (1)

Country Link
JP (1) JP3889311B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5186741B2 (ja) * 2006-08-18 2013-04-24 富士通セミコンダクター株式会社 回路基板及び半導体装置
DE102008054932B4 (de) * 2008-12-18 2011-12-01 Infineon Technologies Ag Leistungshalbleitermodul mit versteifter Bodenplatte
KR102059478B1 (ko) * 2017-09-15 2019-12-26 스템코 주식회사 회로 기판 및 그 제조 방법

Also Published As

Publication number Publication date
JP2003338666A (ja) 2003-11-28

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