JPH02102738U - - Google Patents
Info
- Publication number
- JPH02102738U JPH02102738U JP1989009933U JP993389U JPH02102738U JP H02102738 U JPH02102738 U JP H02102738U JP 1989009933 U JP1989009933 U JP 1989009933U JP 993389 U JP993389 U JP 993389U JP H02102738 U JPH02102738 U JP H02102738U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive pattern
- solder ball
- external connection
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989009933U JPH02102738U (enExample) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989009933U JPH02102738U (enExample) | 1989-01-31 | 1989-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102738U true JPH02102738U (enExample) | 1990-08-15 |
Family
ID=31217116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989009933U Pending JPH02102738U (enExample) | 1989-01-31 | 1989-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102738U (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992020097A1 (fr) * | 1991-04-26 | 1992-11-12 | Citizen Watch Co., Ltd. | Dispositif a semi-conducteurs et procede de production de ce dispositif |
| JPH05206357A (ja) * | 1992-01-29 | 1993-08-13 | Matsushita Electric Ind Co Ltd | 中間基材のボンディング方法 |
| JPH08236911A (ja) * | 1995-02-27 | 1996-09-13 | Nec Corp | ボール状外部接続端子の構造 |
| JPH098168A (ja) * | 1995-06-21 | 1997-01-10 | Nec Corp | 半導体装置 |
| WO1998034443A1 (en) * | 1997-01-30 | 1998-08-06 | Ibiden Co., Ltd. | Printed wiring board and manufacturing method therefor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63229842A (ja) * | 1987-03-19 | 1988-09-26 | Ibiden Co Ltd | 表面実装用パツケ−ジ |
-
1989
- 1989-01-31 JP JP1989009933U patent/JPH02102738U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63229842A (ja) * | 1987-03-19 | 1988-09-26 | Ibiden Co Ltd | 表面実装用パツケ−ジ |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992020097A1 (fr) * | 1991-04-26 | 1992-11-12 | Citizen Watch Co., Ltd. | Dispositif a semi-conducteurs et procede de production de ce dispositif |
| JPH05206357A (ja) * | 1992-01-29 | 1993-08-13 | Matsushita Electric Ind Co Ltd | 中間基材のボンディング方法 |
| JPH08236911A (ja) * | 1995-02-27 | 1996-09-13 | Nec Corp | ボール状外部接続端子の構造 |
| JPH098168A (ja) * | 1995-06-21 | 1997-01-10 | Nec Corp | 半導体装置 |
| WO1998034443A1 (en) * | 1997-01-30 | 1998-08-06 | Ibiden Co., Ltd. | Printed wiring board and manufacturing method therefor |