JPH02102738U - - Google Patents

Info

Publication number
JPH02102738U
JPH02102738U JP993389U JP993389U JPH02102738U JP H02102738 U JPH02102738 U JP H02102738U JP 993389 U JP993389 U JP 993389U JP 993389 U JP993389 U JP 993389U JP H02102738 U JPH02102738 U JP H02102738U
Authority
JP
Japan
Prior art keywords
circuit board
conductive pattern
solder ball
external connection
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP993389U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP993389U priority Critical patent/JPH02102738U/ja
Publication of JPH02102738U publication Critical patent/JPH02102738U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図及び第３図はそれぞれ本考案の実施例で
半田ボール形成部の断面図、第２図は第１図の半
田ボールをマザーボードへ接続した状態を示す半
田ボール形成部の断面図、第４図及び第５図は本
考案のＰＰＧＡの断面図及び裏面図である。 １……ＰＰＧＡ、２……樹脂基板、３……ＩＣ
チツプ、４，４０……金属ピン、５……半田ボー
ル。

Claims (1)

    【実用新案登録請求の範囲】
  1. 両面に導電パターンを有する回路基板の上面側
    にＩＣチツプを実装し、上面側の導電パターンと
    下面側の導電パターンとをスルーホールを介して
    接続するとともに、下面側の導電パターンに半田
    ボールを形成して外部接続電極とするＩＣ実装装
    置に於いて、前記回路基板のスルーホール内には
    回路基板の下面側に突出した金属ピンを植設し、
    該金属ピンを包み込む形状に前記半田ボールを形
    成したことを特徴とするＩＣ実装構造。
JP993389U 1989-01-31 1989-01-31 Pending JPH02102738U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP993389U JPH02102738U (ja) 1989-01-31 1989-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP993389U JPH02102738U (ja) 1989-01-31 1989-01-31

Publications (1)

Publication Number Publication Date
JPH02102738U true JPH02102738U (ja) 1990-08-15

Family

ID=31217116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP993389U Pending JPH02102738U (ja) 1989-01-31 1989-01-31

Country Status (1)

Country Link
JP (1) JPH02102738U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992020097A1 (en) * 1991-04-26 1992-11-12 Citizen Watch Co., Ltd. Semiconductor device and manufacturing method therefor
JPH05206357A (ja) * 1992-01-29 1993-08-13 Matsushita Electric Ind Co Ltd 中間基材のボンディング方法
JPH08236911A (ja) * 1995-02-27 1996-09-13 Nec Corp ボール状外部接続端子の構造
JPH098168A (ja) * 1995-06-21 1997-01-10 Nec Corp 半導体装置
WO1998034443A1 (fr) * 1997-01-30 1998-08-06 Ibiden Co., Ltd. Carte imprimee et son procede de production

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229842A (ja) * 1987-03-19 1988-09-26 Ibiden Co Ltd 表面実装用パツケ−ジ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63229842A (ja) * 1987-03-19 1988-09-26 Ibiden Co Ltd 表面実装用パツケ−ジ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992020097A1 (en) * 1991-04-26 1992-11-12 Citizen Watch Co., Ltd. Semiconductor device and manufacturing method therefor
JPH05206357A (ja) * 1992-01-29 1993-08-13 Matsushita Electric Ind Co Ltd 中間基材のボンディング方法
JPH08236911A (ja) * 1995-02-27 1996-09-13 Nec Corp ボール状外部接続端子の構造
JPH098168A (ja) * 1995-06-21 1997-01-10 Nec Corp 半導体装置
WO1998034443A1 (fr) * 1997-01-30 1998-08-06 Ibiden Co., Ltd. Carte imprimee et son procede de production

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