JP2003332440A5 - - Google Patents

Download PDF

Info

Publication number
JP2003332440A5
JP2003332440A5 JP2002131172A JP2002131172A JP2003332440A5 JP 2003332440 A5 JP2003332440 A5 JP 2003332440A5 JP 2002131172 A JP2002131172 A JP 2002131172A JP 2002131172 A JP2002131172 A JP 2002131172A JP 2003332440 A5 JP2003332440 A5 JP 2003332440A5
Authority
JP
Japan
Prior art keywords
circuit
interface
chip
internal
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002131172A
Other languages
English (en)
Japanese (ja)
Other versions
JP5085829B2 (ja
JP2003332440A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002131172A priority Critical patent/JP5085829B2/ja
Priority claimed from JP2002131172A external-priority patent/JP5085829B2/ja
Publication of JP2003332440A publication Critical patent/JP2003332440A/ja
Publication of JP2003332440A5 publication Critical patent/JP2003332440A5/ja
Application granted granted Critical
Publication of JP5085829B2 publication Critical patent/JP5085829B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002131172A 2002-05-07 2002-05-07 集積回路チップ構造 Expired - Fee Related JP5085829B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002131172A JP5085829B2 (ja) 2002-05-07 2002-05-07 集積回路チップ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002131172A JP5085829B2 (ja) 2002-05-07 2002-05-07 集積回路チップ構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010097554A Division JP2010239137A (ja) 2010-04-21 2010-04-21 高性能サブシステムの設計および組立体

Publications (3)

Publication Number Publication Date
JP2003332440A JP2003332440A (ja) 2003-11-21
JP2003332440A5 true JP2003332440A5 (https=) 2005-09-29
JP5085829B2 JP5085829B2 (ja) 2012-11-28

Family

ID=29695855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002131172A Expired - Fee Related JP5085829B2 (ja) 2002-05-07 2002-05-07 集積回路チップ構造

Country Status (1)

Country Link
JP (1) JP5085829B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4640655B2 (ja) 2004-06-10 2011-03-02 日本電気株式会社 情報端末、ネットワーク接続設定プログラム、ネットワークシステムおよび方法
KR100630685B1 (ko) * 2004-06-22 2006-10-02 삼성전자주식회사 다른 칩을 경유하여 입력 신호를 전달하는 집적회로 장치및 집적회로 멀티 칩 패키지
JP2006080145A (ja) * 2004-09-07 2006-03-23 Nec Electronics Corp チップオンチップ型半導体集積回路装置
KR101049640B1 (ko) 2007-01-19 2011-07-14 램버스 인코포레이티드 반도체 장치
JP5801531B2 (ja) * 2009-10-16 2015-10-28 ルネサスエレクトロニクス株式会社 半導体パッケージ及びその製造方法
KR101190744B1 (ko) 2010-05-27 2012-10-12 에스케이하이닉스 주식회사 멀티칩 구조를 가지는 반도체 집적 회로
KR101211044B1 (ko) 2010-05-27 2012-12-12 에스케이하이닉스 주식회사 멀티칩 구조를 가지는 반도체 집적 회로
TWI483378B (zh) * 2013-01-04 2015-05-01 黃財煜 三維晶片堆疊結構
JP5908545B2 (ja) * 2014-08-14 2016-04-26 クゥアルコム・インコーポレイテッドＱｕａｌｃｏｍｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 高性能サブシステムの設計および組立体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58118123A (ja) * 1982-01-06 1983-07-14 Hitachi Ltd 半導体集積回路
JPS63126263A (ja) * 1986-11-17 1988-05-30 Hitachi Ltd 半導体集積回路装置
JP2531827B2 (ja) * 1990-04-25 1996-09-04 株式会社東芝 半導体装置及びその製造方法
EP0767492A3 (en) * 1995-10-02 1998-09-09 Altera Corporation Integrated circuit test system
JP3152635B2 (ja) * 1996-09-09 2001-04-03 三洋電機株式会社 マスタスライス方式の基本セル、半導体集積回路装置、フリップフロップ回路、排他的論理和回路、マルチプレクサ及び加算器
JP2000022072A (ja) * 1998-07-07 2000-01-21 Matsushita Electric Ind Co Ltd マルチチップモジュール

Similar Documents

Publication Publication Date Title
TW200511612A (en) Mount for semiconductor light emitting device
JP2004063767A5 (https=)
WO2007139730A3 (en) Semiconductor input control device
JPH11163255A5 (ja) 半導体装置
JP2006339640A (ja) 静電気放電衝撃に対する保護機能が内蔵された高輝度発光ダイオード
WO2005003801A3 (en) Semiconductor device and magneto-resistive sensor integration
TW200737383A (en) Substrate with built-in chip and method for manufacturing substrate with built-in chip
WO2011084216A3 (en) Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
JP2007525842A5 (https=)
MY131415A (en) Semiconductor device
TW200627563A (en) Bump-less chip package
TWI385779B (zh) 多層系統晶片模組結構
JP2010219122A5 (https=)
DE60333289D1 (de) Chip verbunden mit einer integrierten schaltung
TW200504952A (en) Method of manufacturing semiconductor package and method of manufacturing semiconductor device
TW200802828A (en) Semiconductor device
TW200511534A (en) Tape circuit substrate and semiconductor chip package using the same
JP2002110865A5 (https=)
CA2409912A1 (en) Improvements in grounding and thermal dissipation for integrated circuit packages
JP2003332440A5 (https=)
TW200627561A (en) Chip package
TW200731438A (en) Flip chip MLP with conductive ink
JP2005347369A5 (https=)
TW200727756A (en) Circuit board and electronic assembly
JP2005150283A5 (https=)