JP2003273020A5 - - Google Patents

Download PDF

Info

Publication number
JP2003273020A5
JP2003273020A5 JP2002070065A JP2002070065A JP2003273020A5 JP 2003273020 A5 JP2003273020 A5 JP 2003273020A5 JP 2002070065 A JP2002070065 A JP 2002070065A JP 2002070065 A JP2002070065 A JP 2002070065A JP 2003273020 A5 JP2003273020 A5 JP 2003273020A5
Authority
JP
Japan
Prior art keywords
outer tube
processed
substrate
semiconductor device
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002070065A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003273020A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002070065A priority Critical patent/JP2003273020A/ja
Priority claimed from JP2002070065A external-priority patent/JP2003273020A/ja
Priority to US10/383,636 priority patent/US20030175426A1/en
Priority to KR10-2003-0015682A priority patent/KR20030074418A/ko
Publication of JP2003273020A publication Critical patent/JP2003273020A/ja
Publication of JP2003273020A5 publication Critical patent/JP2003273020A5/ja
Pending legal-status Critical Current

Links

JP2002070065A 2002-03-14 2002-03-14 基板処理方法 Pending JP2003273020A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002070065A JP2003273020A (ja) 2002-03-14 2002-03-14 基板処理方法
US10/383,636 US20030175426A1 (en) 2002-03-14 2003-03-10 Heat treatment apparatus and method for processing substrates
KR10-2003-0015682A KR20030074418A (ko) 2002-03-14 2003-03-13 기판 처리 방법 및 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002070065A JP2003273020A (ja) 2002-03-14 2002-03-14 基板処理方法

Publications (2)

Publication Number Publication Date
JP2003273020A JP2003273020A (ja) 2003-09-26
JP2003273020A5 true JP2003273020A5 (enExample) 2005-09-22

Family

ID=28035038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002070065A Pending JP2003273020A (ja) 2002-03-14 2002-03-14 基板処理方法

Country Status (3)

Country Link
US (1) US20030175426A1 (enExample)
JP (1) JP2003273020A (enExample)
KR (1) KR20030074418A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070243317A1 (en) * 2002-07-15 2007-10-18 Du Bois Dale R Thermal Processing System and Configurable Vertical Chamber
US8200700B2 (en) 2005-02-01 2012-06-12 Newsilike Media Group, Inc Systems and methods for use of structured and unstructured distributed data
US7381926B2 (en) * 2005-09-09 2008-06-03 Applied Materials, Inc. Removable heater
JP2008186865A (ja) * 2007-01-26 2008-08-14 Tokyo Electron Ltd 基板処理装置
JP5222652B2 (ja) * 2008-07-30 2013-06-26 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5383332B2 (ja) * 2008-08-06 2014-01-08 株式会社日立国際電気 基板処理装置、基板処理方法及び半導体装置の製造方法
TW202229795A (zh) * 2020-11-23 2022-08-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 具注入器之基板處理設備
CN112663027B (zh) * 2020-12-02 2023-04-25 鑫天虹(厦门)科技有限公司 可减少前驱物沉积的原子层沉积设备与制程方法
FI129948B (en) * 2021-05-10 2022-11-15 Picosun Oy SUBSTRATE PROCESSING APPARATUS AND METHOD
JP7317912B2 (ja) * 2021-09-21 2023-07-31 株式会社Kokusai Electric 炉口部構造、基板処理装置、および半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2825172B2 (ja) * 1992-07-10 1998-11-18 東京エレクトロン株式会社 減圧処理装置および減圧処理方法
US5637153A (en) * 1993-04-30 1997-06-10 Tokyo Electron Limited Method of cleaning reaction tube and exhaustion piping system in heat processing apparatus
US5507639A (en) * 1993-06-30 1996-04-16 Tokyo Electron Kabushiki Kaisha Heat treatment apparatus and method thereof
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US6383300B1 (en) * 1998-11-27 2002-05-07 Tokyo Electron Ltd. Heat treatment apparatus and cleaning method of the same

Similar Documents

Publication Publication Date Title
JP2003273020A5 (enExample)
JP2011192872A5 (enExample)
JP5113705B2 (ja) 薄膜形成装置の洗浄方法、薄膜形成方法、薄膜形成装置及びプログラム
JP2008502134A5 (enExample)
JP2010153680A5 (enExample)
SG169306A1 (en) Method of manufacturing semiconductor device, cleaning method, and substrate processing apparatus
WO2007067395A3 (en) Apparatus and method for cleaning and drying a container for semiconductor workpieces
WO2009041499A1 (ja) プラズマ処理装置及びそのガス排気方法
WO2003023825A3 (en) Substrate processing apparatus
JP2001274104A5 (enExample)
TW200506091A (en) Process for depositing film, process for fabricating semiconductor device, semiconductor device and system for depositing film
JP2007509499A5 (enExample)
JP2022107898A5 (enExample)
WO2011097178A3 (en) Methods for nitridation and oxidation
JP2005064302A5 (enExample)
CN103681246B (zh) 一种SiC材料清洗方法
WO2006107569A3 (en) Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas environment including a drying enhancement substance
JP2002246381A5 (enExample)
JP2008118123A5 (enExample)
JP5675847B2 (ja) ウエハー洗浄装備用カセットジグ及びこれを備えたカセットアセンブリ
JP2007501899A5 (enExample)
TW200746310A (en) W based film forming method, gate electrode forming method, semiconductor device manufacturing method, and computer-readable storage medium
JP2006005287A5 (enExample)
JP2007530788A5 (enExample)
US9228260B1 (en) Wafer processing chamber, heat treatment apparatus and method for processing wafers