JP2006005287A5 - - Google Patents

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Publication number
JP2006005287A5
JP2006005287A5 JP2004182339A JP2004182339A JP2006005287A5 JP 2006005287 A5 JP2006005287 A5 JP 2006005287A5 JP 2004182339 A JP2004182339 A JP 2004182339A JP 2004182339 A JP2004182339 A JP 2004182339A JP 2006005287 A5 JP2006005287 A5 JP 2006005287A5
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JP
Japan
Prior art keywords
substrate
processing
plasma
production
transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004182339A
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English (en)
Japanese (ja)
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JP2006005287A (ja
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Publication date
Application filed filed Critical
Priority to JP2004182339A priority Critical patent/JP2006005287A/ja
Priority claimed from JP2004182339A external-priority patent/JP2006005287A/ja
Publication of JP2006005287A publication Critical patent/JP2006005287A/ja
Publication of JP2006005287A5 publication Critical patent/JP2006005287A5/ja
Pending legal-status Critical Current

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JP2004182339A 2004-06-21 2004-06-21 基板処理方法 Pending JP2006005287A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004182339A JP2006005287A (ja) 2004-06-21 2004-06-21 基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004182339A JP2006005287A (ja) 2004-06-21 2004-06-21 基板処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009032671A Division JP2009152624A (ja) 2009-02-16 2009-02-16 基板処理方法及び半導体製造装置

Publications (2)

Publication Number Publication Date
JP2006005287A JP2006005287A (ja) 2006-01-05
JP2006005287A5 true JP2006005287A5 (enExample) 2007-07-26

Family

ID=35773373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004182339A Pending JP2006005287A (ja) 2004-06-21 2004-06-21 基板処理方法

Country Status (1)

Country Link
JP (1) JP2006005287A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006130838A2 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Methods and apparatus for incorporating nitrogen in oxide films
JP5448456B2 (ja) * 2006-01-18 2014-03-19 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト 円板状の基板の脱ガスをする装置
JP2007288069A (ja) * 2006-04-19 2007-11-01 Hitachi Kokusai Electric Inc 半導体装置の製造方法
JP6022785B2 (ja) 2012-03-26 2016-11-09 株式会社日立国際電気 半導体装置の製造方法、基板処理装置、及びプログラム
WO2021161824A1 (ja) * 2020-02-14 2021-08-19 東京エレクトロン株式会社 基板処理方法および基板処理装置

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