JP2003243576A5 - - Google Patents

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Publication number
JP2003243576A5
JP2003243576A5 JP2002036466A JP2002036466A JP2003243576A5 JP 2003243576 A5 JP2003243576 A5 JP 2003243576A5 JP 2002036466 A JP2002036466 A JP 2002036466A JP 2002036466 A JP2002036466 A JP 2002036466A JP 2003243576 A5 JP2003243576 A5 JP 2003243576A5
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JP
Japan
Prior art keywords
signal
electrode
semiconductor
semiconductor device
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002036466A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003243576A (ja
JP3741274B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002036466A priority Critical patent/JP3741274B2/ja
Priority claimed from JP2002036466A external-priority patent/JP3741274B2/ja
Priority to US10/366,347 priority patent/US6661101B2/en
Publication of JP2003243576A publication Critical patent/JP2003243576A/ja
Publication of JP2003243576A5 publication Critical patent/JP2003243576A5/ja
Application granted granted Critical
Publication of JP3741274B2 publication Critical patent/JP3741274B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2002036466A 2002-02-14 2002-02-14 半導体装置 Expired - Lifetime JP3741274B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002036466A JP3741274B2 (ja) 2002-02-14 2002-02-14 半導体装置
US10/366,347 US6661101B2 (en) 2002-02-14 2003-02-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002036466A JP3741274B2 (ja) 2002-02-14 2002-02-14 半導体装置

Publications (3)

Publication Number Publication Date
JP2003243576A JP2003243576A (ja) 2003-08-29
JP2003243576A5 true JP2003243576A5 (https=) 2005-07-07
JP3741274B2 JP3741274B2 (ja) 2006-02-01

Family

ID=27655039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002036466A Expired - Lifetime JP3741274B2 (ja) 2002-02-14 2002-02-14 半導体装置

Country Status (2)

Country Link
US (1) US6661101B2 (https=)
JP (1) JP3741274B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6847123B2 (en) * 2002-04-02 2005-01-25 Lsi Logic Corporation Vertically staggered bondpad array
US7303113B2 (en) * 2003-11-28 2007-12-04 International Business Machines Corporation Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
US20060175712A1 (en) * 2005-02-10 2006-08-10 Microbonds, Inc. High performance IC package and method
US20070145607A1 (en) * 2005-12-28 2007-06-28 Mathew Ranjan J System to wirebond power signals to flip-chip core
US7638863B2 (en) * 2006-08-31 2009-12-29 Semiconductor Components Industries, Llc Semiconductor package and method therefor
WO2008132814A1 (ja) * 2007-04-18 2008-11-06 Panasonic Corporation 部品内蔵基板と、これを用いた電子モジュール及び電子機器
US7825527B2 (en) * 2008-06-13 2010-11-02 Altera Corporation Return loss techniques in wirebond packages for high-speed data communications
US9515032B1 (en) 2015-08-13 2016-12-06 Win Semiconductors Corp. High-frequency package
US11152326B2 (en) 2018-10-30 2021-10-19 Stmicroelectronics, Inc. Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
US10978419B1 (en) * 2019-10-14 2021-04-13 Nanya Technology Corporation Semiconductor package and manufacturing method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472455B2 (ja) * 1997-09-12 2003-12-02 沖電気工業株式会社 半導体集積回路装置及びそのパッケージ構造

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