JP2003229483A5 - - Google Patents
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- Publication number
- JP2003229483A5 JP2003229483A5 JP2002023995A JP2002023995A JP2003229483A5 JP 2003229483 A5 JP2003229483 A5 JP 2003229483A5 JP 2002023995 A JP2002023995 A JP 2002023995A JP 2002023995 A JP2002023995 A JP 2002023995A JP 2003229483 A5 JP2003229483 A5 JP 2003229483A5
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- Japan
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002023995A JP3952271B2 (ja) | 2002-01-31 | 2002-01-31 | 半導体装置及びその製造方法 |
US10/224,434 US7495309B2 (en) | 2002-01-31 | 2002-08-21 | Semiconductor device and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002023995A JP3952271B2 (ja) | 2002-01-31 | 2002-01-31 | 半導体装置及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003229483A JP2003229483A (ja) | 2003-08-15 |
JP2003229483A5 true JP2003229483A5 (ja) | 2005-07-21 |
JP3952271B2 JP3952271B2 (ja) | 2007-08-01 |
Family
ID=27606424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002023995A Expired - Fee Related JP3952271B2 (ja) | 2002-01-31 | 2002-01-31 | 半導体装置及びその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7495309B2 (ja) |
JP (1) | JP3952271B2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100442868B1 (ko) * | 2002-01-23 | 2004-08-02 | 삼성전자주식회사 | 반도체 소자의 퓨즈 형성방법 |
KR100519799B1 (ko) * | 2004-03-25 | 2005-10-10 | 삼성전자주식회사 | 반도체 소자의 퓨즈영역 및 그 제조방법 |
KR100534102B1 (ko) * | 2004-04-21 | 2005-12-06 | 삼성전자주식회사 | 반도체 기억소자의 퓨즈 영역들 및 그 제조방법들 |
JP2007081152A (ja) * | 2005-09-14 | 2007-03-29 | Renesas Technology Corp | 半導体装置 |
JP4830455B2 (ja) * | 2005-11-10 | 2011-12-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7651893B2 (en) * | 2005-12-27 | 2010-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal electrical fuse structure |
US7491585B2 (en) * | 2006-10-19 | 2009-02-17 | International Business Machines Corporation | Electrical fuse and method of making |
JP5127251B2 (ja) * | 2007-02-01 | 2013-01-23 | パナソニック株式会社 | 半導体装置の製造方法 |
DE102008054073A1 (de) * | 2008-10-31 | 2010-05-12 | Advanced Micro Devices, Inc., Sunnyvale | Halbleiterbauelement mit elektronischen Sicherungen mit erhöhter Programmiereffizienz |
KR20110065658A (ko) * | 2009-12-10 | 2011-06-16 | 주식회사 하이닉스반도체 | 반도체 소자의 퓨즈 및 그의 형성 방법 |
US8952486B2 (en) * | 2011-04-13 | 2015-02-10 | International Business Machines Corporation | Electrical fuse and method of making the same |
JP5547779B2 (ja) * | 2012-08-13 | 2014-07-16 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US9859209B2 (en) | 2016-03-28 | 2018-01-02 | International Business Machines Corporation | Advanced e-Fuse structure with enhanced electromigration fuse element |
US9893012B2 (en) | 2016-03-28 | 2018-02-13 | International Business Machines Corporation | Advanced e-fuse structure with hybrid metal controlled microstructure |
US10032716B2 (en) | 2016-03-28 | 2018-07-24 | International Business Machines Corporation | Advanced E-fuse structure with controlled microstructure |
KR102580702B1 (ko) * | 2018-02-22 | 2023-09-20 | 삼성전자주식회사 | 습기 유도 구조를 포함하는 전자 장치 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2839636B2 (ja) | 1990-05-07 | 1998-12-16 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP3186745B2 (ja) | 1990-08-09 | 2001-07-11 | セイコーエプソン株式会社 | 半導体装置 |
SE505448C2 (sv) * | 1993-05-28 | 1997-09-01 | Ericsson Telefon Ab L M | Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring |
JP3568562B2 (ja) | 1993-09-08 | 2004-09-22 | 富士通株式会社 | ヒューズ回路及び半導体記憶装置 |
JPH11154706A (ja) | 1997-11-20 | 1999-06-08 | Mitsubishi Electric Corp | 半導体装置 |
JPH11224900A (ja) | 1998-02-05 | 1999-08-17 | Toshiba Corp | 半導体装置及びその製造方法 |
US6147546A (en) | 1998-03-11 | 2000-11-14 | International Business Machines Corporation | Zero volt/zero current fuse arrangement |
JPH11284074A (ja) | 1998-03-30 | 1999-10-15 | Texas Instr Japan Ltd | 半導体デバイス用フューズ |
US6259146B1 (en) * | 1998-07-17 | 2001-07-10 | Lsi Logic Corporation | Self-aligned fuse structure and method with heat sink |
US6335229B1 (en) * | 1999-10-13 | 2002-01-01 | International Business Machines Corporation | Inductive fuse for semiconductor device |
JP2001298093A (ja) | 2000-04-18 | 2001-10-26 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2003017570A (ja) * | 2001-07-02 | 2003-01-17 | Fujitsu Ltd | 半導体装置及びその製造方法 |
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2002
- 2002-01-31 JP JP2002023995A patent/JP3952271B2/ja not_active Expired - Fee Related
- 2002-08-21 US US10/224,434 patent/US7495309B2/en not_active Expired - Fee Related