JP2003208950A - 厚膜伝送線に接続する同軸rfコネクタのシールドされたアタッチメント - Google Patents

厚膜伝送線に接続する同軸rfコネクタのシールドされたアタッチメント

Info

Publication number
JP2003208950A
JP2003208950A JP2002313965A JP2002313965A JP2003208950A JP 2003208950 A JP2003208950 A JP 2003208950A JP 2002313965 A JP2002313965 A JP 2002313965A JP 2002313965 A JP2002313965 A JP 2002313965A JP 2003208950 A JP2003208950 A JP 2003208950A
Authority
JP
Japan
Prior art keywords
transmission line
connector
quasi
coaxial
coaxial transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002313965A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003208950A5 (enExample
Inventor
Lewis R Dove
ルイス・アール・ダブ
Marving G Wong
マービン・ジー・ワン
John F Casey
ジョン・エフ・ケイシー
Wesley C Whiteley
ウェズリー・シー・ホワイトリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2003208950A publication Critical patent/JP2003208950A/ja
Publication of JP2003208950A5 publication Critical patent/JP2003208950A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515Connection to a rigid planar substrate, e.g. printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
JP2002313965A 2001-10-29 2002-10-29 厚膜伝送線に接続する同軸rfコネクタのシールドされたアタッチメント Pending JP2003208950A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/016,285 US6457979B1 (en) 2001-10-29 2001-10-29 Shielded attachment of coaxial RF connector to thick film integrally shielded transmission line on a substrate
US10/016285 2001-10-29

Publications (2)

Publication Number Publication Date
JP2003208950A true JP2003208950A (ja) 2003-07-25
JP2003208950A5 JP2003208950A5 (enExample) 2005-12-15

Family

ID=21776337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002313965A Pending JP2003208950A (ja) 2001-10-29 2002-10-29 厚膜伝送線に接続する同軸rfコネクタのシールドされたアタッチメント

Country Status (4)

Country Link
US (1) US6457979B1 (enExample)
JP (1) JP2003208950A (enExample)
KR (1) KR20030035975A (enExample)
DE (1) DE10233647A1 (enExample)

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JP2014096250A (ja) * 2012-11-08 2014-05-22 Mitsubishi Electric Corp 同軸コネクタおよびその基板接続構造
JP2014107733A (ja) * 2012-11-28 2014-06-09 Mitsubishi Electric Corp 同軸コネクタおよびその基板接続構造
DE112017007001T5 (de) 2017-03-08 2019-10-24 Mitsubishi Electric Corporation Basisplatinenmodul
WO2020095783A1 (ja) 2018-11-06 2020-05-14 Agc株式会社 同軸コネクタ及び同軸コネクタ付き基板
JP6994814B1 (ja) 2020-07-02 2022-01-14 アンリツ株式会社 エンドランチコネクタ及び空洞共振抑制方法

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US7022251B2 (en) * 2003-06-19 2006-04-04 Agilent Technologies, Inc. Methods for forming a conductor on a dielectric
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US6953698B2 (en) * 2003-06-19 2005-10-11 Agilent Technologies, Inc. Methods for making microwave circuits
US20050156693A1 (en) * 2004-01-20 2005-07-21 Dove Lewis R. Quasi-coax transmission lines
US20050184834A1 (en) * 2004-02-20 2005-08-25 Dove Lewis R. Methods and apparatus for coupling first and second microwave modules
US7014784B2 (en) * 2004-03-03 2006-03-21 Agilent Technologies, Inc. Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics
US6995329B2 (en) 2004-03-11 2006-02-07 Agilent Technologies, Inc. Switch, with lid mounted on a thickfilm dielectric
US7019236B2 (en) * 2004-03-11 2006-03-28 Agilent Technologies, Inc. Switch with lid
US7344381B2 (en) * 2004-04-29 2008-03-18 Emerson Network Power Connectivity Solutions, Inc. High frequency edge mount connector
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US20060086703A1 (en) * 2004-08-18 2006-04-27 Ling Liu System and method for singulating a substrate
US20070054510A1 (en) * 2005-09-02 2007-03-08 Russell Price System and method for shielded coaxial cable attachment
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US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
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US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
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EP2731783A4 (en) 2011-07-13 2016-03-09 Nuvotronics Llc METHOD FOR PRODUCING ELECTRONIC AND MECHANICAL STRUCTURES
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
CN103647127B (zh) * 2013-12-09 2017-02-01 上海贝尔股份有限公司 用于将同轴电缆耦接至带状线的连接器
JP6535347B2 (ja) 2014-01-17 2019-06-26 ヌボトロニクス、インク. ウエハースケールのテスト・インターフェース・ユニット:高速および高密度の混合信号インターコネクトおよびコンタクタのための低損失および高絶縁性の装置および方法
CN104269679B (zh) * 2014-08-18 2017-03-15 海信集团有限公司 一种射频端子
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
WO2016094129A1 (en) 2014-12-03 2016-06-16 Nuvotronics, Inc. Systems and methods for manufacturing stacked circuits and transmission lines
FR3029702B1 (fr) * 2014-12-03 2016-12-09 Sagemcom Broadband Sas Connecteur coaxial integre a un blindage et carte electronique equipee d'un tel connecteur
US10727391B2 (en) 2017-09-29 2020-07-28 International Business Machines Corporation Bump bonded cryogenic chip carrier
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
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US10709011B2 (en) * 2018-01-31 2020-07-07 Raytheon Company Radio frequency (RF) shielding structure for RF connector to microwave transmission interconnect regions and methods for manufacturing such RF shielding structure
DE102018109364B4 (de) * 2018-04-19 2019-12-12 Automotive Lighting Reutlingen Gmbh Koaxial-Steckverbinder
EP3996201B1 (en) * 2019-07-03 2025-05-14 Kabushiki Kaisha Toshiba Coaxial microstrip line conversion circuit
KR102339092B1 (ko) * 2020-03-13 2021-12-14 주식회사 센서뷰 회로기판의 측면에 결합되는 커넥터 조립체

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096250A (ja) * 2012-11-08 2014-05-22 Mitsubishi Electric Corp 同軸コネクタおよびその基板接続構造
JP2014107733A (ja) * 2012-11-28 2014-06-09 Mitsubishi Electric Corp 同軸コネクタおよびその基板接続構造
DE112017007001T5 (de) 2017-03-08 2019-10-24 Mitsubishi Electric Corporation Basisplatinenmodul
WO2020095783A1 (ja) 2018-11-06 2020-05-14 Agc株式会社 同軸コネクタ及び同軸コネクタ付き基板
KR20210087933A (ko) 2018-11-06 2021-07-13 에이지씨 가부시키가이샤 동축 커넥터 및 동축 커넥터를 갖는 기판
US11967792B2 (en) 2018-11-06 2024-04-23 AGC Inc. Coaxial connector and substrate with coaxial connector
JP6994814B1 (ja) 2020-07-02 2022-01-14 アンリツ株式会社 エンドランチコネクタ及び空洞共振抑制方法
JP2022024220A (ja) * 2020-07-02 2022-02-09 アンリツ株式会社 エンドランチコネクタ及び空洞共振抑制方法

Also Published As

Publication number Publication date
DE10233647A1 (de) 2003-05-08
US6457979B1 (en) 2002-10-01
KR20030035975A (ko) 2003-05-09

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