JP2003206403A5 - - Google Patents

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Publication number
JP2003206403A5
JP2003206403A5 JP2002333272A JP2002333272A JP2003206403A5 JP 2003206403 A5 JP2003206403 A5 JP 2003206403A5 JP 2002333272 A JP2002333272 A JP 2002333272A JP 2002333272 A JP2002333272 A JP 2002333272A JP 2003206403 A5 JP2003206403 A5 JP 2003206403A5
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JP
Japan
Prior art keywords
aryl
alkyl
hydrogen
formula
integer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002333272A
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English (en)
Japanese (ja)
Other versions
JP2003206403A (ja
JP4903972B2 (ja
Filing date
Publication date
Priority claimed from US10/194,851 external-priority patent/US6852367B2/en
Application filed filed Critical
Publication of JP2003206403A publication Critical patent/JP2003206403A/ja
Publication of JP2003206403A5 publication Critical patent/JP2003206403A5/ja
Application granted granted Critical
Publication of JP4903972B2 publication Critical patent/JP4903972B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002333272A 2001-11-20 2002-11-18 安定組成物 Expired - Fee Related JP4903972B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US33191101P 2001-11-20 2001-11-20
US60/331911 2001-11-20
US10/194,851 US6852367B2 (en) 2001-11-20 2002-07-12 Stable composition
US10/194851 2002-07-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010175931A Division JP2010261049A (ja) 2001-11-20 2010-08-05 安定組成物

Publications (3)

Publication Number Publication Date
JP2003206403A JP2003206403A (ja) 2003-07-22
JP2003206403A5 true JP2003206403A5 (https=) 2009-05-21
JP4903972B2 JP4903972B2 (ja) 2012-03-28

Family

ID=26890462

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002333272A Expired - Fee Related JP4903972B2 (ja) 2001-11-20 2002-11-18 安定組成物
JP2010175931A Pending JP2010261049A (ja) 2001-11-20 2010-08-05 安定組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010175931A Pending JP2010261049A (ja) 2001-11-20 2010-08-05 安定組成物

Country Status (6)

Country Link
US (1) US6852367B2 (https=)
EP (1) EP1312649B1 (https=)
JP (2) JP4903972B2 (https=)
KR (1) KR100995550B1 (https=)
DE (1) DE60215601T2 (https=)
TW (1) TWI279421B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496354B1 (ko) * 2002-03-27 2005-06-20 서울산업대학교 산학협력단 생분해성 고분자 지지체층을 포함하는 하이브리드인공혈관 및 그의 제조 방법
US7138185B2 (en) * 2002-07-05 2006-11-21 Fuji Photo Film Co., Ltd. Anti-reflection film, polarizing plate and display device
JP4409515B2 (ja) * 2003-04-09 2010-02-03 エルジー・ケム・リミテッド 絶縁膜形成用コーティング組成物、その組成物を使用した低誘電絶縁膜の製造方法、その組成物より製造される半導体素子用低誘電絶縁膜およびその絶縁膜からなる半導体素子
US20050089642A1 (en) * 2003-10-28 2005-04-28 Rohm And Haas Electronic Materials, L.L.C. Dielectric materials preparation
JP2005133060A (ja) * 2003-10-29 2005-05-26 Rohm & Haas Electronic Materials Llc 多孔性材料
JP4894153B2 (ja) * 2005-03-23 2012-03-14 株式会社アルバック 多孔質膜の前駆体組成物及びその調製方法、多孔質膜及びその作製方法、並びに半導体装置
DE602007000498D1 (de) * 2006-04-11 2009-03-12 Shinetsu Chemical Co Siliziumhaltige, folienbildende Zusammensetzung, siliziumhaltige Folie, siliziumhaltiges, folientragendes Substrat und Strukturierungsverfahren
JP5030478B2 (ja) * 2006-06-02 2012-09-19 株式会社アルバック 多孔質膜の前駆体組成物及びその調製方法、多孔質膜及びその作製方法、並びに半導体装置
TWI434891B (zh) * 2007-02-22 2014-04-21 賽倫斯股份有限公司 積體電路用高矽含量矽氧烷聚合物
KR100894417B1 (ko) * 2007-09-06 2009-04-24 제일모직주식회사 갭 필 능력이 개선된 반도체 미세 갭 필용 유기실란계중합체 및 이를 이용한 반도체 미세 갭 필용 조성물
WO2009044960A1 (en) * 2007-10-02 2009-04-09 Cheil Industries Inc. Gap-filling composition with excellent shelf life by end-capping
EP2234929A1 (en) * 2007-12-14 2010-10-06 DSM IP Assets B.V. Sol-gel process with a protected catalyst
JP2011040634A (ja) * 2009-08-13 2011-02-24 Ulvac Japan Ltd 多孔質膜の前駆体組成物、多孔質膜及びその作製方法、並びに半導体装置
US8648125B2 (en) 2009-12-04 2014-02-11 Dow Corning Corporation Stabilization of silsesquioxane resins
JP2011165804A (ja) * 2010-02-08 2011-08-25 Fujifilm Corp 半導体装置および半導体素子用基板の製造方法
EP2355141A3 (en) * 2010-02-08 2017-09-20 Fujifilm Corporation Semiconductor device, method for producing the semiconductor device, substrate for semiconductor element and method for producing the substrate
JP2015189856A (ja) * 2014-03-28 2015-11-02 株式会社Adeka ケイ素含有組成物
JPWO2017217175A1 (ja) * 2016-06-17 2018-11-01 東レ・ファインケミカル株式会社 シリコーン重合体組成物

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GB1115051A (en) * 1964-05-27 1968-05-22 Owens Illinois Inc Siloxane resins
US3909424A (en) * 1974-06-24 1975-09-30 Dow Corning Lubricant compositions
US3986997A (en) * 1974-06-25 1976-10-19 Dow Corning Corporation Pigment-free coating compositions
US4177175A (en) * 1977-12-23 1979-12-04 Dow Corning Corporation Organothiol-containing siloxane resins as adhesion promoters for siloxane resins
US4324712A (en) * 1978-11-30 1982-04-13 General Electric Company Silicone resin coating composition
US4223121A (en) * 1978-12-04 1980-09-16 Owens-Illinois, Inc. Organopolysiloxane resins of increased hardness
US4349609A (en) * 1979-06-21 1982-09-14 Fujitsu Limited Electronic device having multilayer wiring structure
JP2624254B2 (ja) * 1987-05-22 1997-06-25 東京応化工業株式会社 シリカ系被膜の膜質改善方法
TW492989B (en) * 1993-03-19 2002-07-01 Dow Corning Stabilization of hydrogen silsesquioxane resin solutions
US5895794A (en) * 1993-08-30 1999-04-20 Dow Corning Corporation Shelf stable cross-linked emulsions with optimum consistency and handling without the use of thickeners
DE19515540A1 (de) * 1995-04-27 1996-10-31 Wacker Chemie Gmbh Stabilisierung von reaktiven Organopolysiloxanharzen
KR19980015230A (ko) * 1996-08-20 1998-05-25 이웅열 압출형 도포장치
US6020410A (en) * 1996-10-29 2000-02-01 Alliedsignal Inc. Stable solution of a silsesquioxane or siloxane resin and a silicone solvent
US5895263A (en) * 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
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JP3812104B2 (ja) * 1997-12-02 2006-08-23 Ｊｓｒ株式会社 膜形成用組成物
US6231989B1 (en) * 1998-11-20 2001-05-15 Dow Corning Corporation Method of forming coatings
JP4305587B2 (ja) * 1999-04-27 2009-07-29 Ｊｓｒ株式会社 半導体装置用の層間絶縁膜形成用材料
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