JP2003205428A - 電解加工装置及び方法 - Google Patents
電解加工装置及び方法Info
- Publication number
- JP2003205428A JP2003205428A JP2002001737A JP2002001737A JP2003205428A JP 2003205428 A JP2003205428 A JP 2003205428A JP 2002001737 A JP2002001737 A JP 2002001737A JP 2002001737 A JP2002001737 A JP 2002001737A JP 2003205428 A JP2003205428 A JP 2003205428A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- machining
- processing
- workpiece
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 title claims abstract description 119
- 238000000034 method Methods 0.000 title claims description 22
- 239000000126 substance Substances 0.000 title abstract description 12
- 239000012530 fluid Substances 0.000 claims abstract description 29
- 238000003672 processing method Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 description 103
- 150000002500 ions Chemical class 0.000 description 55
- 229910021642 ultra pure water Inorganic materials 0.000 description 36
- 239000012498 ultrapure water Substances 0.000 description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 35
- 239000000463 material Substances 0.000 description 27
- 239000010949 copper Substances 0.000 description 26
- 229910052802 copper Inorganic materials 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- -1 hydroxide ions Chemical class 0.000 description 16
- 238000005342 ion exchange Methods 0.000 description 15
- 238000005341 cation exchange Methods 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- 238000010559 graft polymerization reaction Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 239000002648 laminated material Substances 0.000 description 9
- 238000005349 anion exchange Methods 0.000 description 8
- 230000002378 acidificating effect Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 239000004745 nonwoven fabric Substances 0.000 description 7
- 238000005498 polishing Methods 0.000 description 7
- 239000008151 electrolyte solution Substances 0.000 description 6
- 230000003993 interaction Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000010494 dissociation reaction Methods 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 208000018459 dissociative disease Diseases 0.000 description 3
- 230000005251 gamma ray Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 125000000542 sulfonic acid group Chemical group 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005593 dissociations Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 101000905241 Mus musculus Heart- and neural crest derivatives-expressed protein 1 Proteins 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- MNCGMVDMOKPCSQ-UHFFFAOYSA-M sodium;2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=CC1=CC=CC=C1 MNCGMVDMOKPCSQ-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
- B23H3/08—Working media
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002001737A JP2003205428A (ja) | 2002-01-08 | 2002-01-08 | 電解加工装置及び方法 |
| US10/500,576 US20050115838A1 (en) | 2002-01-08 | 2003-01-07 | Electrolytic processing apparatus and method |
| TW092100219A TWI271246B (en) | 2002-01-08 | 2003-01-07 | Electrolytic processing apparatus and method |
| PCT/JP2003/000038 WO2003057948A1 (en) | 2002-01-08 | 2003-01-07 | Electrolytic processing apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002001737A JP2003205428A (ja) | 2002-01-08 | 2002-01-08 | 電解加工装置及び方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003205428A true JP2003205428A (ja) | 2003-07-22 |
| JP2003205428A5 JP2003205428A5 (enExample) | 2005-08-04 |
Family
ID=19190647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002001737A Pending JP2003205428A (ja) | 2002-01-08 | 2002-01-08 | 電解加工装置及び方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20050115838A1 (enExample) |
| JP (1) | JP2003205428A (enExample) |
| TW (1) | TWI271246B (enExample) |
| WO (1) | WO2003057948A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025518863A (ja) * | 2022-06-06 | 2025-06-19 | アプライド マテリアルズ インコーポレイテッド | 上向きウエハ電気化学平坦化装置 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050051432A1 (en) * | 2001-12-13 | 2005-03-10 | Mitsuhiko Shirakashi | Electrolytic processing apparatus and method |
| DE102006062031B3 (de) * | 2006-12-29 | 2008-06-19 | Advanced Micro Devices, Inc., Sunnyvale | System zum Antreiben und Steuern einer bewegbaren Elektrodenanordnung in einer elektro-chemischen Prozessanlage |
| DE102006062037B4 (de) * | 2006-12-29 | 2013-10-31 | Advanced Micro Devices, Inc. | Verfahren zum Steuern eines elektrochemischen Ätzprozesses und System mit einer elektrochemischen Ätzanlage |
| MD3808G2 (ro) * | 2007-05-25 | 2009-08-31 | Институт Прикладной Физики Академии Наук Молдовы | Instalaţie de prelucrare electrică a metalelor |
| CN104400156B (zh) * | 2014-09-12 | 2017-10-10 | 南京航空航天大学 | 非圆截面电解切割电极及其装置 |
| CN106191946B (zh) * | 2016-08-08 | 2018-10-09 | 江苏大学 | 一种多电位吸液电沉积3d打印的装置和方法 |
| CN108385158A (zh) * | 2018-03-16 | 2018-08-10 | 江西宏业铜箔有限公司 | 一种高延低峰值超薄铜箔的光面微蚀处理工艺及设备 |
| TWI720548B (zh) * | 2019-07-17 | 2021-03-01 | 逢甲大學 | 變脈寬定電流控制之電化學加工方法及其裝置 |
| TWI742663B (zh) * | 2020-05-15 | 2021-10-11 | 國立臺灣師範大學 | 電解加工設備及其方法 |
| WO2024182485A1 (en) * | 2023-02-28 | 2024-09-06 | Illinois Tool Works Inc. | Systems and fixtures for electrode connections |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5149405A (en) * | 1991-05-28 | 1992-09-22 | Lehr Precision Inc. | Four-axis ECM machine and method of operation |
| JP3837783B2 (ja) * | 1996-08-12 | 2006-10-25 | 森 勇蔵 | 超純水中の水酸基による加工方法 |
| US6652658B1 (en) * | 1998-12-07 | 2003-11-25 | Japan Science And Technology Corporation | Method for machining/cleaning by hydroxide ion in ultrapure water |
| JP2001064799A (ja) * | 1999-08-27 | 2001-03-13 | Yuzo Mori | 電解加工方法及び装置 |
| JP4513145B2 (ja) * | 1999-09-07 | 2010-07-28 | ソニー株式会社 | 半導体装置の製造方法および研磨方法 |
| JP4141114B2 (ja) * | 2000-07-05 | 2008-08-27 | 株式会社荏原製作所 | 電解加工方法及び装置 |
| US7101465B2 (en) * | 2001-06-18 | 2006-09-05 | Ebara Corporation | Electrolytic processing device and substrate processing apparatus |
| US7638030B2 (en) * | 2001-06-18 | 2009-12-29 | Ebara Corporation | Electrolytic processing apparatus and electrolytic processing method |
| JP4043234B2 (ja) * | 2001-06-18 | 2008-02-06 | 株式会社荏原製作所 | 電解加工装置及び基板処理装置 |
-
2002
- 2002-01-08 JP JP2002001737A patent/JP2003205428A/ja active Pending
-
2003
- 2003-01-07 TW TW092100219A patent/TWI271246B/zh not_active IP Right Cessation
- 2003-01-07 US US10/500,576 patent/US20050115838A1/en not_active Abandoned
- 2003-01-07 WO PCT/JP2003/000038 patent/WO2003057948A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025518863A (ja) * | 2022-06-06 | 2025-06-19 | アプライド マテリアルズ インコーポレイテッド | 上向きウエハ電気化学平坦化装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI271246B (en) | 2007-01-21 |
| WO2003057948A1 (en) | 2003-07-17 |
| TW200301717A (en) | 2003-07-16 |
| US20050115838A1 (en) | 2005-06-02 |
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| A521 | Written amendment |
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| A621 | Written request for application examination |
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