JP2003205428A5 - - Google Patents

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Publication number
JP2003205428A5
JP2003205428A5 JP2002001737A JP2002001737A JP2003205428A5 JP 2003205428 A5 JP2003205428 A5 JP 2003205428A5 JP 2002001737 A JP2002001737 A JP 2002001737A JP 2002001737 A JP2002001737 A JP 2002001737A JP 2003205428 A5 JP2003205428 A5 JP 2003205428A5
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JP
Japan
Prior art keywords
electrode
workpiece
numerical control
machining
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002001737A
Other languages
English (en)
Japanese (ja)
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JP2003205428A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002001737A priority Critical patent/JP2003205428A/ja
Priority claimed from JP2002001737A external-priority patent/JP2003205428A/ja
Priority to US10/500,576 priority patent/US20050115838A1/en
Priority to TW092100219A priority patent/TWI271246B/zh
Priority to PCT/JP2003/000038 priority patent/WO2003057948A1/en
Publication of JP2003205428A publication Critical patent/JP2003205428A/ja
Publication of JP2003205428A5 publication Critical patent/JP2003205428A5/ja
Pending legal-status Critical Current

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JP2002001737A 2002-01-08 2002-01-08 電解加工装置及び方法 Pending JP2003205428A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002001737A JP2003205428A (ja) 2002-01-08 2002-01-08 電解加工装置及び方法
US10/500,576 US20050115838A1 (en) 2002-01-08 2003-01-07 Electrolytic processing apparatus and method
TW092100219A TWI271246B (en) 2002-01-08 2003-01-07 Electrolytic processing apparatus and method
PCT/JP2003/000038 WO2003057948A1 (en) 2002-01-08 2003-01-07 Electrolytic processing apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002001737A JP2003205428A (ja) 2002-01-08 2002-01-08 電解加工装置及び方法

Publications (2)

Publication Number Publication Date
JP2003205428A JP2003205428A (ja) 2003-07-22
JP2003205428A5 true JP2003205428A5 (enExample) 2005-08-04

Family

ID=19190647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002001737A Pending JP2003205428A (ja) 2002-01-08 2002-01-08 電解加工装置及び方法

Country Status (4)

Country Link
US (1) US20050115838A1 (enExample)
JP (1) JP2003205428A (enExample)
TW (1) TWI271246B (enExample)
WO (1) WO2003057948A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050051432A1 (en) * 2001-12-13 2005-03-10 Mitsuhiko Shirakashi Electrolytic processing apparatus and method
DE102006062031B3 (de) * 2006-12-29 2008-06-19 Advanced Micro Devices, Inc., Sunnyvale System zum Antreiben und Steuern einer bewegbaren Elektrodenanordnung in einer elektro-chemischen Prozessanlage
DE102006062037B4 (de) * 2006-12-29 2013-10-31 Advanced Micro Devices, Inc. Verfahren zum Steuern eines elektrochemischen Ätzprozesses und System mit einer elektrochemischen Ätzanlage
MD3808G2 (ro) * 2007-05-25 2009-08-31 Институт Прикладной Физики Академии Наук Молдовы Instalaţie de prelucrare electrică a metalelor
CN104400156B (zh) * 2014-09-12 2017-10-10 南京航空航天大学 非圆截面电解切割电极及其装置
CN106191946B (zh) * 2016-08-08 2018-10-09 江苏大学 一种多电位吸液电沉积3d打印的装置和方法
CN108385158A (zh) * 2018-03-16 2018-08-10 江西宏业铜箔有限公司 一种高延低峰值超薄铜箔的光面微蚀处理工艺及设备
TWI720548B (zh) * 2019-07-17 2021-03-01 逢甲大學 變脈寬定電流控制之電化學加工方法及其裝置
TWI742663B (zh) * 2020-05-15 2021-10-11 國立臺灣師範大學 電解加工設備及其方法
US12090600B2 (en) * 2022-06-06 2024-09-17 Applied Materials, Inc. Face-up wafer electrochemical planarization apparatus
WO2024182485A1 (en) * 2023-02-28 2024-09-06 Illinois Tool Works Inc. Systems and fixtures for electrode connections

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149405A (en) * 1991-05-28 1992-09-22 Lehr Precision Inc. Four-axis ECM machine and method of operation
JP3837783B2 (ja) * 1996-08-12 2006-10-25 森 勇蔵 超純水中の水酸基による加工方法
US6652658B1 (en) * 1998-12-07 2003-11-25 Japan Science And Technology Corporation Method for machining/cleaning by hydroxide ion in ultrapure water
JP2001064799A (ja) * 1999-08-27 2001-03-13 Yuzo Mori 電解加工方法及び装置
JP4513145B2 (ja) * 1999-09-07 2010-07-28 ソニー株式会社 半導体装置の製造方法および研磨方法
JP4141114B2 (ja) * 2000-07-05 2008-08-27 株式会社荏原製作所 電解加工方法及び装置
US7101465B2 (en) * 2001-06-18 2006-09-05 Ebara Corporation Electrolytic processing device and substrate processing apparatus
US7638030B2 (en) * 2001-06-18 2009-12-29 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
JP4043234B2 (ja) * 2001-06-18 2008-02-06 株式会社荏原製作所 電解加工装置及び基板処理装置

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