JP2003173989A - Ｉｃチップの製造方法 - Google Patents

Ｉｃチップの製造方法

Info

Publication number
JP2003173989A
JP2003173989A JP2001370759A JP2001370759A JP2003173989A JP 2003173989 A JP2003173989 A JP 2003173989A JP 2001370759 A JP2001370759 A JP 2001370759A JP 2001370759 A JP2001370759 A JP 2001370759A JP 2003173989 A JP2003173989 A JP 2003173989A
Authority
JP
Japan
Prior art keywords
wafer
layer
pressure
sensitive adhesive
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001370759A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003173989A5 (enExample
Inventor
Munehiro Hatakei
宗宏 畠井
Masateru Fukuoka
正輝 福岡
Satoshi Hayashi
聡史 林
Shigeru Danjo
滋 檀上
Yasuhiko Oyama
康彦 大山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2001370759A priority Critical patent/JP2003173989A/ja
Priority to EP02730861A priority patent/EP1413615A4/en
Priority to CNB028151534A priority patent/CN100336880C/zh
Priority to KR1020047001671A priority patent/KR100878971B1/ko
Priority to TW091111919A priority patent/TWI299353B/zh
Priority to PCT/JP2002/005407 priority patent/WO2003014242A1/ja
Priority to US10/485,462 priority patent/US20040248382A1/en
Publication of JP2003173989A publication Critical patent/JP2003173989A/ja
Priority to NO20040276A priority patent/NO20040276L/no
Publication of JP2003173989A5 publication Critical patent/JP2003173989A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
JP2001370759A 2001-08-03 2001-12-04 Ｉｃチップの製造方法 Withdrawn JP2003173989A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2001370759A JP2003173989A (ja) 2001-12-04 2001-12-04 Ｉｃチップの製造方法
EP02730861A EP1413615A4 (en) 2001-08-03 2002-06-03 DOUBLE ADHESIVE COATED STRIP AND INTEGRATED CIRCUIT CHIP PRODUCTION METHOD USING THE STRIP
CNB028151534A CN100336880C (zh) 2001-08-03 2002-06-03 两面胶以及使用它的ic芯片的制造方法
KR1020047001671A KR100878971B1 (ko) 2001-08-03 2002-06-03 양면 점착 테이프 및 이를 이용한 ｉｃ 칩의 제조 방법
TW091111919A TWI299353B (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
PCT/JP2002/005407 WO2003014242A1 (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
US10/485,462 US20040248382A1 (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
NO20040276A NO20040276L (no) 2001-08-03 2004-01-21 Dobbeltsidig trykkfolsom adhesivtap og fremgangsmate for tilvirkning av IC-brikke som bruker denne

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370759A JP2003173989A (ja) 2001-12-04 2001-12-04 Ｉｃチップの製造方法

Publications (2)

Publication Number Publication Date
JP2003173989A true JP2003173989A (ja) 2003-06-20
JP2003173989A5 JP2003173989A5 (enExample) 2004-12-24

Family

ID=19179930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001370759A Withdrawn JP2003173989A (ja) 2001-08-03 2001-12-04 Ｉｃチップの製造方法

Country Status (1)

Country Link
JP (1) JP2003173989A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006324292A (ja) * 2005-05-17 2006-11-30 Oki Electric Ind Co Ltd 半導体装置の製造方法、そのボンディングテープおよびその製造方法
CN100437926C (zh) * 2004-03-24 2008-11-26 日东电工株式会社 固定在加强半导体晶圆上的加强板的分离方法及其装置
WO2013088686A1 (ja) 2011-12-14 2013-06-20 三井化学株式会社 接着性樹脂組成物、積層体および自己剥離方法
WO2014192631A1 (ja) 2013-05-31 2014-12-04 三井化学東セロ株式会社 電子部材の剥離方法および積層体
CN109545652A (zh) * 2017-09-21 2019-03-29 达迈科技股份有限公司 用于柔性显示器的透明聚酰亚胺复合膜及其制造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437926C (zh) * 2004-03-24 2008-11-26 日东电工株式会社 固定在加强半导体晶圆上的加强板的分离方法及其装置
JP2006324292A (ja) * 2005-05-17 2006-11-30 Oki Electric Ind Co Ltd 半導体装置の製造方法、そのボンディングテープおよびその製造方法
WO2013088686A1 (ja) 2011-12-14 2013-06-20 三井化学株式会社 接着性樹脂組成物、積層体および自己剥離方法
KR20140101843A (ko) 2011-12-14 2014-08-20 미쓰이 가가쿠 토세로 가부시키가이샤 접착성 수지 조성물, 적층체 및 자기 박리 방법
US9611410B2 (en) 2011-12-14 2017-04-04 Mitsui Chemicals Tohcello, Inc. Adhesive resin composition, laminate, and self-stripping method
WO2014192631A1 (ja) 2013-05-31 2014-12-04 三井化学東セロ株式会社 電子部材の剥離方法および積層体
KR20150140801A (ko) 2013-05-31 2015-12-16 미쓰이 가가쿠 토세로 가부시키가이샤 전자 부재의 박리 방법 및 적층체
CN109545652A (zh) * 2017-09-21 2019-03-29 达迈科技股份有限公司 用于柔性显示器的透明聚酰亚胺复合膜及其制造方法

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