JP2003173989A5 - - Google Patents
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- Publication number
- JP2003173989A5 JP2003173989A5 JP2001370759A JP2001370759A JP2003173989A5 JP 2003173989 A5 JP2003173989 A5 JP 2003173989A5 JP 2001370759 A JP2001370759 A JP 2001370759A JP 2001370759 A JP2001370759 A JP 2001370759A JP 2003173989 A5 JP2003173989 A5 JP 2003173989A5
- Authority
- JP
- Japan
- Prior art keywords
- tape
- registered trademark
- series
- adwill
- particularly limited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002390 adhesive tape Substances 0.000 description 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001370759A JP2003173989A (ja) | 2001-12-04 | 2001-12-04 | Ｉｃチップの製造方法 |
| US10/485,462 US20040248382A1 (en) | 2001-08-03 | 2002-06-03 | Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
| TW091111919A TWI299353B (en) | 2001-08-03 | 2002-06-03 | Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
| KR1020047001671A KR100878971B1 (ko) | 2001-08-03 | 2002-06-03 | 양면 점착 테이프 및 이를 이용한 ｉｃ 칩의 제조 방법 |
| PCT/JP2002/005407 WO2003014242A1 (en) | 2001-08-03 | 2002-06-03 | Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
| EP02730861A EP1413615A4 (en) | 2001-08-03 | 2002-06-03 | DOUBLE-COATED ADHESIVE TAPE AND ITS USE IN MANUFACTURING AN IC-CHIP |
| CNB028151534A CN100336880C (zh) | 2001-08-03 | 2002-06-03 | 两面胶以及使用它的ic芯片的制造方法 |
| NO20040276A NO20040276L (no) | 2001-08-03 | 2004-01-21 | Dobbeltsidig trykkfolsom adhesivtap og fremgangsmate for tilvirkning av IC-brikke som bruker denne |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001370759A JP2003173989A (ja) | 2001-12-04 | 2001-12-04 | Ｉｃチップの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003173989A JP2003173989A (ja) | 2003-06-20 |
| JP2003173989A5 true JP2003173989A5 (enExample) | 2004-12-24 |
Family
ID=19179930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001370759A Withdrawn JP2003173989A (ja) | 2001-08-03 | 2001-12-04 | Ｉｃチップの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003173989A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4381860B2 (ja) * | 2004-03-24 | 2009-12-09 | 日東電工株式会社 | 補強半導体ウエハに固定された補強板の分離方法およびその装置 |
| JP4528668B2 (ja) * | 2005-05-17 | 2010-08-18 | Ｏｋｉセミコンダクタ株式会社 | 半導体装置の製造方法 |
| JP5788528B2 (ja) | 2011-12-14 | 2015-09-30 | 三井化学東セロ株式会社 | 接着性樹脂組成物、積層体および自己剥離方法 |
| WO2014192631A1 (ja) | 2013-05-31 | 2014-12-04 | 三井化学東セロ株式会社 | 電子部材の剥離方法および積層体 |
| CN109545652A (zh) * | 2017-09-21 | 2019-03-29 | 达迈科技股份有限公司 | 用于柔性显示器的透明聚酰亚胺复合膜及其制造方法 |
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2001
- 2001-12-04 JP JP2001370759A patent/JP2003173989A/ja not_active Withdrawn