JP2003173989A5 - - Google Patents
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- Publication number
- JP2003173989A5 JP2003173989A5 JP2001370759A JP2001370759A JP2003173989A5 JP 2003173989 A5 JP2003173989 A5 JP 2003173989A5 JP 2001370759 A JP2001370759 A JP 2001370759A JP 2001370759 A JP2001370759 A JP 2001370759A JP 2003173989 A5 JP2003173989 A5 JP 2003173989A5
- Authority
- JP
- Japan
- Prior art keywords
- tape
- registered trademark
- series
- adwill
- particularly limited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002390 adhesive tape Substances 0.000 description 1
Description
【0046】
上記ダイシングテープとしては特に限定されないが、公知の光硬化性粘着テープを用いることができ、例えば、Adwill(登録商標)D−シリーズや、日東電工社製のエレップホルダー(登録商標)UEシリーズ等のテープが挙げられる。[0046]
The dicing tape is not particularly limited, but a known photocurable adhesive tape can be used, for example, Adwill (registered trademark) D-series , Elep Holder (registered trademark) UE series manufactured by Nitto Denko Corporation, etc. The tape of
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001370759A JP2003173989A (en) | 2001-12-04 | 2001-12-04 | Method for manufacturing ic chip |
PCT/JP2002/005407 WO2003014242A1 (en) | 2001-08-03 | 2002-06-03 | Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
TW091111919A TWI299353B (en) | 2001-08-03 | 2002-06-03 | Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
EP02730861A EP1413615A4 (en) | 2001-08-03 | 2002-06-03 | Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
US10/485,462 US20040248382A1 (en) | 2001-08-03 | 2002-06-03 | Pressure sensitive adhesive double coated tape and method for producing ic chip using it |
KR1020047001671A KR100878971B1 (en) | 2001-08-03 | 2002-06-03 | Pressure Sensitive Adhesive Double Coated Tape and Method For Producing ?? Chip Using It |
CNB028151534A CN100336880C (en) | 2001-08-03 | 2002-06-03 | Pressure sensitive adhesive double coated tape and method for producing IC chip using it |
NO20040276A NO20040276L (en) | 2001-08-03 | 2004-01-21 | Double-sided pressure-sensitive adhesive tape and method for manufacturing IC chip using it |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001370759A JP2003173989A (en) | 2001-12-04 | 2001-12-04 | Method for manufacturing ic chip |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003173989A JP2003173989A (en) | 2003-06-20 |
JP2003173989A5 true JP2003173989A5 (en) | 2004-12-24 |
Family
ID=19179930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001370759A Withdrawn JP2003173989A (en) | 2001-08-03 | 2001-12-04 | Method for manufacturing ic chip |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003173989A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4381860B2 (en) * | 2004-03-24 | 2009-12-09 | 日東電工株式会社 | Method and apparatus for separating reinforcing plate fixed to reinforced semiconductor wafer |
JP4528668B2 (en) * | 2005-05-17 | 2010-08-18 | Okiセミコンダクタ株式会社 | Manufacturing method of semiconductor device |
MY170660A (en) | 2011-12-14 | 2019-08-26 | Mitsui Chemicals Tohcello Inc | Adhesive resin composition, laminate, and self-stripping method |
KR101772787B1 (en) | 2013-05-31 | 2017-08-29 | 미쓰이 가가쿠 토세로 가부시키가이샤 | Method of peeling electronic member and laminate |
CN109545652A (en) * | 2017-09-21 | 2019-03-29 | 达迈科技股份有限公司 | Clear polyimides composite membrane and its manufacturing method for flexible display |
-
2001
- 2001-12-04 JP JP2001370759A patent/JP2003173989A/en not_active Withdrawn
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