JP2003173989A5 - - Google Patents

Download PDF

Info

Publication number
JP2003173989A5
JP2003173989A5 JP2001370759A JP2001370759A JP2003173989A5 JP 2003173989 A5 JP2003173989 A5 JP 2003173989A5 JP 2001370759 A JP2001370759 A JP 2001370759A JP 2001370759 A JP2001370759 A JP 2001370759A JP 2003173989 A5 JP2003173989 A5 JP 2003173989A5
Authority
JP
Japan
Prior art keywords
tape
registered trademark
series
adwill
particularly limited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001370759A
Other languages
Japanese (ja)
Other versions
JP2003173989A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2001370759A priority Critical patent/JP2003173989A/en
Priority claimed from JP2001370759A external-priority patent/JP2003173989A/en
Priority to KR1020047001671A priority patent/KR100878971B1/en
Priority to EP02730861A priority patent/EP1413615A4/en
Priority to US10/485,462 priority patent/US20040248382A1/en
Priority to TW091111919A priority patent/TWI299353B/en
Priority to CNB028151534A priority patent/CN100336880C/en
Priority to PCT/JP2002/005407 priority patent/WO2003014242A1/en
Publication of JP2003173989A publication Critical patent/JP2003173989A/en
Priority to NO20040276A priority patent/NO20040276L/en
Publication of JP2003173989A5 publication Critical patent/JP2003173989A5/ja
Withdrawn legal-status Critical Current

Links

Description

【００４６】
上記ダイシングテープとしては特に限定されないが、公知の光硬化性粘着テープを用いることができ、例えば、Ａｄｗｉｌｌ（登録商標）Ｄ−シリーズや、日東電工社製のエレップホルダー（登録商標）ＵＥシリーズ等のテープが挙げられる。[0046]
The dicing tape is not particularly limited, but a known photocurable adhesive tape can be used, for example, Adwill (registered trademark) D-series , Elep Holder (registered trademark) UE series manufactured by Nitto Denko Corporation, etc. The tape of

JP2001370759A 2001-08-03 2001-12-04 Method for manufacturing ic chip Withdrawn JP2003173989A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2001370759A JP2003173989A (en) 2001-12-04 2001-12-04 Method for manufacturing ic chip
PCT/JP2002/005407 WO2003014242A1 (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
TW091111919A TWI299353B (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
EP02730861A EP1413615A4 (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
US10/485,462 US20040248382A1 (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing ic chip using it
KR1020047001671A KR100878971B1 (en) 2001-08-03 2002-06-03 Pressure Sensitive Adhesive Double Coated Tape and Method For Producing ?? Chip Using It
CNB028151534A CN100336880C (en) 2001-08-03 2002-06-03 Pressure sensitive adhesive double coated tape and method for producing IC chip using it
NO20040276A NO20040276L (en) 2001-08-03 2004-01-21 Double-sided pressure-sensitive adhesive tape and method for manufacturing IC chip using it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370759A JP2003173989A (en) 2001-12-04 2001-12-04 Method for manufacturing ic chip

Publications (2)

Publication Number Publication Date
JP2003173989A JP2003173989A (en) 2003-06-20
JP2003173989A5 true JP2003173989A5 (en) 2004-12-24

Family

ID=19179930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001370759A Withdrawn JP2003173989A (en) 2001-08-03 2001-12-04 Method for manufacturing ic chip

Country Status (1)

Country Link
JP (1) JP2003173989A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4381860B2 (en) * 2004-03-24 2009-12-09 日東電工株式会社 Method and apparatus for separating reinforcing plate fixed to reinforced semiconductor wafer
JP4528668B2 (en) * 2005-05-17 2010-08-18 Ｏｋｉセミコンダクタ株式会社 Manufacturing method of semiconductor device
MY170660A (en) 2011-12-14 2019-08-26 Mitsui Chemicals Tohcello Inc Adhesive resin composition, laminate, and self-stripping method
KR101772787B1 (en) 2013-05-31 2017-08-29 미쓰이 가가쿠 토세로 가부시키가이샤 Method of peeling electronic member and laminate
CN109545652A (en) * 2017-09-21 2019-03-29 达迈科技股份有限公司 Clear polyimides composite membrane and its manufacturing method for flexible display

Similar Documents

Publication Publication Date Title
JP2004538039A5 (en)
JP2004043642A5 (en)
CA2312493A1 (en) Novel suppository form comprising an acid-labile active compound
JP2002542342A5 (en)
WO2003036715A3 (en) Adhesive wafers for die attach application
JP2004532806A5 (en)
IT1302234B1 (en) PROCEDURE FOR THE MANUFACTURE OF A SEMICONDUCTOR DEVICE USING A MINUTE RESIST CONFIGURATION, AND DEVICE A
AU2002243735A1 (en) High performance silicon contact for flip chip
BR0209984A (en) Process for the preparation of prostaglandins and their analogues
DK1273051T3 (en) Piezoceramic bending transducer, as well as an application of the piezoceramic bending transducer
JP2003506545A5 (en)
CO5271735A1 (en) CRYSTAL FORM
JP2002373871A5 (en)
JP2003173989A5 (en)
JP2005532420A5 (en)
DK1330458T3 (en) N- (1,2,4-triazoloazinyl) thiophenesulfonamide compounds as herbicides
IT1319854B1 (en) PROCEDURE FOR THE MANUFACTURE OF A COMPRESSOR VALVE PLATE, VALVE PLATE OBTAINED WITH THE PROCEDURE, GROUP
JP2003209083A5 (en)
JP2004047722A5 (en)
JP2002540769A5 (en)
JP2003209070A5 (en)
JP2003171624A5 (en)
JP2005080553A5 (en)
WO2000055051A3 (en) Disk holder device and method
JP2001354766A5 (en)