JP2004047722A5 - - Google Patents

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Publication number
JP2004047722A5
JP2004047722A5 JP2002202990A JP2002202990A JP2004047722A5 JP 2004047722 A5 JP2004047722 A5 JP 2004047722A5 JP 2002202990 A JP2002202990 A JP 2002202990A JP 2002202990 A JP2002202990 A JP 2002202990A JP 2004047722 A5 JP2004047722 A5 JP 2004047722A5
Authority
JP
Japan
Prior art keywords
tape
registered trademark
series
adwill
particularly limited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002202990A
Other languages
Japanese (ja)
Other versions
JP2004047722A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002202990A priority Critical patent/JP2004047722A/en
Priority claimed from JP2002202990A external-priority patent/JP2004047722A/en
Publication of JP2004047722A publication Critical patent/JP2004047722A/en
Publication of JP2004047722A5 publication Critical patent/JP2004047722A5/ja
Withdrawn legal-status Critical Current

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Description

【0034】
上記ダイシングテープとしては特に限定されないが、公知の光硬化性粘着テープを用いることができ、例えば、Adwill(登録商標)D−シリーズや、日東電工社製のエレップホルダー(登録商標)UEシリーズ等のテープが挙げられる。
[0034]
The dicing tape is not particularly limited, but a known photocurable adhesive tape can be used, for example, Adwill (registered trademark) D-series , Elep Holder (registered trademark) UE series manufactured by Nitto Denko Corporation, etc. The tape of

JP2002202990A 2002-07-11 2002-07-11 Method for manufacturing integrated circuit chip Withdrawn JP2004047722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002202990A JP2004047722A (en) 2002-07-11 2002-07-11 Method for manufacturing integrated circuit chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002202990A JP2004047722A (en) 2002-07-11 2002-07-11 Method for manufacturing integrated circuit chip

Publications (2)

Publication Number Publication Date
JP2004047722A JP2004047722A (en) 2004-02-12
JP2004047722A5 true JP2004047722A5 (en) 2005-02-17

Family

ID=31709016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002202990A Withdrawn JP2004047722A (en) 2002-07-11 2002-07-11 Method for manufacturing integrated circuit chip

Country Status (1)

Country Link
JP (1) JP2004047722A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6016569B2 (en) * 2012-10-17 2016-10-26 株式会社ディスコ Method of peeling surface protection tape

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