JP2003129283A5 - - Google Patents

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Publication number
JP2003129283A5
JP2003129283A5 JP2001320090A JP2001320090A JP2003129283A5 JP 2003129283 A5 JP2003129283 A5 JP 2003129283A5 JP 2001320090 A JP2001320090 A JP 2001320090A JP 2001320090 A JP2001320090 A JP 2001320090A JP 2003129283 A5 JP2003129283 A5 JP 2003129283A5
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JP
Japan
Prior art keywords
plating
storage tank
tank
processing
permeate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001320090A
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English (en)
Japanese (ja)
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JP2003129283A (ja
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Publication date
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Priority to JP2001320090A priority Critical patent/JP2003129283A/ja
Priority claimed from JP2001320090A external-priority patent/JP2003129283A/ja
Publication of JP2003129283A publication Critical patent/JP2003129283A/ja
Publication of JP2003129283A5 publication Critical patent/JP2003129283A5/ja
Pending legal-status Critical Current

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JP2001320090A 2001-10-18 2001-10-18 メッキ処理装置及びそれを用いた半導体装置の製造方法 Pending JP2003129283A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001320090A JP2003129283A (ja) 2001-10-18 2001-10-18 メッキ処理装置及びそれを用いた半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001320090A JP2003129283A (ja) 2001-10-18 2001-10-18 メッキ処理装置及びそれを用いた半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2003129283A JP2003129283A (ja) 2003-05-08
JP2003129283A5 true JP2003129283A5 (enExample) 2005-06-09

Family

ID=19137529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001320090A Pending JP2003129283A (ja) 2001-10-18 2001-10-18 メッキ処理装置及びそれを用いた半導体装置の製造方法

Country Status (1)

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JP (1) JP2003129283A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4171368B2 (ja) * 2003-08-11 2008-10-22 株式会社ルネサステクノロジ 半導体装置の製造方法
US7615255B2 (en) * 2005-09-07 2009-11-10 Rohm And Haas Electronic Materials Llc Metal duplex method
KR100744417B1 (ko) 2006-08-11 2007-07-30 동부일렉트로닉스 주식회사 반도체 소자 제조 장치
US8962085B2 (en) 2009-06-17 2015-02-24 Novellus Systems, Inc. Wetting pretreatment for enhanced damascene metal filling
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
CN103866365A (zh) * 2012-12-11 2014-06-18 诺发系统公司 电镀填充真空电镀槽
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
CN104005077B (zh) * 2014-05-14 2016-11-09 上海交通大学 优化温度场分布的电镀装置及其电镀方法
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
JP2021123732A (ja) * 2020-02-03 2021-08-30 株式会社東設 鍍金方法及びその装置
JP7669916B2 (ja) * 2021-12-02 2025-04-30 トヨタ自動車株式会社 金属皮膜の成膜装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831460B2 (ja) * 1987-11-13 1996-03-27 富士通株式会社 メッキ装置
JPH0717334U (ja) * 1993-08-27 1995-03-28 三菱マテリアル株式会社 発泡性液体の気泡除去装置
JP3985065B2 (ja) * 1997-05-14 2007-10-03 忠弘 大見 多孔質シリコン基板の形成方法及び多孔質シリコン基板の形成装置
KR100804714B1 (ko) * 2000-03-17 2008-02-18 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 방법
JP2002363792A (ja) * 2001-06-01 2002-12-18 Tokyo Electron Ltd 液処理システム及び液処理方法

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