JP2003129283A - メッキ処理装置及びそれを用いた半導体装置の製造方法 - Google Patents

メッキ処理装置及びそれを用いた半導体装置の製造方法

Info

Publication number
JP2003129283A
JP2003129283A JP2001320090A JP2001320090A JP2003129283A JP 2003129283 A JP2003129283 A JP 2003129283A JP 2001320090 A JP2001320090 A JP 2001320090A JP 2001320090 A JP2001320090 A JP 2001320090A JP 2003129283 A JP2003129283 A JP 2003129283A
Authority
JP
Japan
Prior art keywords
plating
plating solution
tank
liquid
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001320090A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003129283A5 (enExample
Inventor
Takashi Yamagami
孝 山上
Kazuhiro Ozawa
和弘 小沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP2001320090A priority Critical patent/JP2003129283A/ja
Publication of JP2003129283A publication Critical patent/JP2003129283A/ja
Publication of JP2003129283A5 publication Critical patent/JP2003129283A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2001320090A 2001-10-18 2001-10-18 メッキ処理装置及びそれを用いた半導体装置の製造方法 Pending JP2003129283A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001320090A JP2003129283A (ja) 2001-10-18 2001-10-18 メッキ処理装置及びそれを用いた半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001320090A JP2003129283A (ja) 2001-10-18 2001-10-18 メッキ処理装置及びそれを用いた半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2003129283A true JP2003129283A (ja) 2003-05-08
JP2003129283A5 JP2003129283A5 (enExample) 2005-06-09

Family

ID=19137529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001320090A Pending JP2003129283A (ja) 2001-10-18 2001-10-18 メッキ処理装置及びそれを用いた半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2003129283A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064016A (ja) * 2003-08-11 2005-03-10 Renesas Technology Corp 半導体装置の製造方法
JP2007070730A (ja) * 2005-09-07 2007-03-22 Rohm & Haas Electronic Materials Llc 金属デュプレックス及び方法
KR100744417B1 (ko) 2006-08-11 2007-07-30 동부일렉트로닉스 주식회사 반도체 소자 제조 장치
CN103866365A (zh) * 2012-12-11 2014-06-18 诺发系统公司 电镀填充真空电镀槽
CN104005077A (zh) * 2014-05-14 2014-08-27 上海交通大学 优化温度场分布的电镀装置及其电镀方法
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9721800B2 (en) 2009-06-17 2017-08-01 Novellus Systems, Inc. Apparatus for wetting pretreatment for enhanced damascene metal filling
JP2021123732A (ja) * 2020-02-03 2021-08-30 株式会社東設 鍍金方法及びその装置
JP2023082465A (ja) * 2021-12-02 2023-06-14 トヨタ自動車株式会社 金属皮膜の成膜装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128547A (ja) * 1987-11-13 1989-05-22 Fujitsu Ltd メッキ装置
JPH0717334U (ja) * 1993-08-27 1995-03-28 三菱マテリアル株式会社 発泡性液体の気泡除去装置
JPH10312990A (ja) * 1997-05-14 1998-11-24 Tadahiro Omi 化学反応方法および化学反応装置
WO2001068952A1 (en) * 2000-03-17 2001-09-20 Ebara Corporation Method and apparatus for electroplating
JP2002363792A (ja) * 2001-06-01 2002-12-18 Tokyo Electron Ltd 液処理システム及び液処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128547A (ja) * 1987-11-13 1989-05-22 Fujitsu Ltd メッキ装置
JPH0717334U (ja) * 1993-08-27 1995-03-28 三菱マテリアル株式会社 発泡性液体の気泡除去装置
JPH10312990A (ja) * 1997-05-14 1998-11-24 Tadahiro Omi 化学反応方法および化学反応装置
WO2001068952A1 (en) * 2000-03-17 2001-09-20 Ebara Corporation Method and apparatus for electroplating
JP2002363792A (ja) * 2001-06-01 2002-12-18 Tokyo Electron Ltd 液処理システム及び液処理方法

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064016A (ja) * 2003-08-11 2005-03-10 Renesas Technology Corp 半導体装置の製造方法
JP2007070730A (ja) * 2005-09-07 2007-03-22 Rohm & Haas Electronic Materials Llc 金属デュプレックス及び方法
KR100744417B1 (ko) 2006-08-11 2007-07-30 동부일렉트로닉스 주식회사 반도체 소자 제조 장치
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US10840101B2 (en) 2009-06-17 2020-11-17 Novellus Systems, Inc. Wetting pretreatment for enhanced damascene metal filling
US10301738B2 (en) 2009-06-17 2019-05-28 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9721800B2 (en) 2009-06-17 2017-08-01 Novellus Systems, Inc. Apparatus for wetting pretreatment for enhanced damascene metal filling
US9828688B2 (en) 2009-06-17 2017-11-28 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9852913B2 (en) 2009-06-17 2017-12-26 Novellus Systems, Inc. Wetting pretreatment for enhanced damascene metal filling
CN103866365A (zh) * 2012-12-11 2014-06-18 诺发系统公司 电镀填充真空电镀槽
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US10128102B2 (en) 2013-02-20 2018-11-13 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
CN104005077A (zh) * 2014-05-14 2014-08-27 上海交通大学 优化温度场分布的电镀装置及其电镀方法
CN104005077B (zh) * 2014-05-14 2016-11-09 上海交通大学 优化温度场分布的电镀装置及其电镀方法
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
JP2021123732A (ja) * 2020-02-03 2021-08-30 株式会社東設 鍍金方法及びその装置
JP2023082465A (ja) * 2021-12-02 2023-06-14 トヨタ自動車株式会社 金属皮膜の成膜装置
JP7669916B2 (ja) 2021-12-02 2025-04-30 トヨタ自動車株式会社 金属皮膜の成膜装置

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