JP2003078075A5 - - Google Patents

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Publication number
JP2003078075A5
JP2003078075A5 JP2002203964A JP2002203964A JP2003078075A5 JP 2003078075 A5 JP2003078075 A5 JP 2003078075A5 JP 2002203964 A JP2002203964 A JP 2002203964A JP 2002203964 A JP2002203964 A JP 2002203964A JP 2003078075 A5 JP2003078075 A5 JP 2003078075A5
Authority
JP
Japan
Prior art keywords
electrical contact
dome
manufacturing
metal plating
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002203964A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003078075A (ja
JP4163458B2 (ja
Filing date
Publication date
Priority claimed from US09/917,093 external-priority patent/US6627092B2/en
Application filed filed Critical
Publication of JP2003078075A publication Critical patent/JP2003078075A/ja
Publication of JP2003078075A5 publication Critical patent/JP2003078075A5/ja
Application granted granted Critical
Publication of JP4163458B2 publication Critical patent/JP4163458B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002203964A 2001-07-27 2002-07-12 電気接点を製造するための方法 Expired - Fee Related JP4163458B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/917093 2001-07-27
US09/917,093 US6627092B2 (en) 2001-07-27 2001-07-27 Method for the fabrication of electrical contacts

Publications (3)

Publication Number Publication Date
JP2003078075A JP2003078075A (ja) 2003-03-14
JP2003078075A5 true JP2003078075A5 (enExample) 2005-04-21
JP4163458B2 JP4163458B2 (ja) 2008-10-08

Family

ID=25438336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002203964A Expired - Fee Related JP4163458B2 (ja) 2001-07-27 2002-07-12 電気接点を製造するための方法

Country Status (6)

Country Link
US (1) US6627092B2 (enExample)
JP (1) JP4163458B2 (enExample)
CN (1) CN1266759C (enExample)
DE (1) DE10231172A1 (enExample)
GB (1) GB2383188B (enExample)
SG (1) SG104332A1 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3950799B2 (ja) * 2003-01-28 2007-08-01 アルプス電気株式会社 接続装置
TW559328U (en) * 2003-03-25 2003-10-21 P Two Ind Inc Metal leaf spring structure
US7005751B2 (en) * 2003-04-10 2006-02-28 Formfactor, Inc. Layered microelectronic contact and method for fabricating same
US6948940B2 (en) * 2003-04-10 2005-09-27 Formfactor, Inc. Helical microelectronic contact and method for fabricating same
US6916181B2 (en) * 2003-06-11 2005-07-12 Neoconix, Inc. Remountable connector for land grid array packages
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US20050120553A1 (en) * 2003-12-08 2005-06-09 Brown Dirk D. Method for forming MEMS grid array connector
US20070020960A1 (en) * 2003-04-11 2007-01-25 Williams John D Contact grid array system
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7056131B1 (en) * 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US7597561B2 (en) 2003-04-11 2009-10-06 Neoconix, Inc. Method and system for batch forming spring elements in three dimensions
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US7628617B2 (en) 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
JP2004345286A (ja) * 2003-05-23 2004-12-09 Sony Corp 金型表面装飾方法及び金型
TWI343156B (en) * 2003-10-16 2011-06-01 Tyco Electronics Corp Conductive elastomeric contact system with anti-overstress columns
US6890185B1 (en) * 2003-11-03 2005-05-10 Kulicke & Soffa Interconnect, Inc. Multipath interconnect with meandering contact cantilevers
JP4520874B2 (ja) * 2004-02-06 2010-08-11 矢崎総業株式会社 雌端子及びコネクタ
US7137831B2 (en) * 2004-03-16 2006-11-21 Alps Electric Co., Ltd. Substrate having spiral contactors
US7025601B2 (en) * 2004-03-19 2006-04-11 Neoconix, Inc. Interposer and method for making same
US7347698B2 (en) 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
TWI309094B (en) 2004-03-19 2009-04-21 Neoconix Inc Electrical connector in a flexible host and method for fabricating the same
US7090503B2 (en) 2004-03-19 2006-08-15 Neoconix, Inc. Interposer with compliant pins
US7354276B2 (en) 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
JP2006049101A (ja) * 2004-08-05 2006-02-16 Molex Japan Co Ltd シート状コネクタとその製造方法
US7262495B2 (en) 2004-10-07 2007-08-28 Hewlett-Packard Development Company, L.P. 3D interconnect with protruding contacts
JP2006253580A (ja) * 2005-03-14 2006-09-21 Alps Electric Co Ltd 電子機能部品実装体及び電子機器
JP2006351327A (ja) * 2005-06-15 2006-12-28 Alps Electric Co Ltd 部材間の接続構造及びその製造方法、ならびに前記部材間の接続構造を備えた電子機器
US7331796B2 (en) * 2005-09-08 2008-02-19 International Business Machines Corporation Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
US7357644B2 (en) 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
KR20090057328A (ko) * 2006-09-26 2009-06-04 알프스 덴키 가부시키가이샤 탄성 접촉자 및 이것을 이용한 금속단자 간의 접합방법
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
DE102015004151B4 (de) * 2015-03-31 2022-01-27 Feinmetall Gmbh Verfahren zur Herstellung einer Federkontaktstift-Anordnung mit mehreren Federkontaktstiften
US12248003B2 (en) * 2022-12-06 2025-03-11 International Business Machines Corporation Clustered rigid wafer test probe

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285362A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Method of producing connecting terminal of ceramic wiring substrate
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
WO1991000619A1 (en) 1989-06-30 1991-01-10 Raychem Corporation Flying leads for integrated circuits
US5228861A (en) * 1992-06-12 1993-07-20 Amp Incorporated High density electrical connector system
US6029344A (en) * 1993-11-16 2000-02-29 Formfactor, Inc. Composite interconnection element for microelectronic components, and method of making same
US5802699A (en) 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
JPH08287983A (ja) 1995-04-14 1996-11-01 Whitaker Corp:The エラストマコネクタ
US6007349A (en) * 1996-01-04 1999-12-28 Tessera, Inc. Flexible contact post and post socket and associated methods therefor
JPH10197557A (ja) * 1997-01-14 1998-07-31 Toppan Printing Co Ltd 検査部材及びその製造方法
JPH10261473A (ja) * 1997-03-19 1998-09-29 Hitachi Electron Eng Co Ltd Ｉｃソケット
JP2001116795A (ja) * 1999-10-18 2001-04-27 Mitsubishi Electric Corp テスト用ソケット、およびテスト用ソケットに用いる接続シート
US6442039B1 (en) * 1999-12-03 2002-08-27 Delphi Technologies, Inc. Metallic microstructure springs and method of making same
JP3440243B2 (ja) * 2000-09-26 2003-08-25 株式会社アドバンストシステムズジャパン スパイラルコンタクタ
US6558560B2 (en) * 2001-07-27 2003-05-06 Hewlett-Packard Company Method for the fabrication of electrical contacts

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