CN1266759C - 电触点的制造方法 - Google Patents
电触点的制造方法 Download PDFInfo
- Publication number
- CN1266759C CN1266759C CN02127069.4A CN02127069A CN1266759C CN 1266759 C CN1266759 C CN 1266759C CN 02127069 A CN02127069 A CN 02127069A CN 1266759 C CN1266759 C CN 1266759C
- Authority
- CN
- China
- Prior art keywords
- electric contact
- substrate
- microstar
- manufacture method
- wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims description 49
- 238000007747 plating Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 3
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 239000013536 elastomeric material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacture Of Switches (AREA)
- Wire Bonding (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/917,093 US6627092B2 (en) | 2001-07-27 | 2001-07-27 | Method for the fabrication of electrical contacts |
US09/917093 | 2001-07-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1400697A CN1400697A (zh) | 2003-03-05 |
CN1266759C true CN1266759C (zh) | 2006-07-26 |
Family
ID=25438336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN02127069.4A Expired - Fee Related CN1266759C (zh) | 2001-07-27 | 2002-07-26 | 电触点的制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6627092B2 (zh) |
JP (1) | JP4163458B2 (zh) |
CN (1) | CN1266759C (zh) |
DE (1) | DE10231172A1 (zh) |
GB (1) | GB2383188B (zh) |
SG (1) | SG104332A1 (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3950799B2 (ja) * | 2003-01-28 | 2007-08-01 | アルプス電気株式会社 | 接続装置 |
TW559328U (en) * | 2003-03-25 | 2003-10-21 | P Two Ind Inc | Metal leaf spring structure |
US6948940B2 (en) * | 2003-04-10 | 2005-09-27 | Formfactor, Inc. | Helical microelectronic contact and method for fabricating same |
US7005751B2 (en) * | 2003-04-10 | 2006-02-28 | Formfactor, Inc. | Layered microelectronic contact and method for fabricating same |
US20070020960A1 (en) * | 2003-04-11 | 2007-01-25 | Williams John D | Contact grid array system |
US7758351B2 (en) | 2003-04-11 | 2010-07-20 | Neoconix, Inc. | Method and system for batch manufacturing of spring elements |
US7114961B2 (en) * | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
US7056131B1 (en) * | 2003-04-11 | 2006-06-06 | Neoconix, Inc. | Contact grid array system |
US7113408B2 (en) * | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
US6916181B2 (en) * | 2003-06-11 | 2005-07-12 | Neoconix, Inc. | Remountable connector for land grid array packages |
US8584353B2 (en) | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
US20050120553A1 (en) * | 2003-12-08 | 2005-06-09 | Brown Dirk D. | Method for forming MEMS grid array connector |
US7244125B2 (en) * | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
JP2004345286A (ja) * | 2003-05-23 | 2004-12-09 | Sony Corp | 金型表面装飾方法及び金型 |
TWI343156B (en) * | 2003-10-16 | 2011-06-01 | Tyco Electronics Corp | Conductive elastomeric contact system with anti-overstress columns |
US6890185B1 (en) * | 2003-11-03 | 2005-05-10 | Kulicke & Soffa Interconnect, Inc. | Multipath interconnect with meandering contact cantilevers |
JP4520874B2 (ja) * | 2004-02-06 | 2010-08-11 | 矢崎総業株式会社 | 雌端子及びコネクタ |
US7137831B2 (en) * | 2004-03-16 | 2006-11-21 | Alps Electric Co., Ltd. | Substrate having spiral contactors |
WO2005091998A2 (en) | 2004-03-19 | 2005-10-06 | Neoconix, Inc. | Electrical connector in a flexible host |
US7090503B2 (en) | 2004-03-19 | 2006-08-15 | Neoconix, Inc. | Interposer with compliant pins |
US7025601B2 (en) * | 2004-03-19 | 2006-04-11 | Neoconix, Inc. | Interposer and method for making same |
JP2006049101A (ja) * | 2004-08-05 | 2006-02-16 | Molex Japan Co Ltd | シート状コネクタとその製造方法 |
US7262495B2 (en) * | 2004-10-07 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | 3D interconnect with protruding contacts |
JP2006253580A (ja) * | 2005-03-14 | 2006-09-21 | Alps Electric Co Ltd | 電子機能部品実装体及び電子機器 |
JP2006351327A (ja) * | 2005-06-15 | 2006-12-28 | Alps Electric Co Ltd | 部材間の接続構造及びその製造方法、ならびに前記部材間の接続構造を備えた電子機器 |
US7331796B2 (en) * | 2005-09-08 | 2008-02-19 | International Business Machines Corporation | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries |
JPWO2008041484A1 (ja) * | 2006-09-26 | 2010-02-04 | アルプス電気株式会社 | 弾性接触子を用いた金属端子間の接合方法 |
US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
DE102015004151B4 (de) * | 2015-03-31 | 2022-01-27 | Feinmetall Gmbh | Verfahren zur Herstellung einer Federkontaktstift-Anordnung mit mehreren Federkontaktstiften |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5285362A (en) * | 1976-01-09 | 1977-07-15 | Hitachi Ltd | Method of producing connecting terminal of ceramic wiring substrate |
US5366380A (en) * | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
WO1991000619A1 (en) | 1989-06-30 | 1991-01-10 | Raychem Corporation | Flying leads for integrated circuits |
US5228861A (en) * | 1992-06-12 | 1993-07-20 | Amp Incorporated | High density electrical connector system |
US6029344A (en) * | 1993-11-16 | 2000-02-29 | Formfactor, Inc. | Composite interconnection element for microelectronic components, and method of making same |
US5802699A (en) | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
JPH08287983A (ja) | 1995-04-14 | 1996-11-01 | Whitaker Corp:The | エラストマコネクタ |
US6007349A (en) * | 1996-01-04 | 1999-12-28 | Tessera, Inc. | Flexible contact post and post socket and associated methods therefor |
JPH10197557A (ja) * | 1997-01-14 | 1998-07-31 | Toppan Printing Co Ltd | 検査部材及びその製造方法 |
JPH10261473A (ja) * | 1997-03-19 | 1998-09-29 | Hitachi Electron Eng Co Ltd | Icソケット |
JP2001116795A (ja) * | 1999-10-18 | 2001-04-27 | Mitsubishi Electric Corp | テスト用ソケット、およびテスト用ソケットに用いる接続シート |
US6442039B1 (en) * | 1999-12-03 | 2002-08-27 | Delphi Technologies, Inc. | Metallic microstructure springs and method of making same |
JP3440243B2 (ja) * | 2000-09-26 | 2003-08-25 | 株式会社アドバンストシステムズジャパン | スパイラルコンタクタ |
US6558560B2 (en) * | 2001-07-27 | 2003-05-06 | Hewlett-Packard Company | Method for the fabrication of electrical contacts |
-
2001
- 2001-07-27 US US09/917,093 patent/US6627092B2/en not_active Expired - Lifetime
-
2002
- 2002-05-28 SG SG200203167A patent/SG104332A1/en unknown
- 2002-07-10 GB GB0216021A patent/GB2383188B/en not_active Expired - Fee Related
- 2002-07-10 DE DE10231172A patent/DE10231172A1/de not_active Withdrawn
- 2002-07-12 JP JP2002203964A patent/JP4163458B2/ja not_active Expired - Fee Related
- 2002-07-26 CN CN02127069.4A patent/CN1266759C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2383188A (en) | 2003-06-18 |
SG104332A1 (en) | 2004-06-21 |
JP2003078075A (ja) | 2003-03-14 |
US20030019836A1 (en) | 2003-01-30 |
DE10231172A1 (de) | 2003-02-20 |
GB0216021D0 (en) | 2002-08-21 |
GB2383188B (en) | 2004-10-27 |
CN1400697A (zh) | 2003-03-05 |
US6627092B2 (en) | 2003-09-30 |
JP4163458B2 (ja) | 2008-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. Free format text: FORMER OWNER: HEWLETT-PACKARD CO. (US) P.O. BOX 10301, PALO ALTO CALIFORNIA U.S.A. Effective date: 20120423 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120423 Address after: Texas, USA Patentee after: HEWLETT-PACKARD DEVELOPMENT Co.,L.P. Address before: California, USA Patentee before: Hewlett-Packard Co. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060726 Termination date: 20140726 |
|
EXPY | Termination of patent right or utility model |