DE10231172A1 - Verfahren zur Herstellung elektrischer Kontakte - Google Patents

Verfahren zur Herstellung elektrischer Kontakte

Info

Publication number
DE10231172A1
DE10231172A1 DE10231172A DE10231172A DE10231172A1 DE 10231172 A1 DE10231172 A1 DE 10231172A1 DE 10231172 A DE10231172 A DE 10231172A DE 10231172 A DE10231172 A DE 10231172A DE 10231172 A1 DE10231172 A1 DE 10231172A1
Authority
DE
Germany
Prior art keywords
electrical contacts
substrate
present
micro
metal plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10231172A
Other languages
German (de)
English (en)
Inventor
Bradley E Clements
Joseph M White
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE10231172A1 publication Critical patent/DE10231172A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacture Of Switches (AREA)
  • Wire Bonding (AREA)
  • Connecting Device With Holders (AREA)
DE10231172A 2001-07-27 2002-07-10 Verfahren zur Herstellung elektrischer Kontakte Withdrawn DE10231172A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/917,093 US6627092B2 (en) 2001-07-27 2001-07-27 Method for the fabrication of electrical contacts

Publications (1)

Publication Number Publication Date
DE10231172A1 true DE10231172A1 (de) 2003-02-20

Family

ID=25438336

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10231172A Withdrawn DE10231172A1 (de) 2001-07-27 2002-07-10 Verfahren zur Herstellung elektrischer Kontakte

Country Status (6)

Country Link
US (1) US6627092B2 (enExample)
JP (1) JP4163458B2 (enExample)
CN (1) CN1266759C (enExample)
DE (1) DE10231172A1 (enExample)
GB (1) GB2383188B (enExample)
SG (1) SG104332A1 (enExample)

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JP3950799B2 (ja) * 2003-01-28 2007-08-01 アルプス電気株式会社 接続装置
TW559328U (en) * 2003-03-25 2003-10-21 P Two Ind Inc Metal leaf spring structure
US7005751B2 (en) * 2003-04-10 2006-02-28 Formfactor, Inc. Layered microelectronic contact and method for fabricating same
US6948940B2 (en) * 2003-04-10 2005-09-27 Formfactor, Inc. Helical microelectronic contact and method for fabricating same
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US6916181B2 (en) * 2003-06-11 2005-07-12 Neoconix, Inc. Remountable connector for land grid array packages
US7628617B2 (en) 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7056131B1 (en) * 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US20050120553A1 (en) * 2003-12-08 2005-06-09 Brown Dirk D. Method for forming MEMS grid array connector
US20070020960A1 (en) * 2003-04-11 2007-01-25 Williams John D Contact grid array system
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7597561B2 (en) 2003-04-11 2009-10-06 Neoconix, Inc. Method and system for batch forming spring elements in three dimensions
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
JP2004345286A (ja) * 2003-05-23 2004-12-09 Sony Corp 金型表面装飾方法及び金型
TWI343156B (en) * 2003-10-16 2011-06-01 Tyco Electronics Corp Conductive elastomeric contact system with anti-overstress columns
US6890185B1 (en) * 2003-11-03 2005-05-10 Kulicke & Soffa Interconnect, Inc. Multipath interconnect with meandering contact cantilevers
JP4520874B2 (ja) * 2004-02-06 2010-08-11 矢崎総業株式会社 雌端子及びコネクタ
US7137831B2 (en) * 2004-03-16 2006-11-21 Alps Electric Co., Ltd. Substrate having spiral contactors
US7347698B2 (en) 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
US7383632B2 (en) 2004-03-19 2008-06-10 Neoconix, Inc. Method for fabricating a connector
US7090503B2 (en) 2004-03-19 2006-08-15 Neoconix, Inc. Interposer with compliant pins
US7025601B2 (en) * 2004-03-19 2006-04-11 Neoconix, Inc. Interposer and method for making same
US7354276B2 (en) 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
JP2006049101A (ja) * 2004-08-05 2006-02-16 Molex Japan Co Ltd シート状コネクタとその製造方法
US7262495B2 (en) * 2004-10-07 2007-08-28 Hewlett-Packard Development Company, L.P. 3D interconnect with protruding contacts
JP2006253580A (ja) * 2005-03-14 2006-09-21 Alps Electric Co Ltd 電子機能部品実装体及び電子機器
JP2006351327A (ja) * 2005-06-15 2006-12-28 Alps Electric Co Ltd 部材間の接続構造及びその製造方法、ならびに前記部材間の接続構造を備えた電子機器
US7331796B2 (en) * 2005-09-08 2008-02-19 International Business Machines Corporation Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
US7357644B2 (en) 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
JPWO2008041484A1 (ja) * 2006-09-26 2010-02-04 アルプス電気株式会社 弾性接触子を用いた金属端子間の接合方法
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
DE102015004151B4 (de) * 2015-03-31 2022-01-27 Feinmetall Gmbh Verfahren zur Herstellung einer Federkontaktstift-Anordnung mit mehreren Federkontaktstiften
US12248003B2 (en) * 2022-12-06 2025-03-11 International Business Machines Corporation Clustered rigid wafer test probe

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Publication number Priority date Publication date Assignee Title
JPS5285362A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Method of producing connecting terminal of ceramic wiring substrate
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
WO1991000619A1 (en) 1989-06-30 1991-01-10 Raychem Corporation Flying leads for integrated circuits
US5228861A (en) * 1992-06-12 1993-07-20 Amp Incorporated High density electrical connector system
US6029344A (en) * 1993-11-16 2000-02-29 Formfactor, Inc. Composite interconnection element for microelectronic components, and method of making same
US5802699A (en) 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
JPH08287983A (ja) 1995-04-14 1996-11-01 Whitaker Corp:The エラストマコネクタ
US6007349A (en) * 1996-01-04 1999-12-28 Tessera, Inc. Flexible contact post and post socket and associated methods therefor
JPH10197557A (ja) * 1997-01-14 1998-07-31 Toppan Printing Co Ltd 検査部材及びその製造方法
JPH10261473A (ja) * 1997-03-19 1998-09-29 Hitachi Electron Eng Co Ltd Ｉｃソケット
JP2001116795A (ja) * 1999-10-18 2001-04-27 Mitsubishi Electric Corp テスト用ソケット、およびテスト用ソケットに用いる接続シート
US6442039B1 (en) * 1999-12-03 2002-08-27 Delphi Technologies, Inc. Metallic microstructure springs and method of making same
JP3440243B2 (ja) * 2000-09-26 2003-08-25 株式会社アドバンストシステムズジャパン スパイラルコンタクタ
US6558560B2 (en) * 2001-07-27 2003-05-06 Hewlett-Packard Company Method for the fabrication of electrical contacts

Also Published As

Publication number Publication date
GB2383188A (en) 2003-06-18
JP4163458B2 (ja) 2008-10-08
CN1266759C (zh) 2006-07-26
GB0216021D0 (en) 2002-08-21
JP2003078075A (ja) 2003-03-14
CN1400697A (zh) 2003-03-05
US20030019836A1 (en) 2003-01-30
US6627092B2 (en) 2003-09-30
GB2383188B (en) 2004-10-27
SG104332A1 (en) 2004-06-21

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8139 Disposal/non-payment of the annual fee