JP2003059721A5 - - Google Patents

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Publication number
JP2003059721A5
JP2003059721A5 JP2002133848A JP2002133848A JP2003059721A5 JP 2003059721 A5 JP2003059721 A5 JP 2003059721A5 JP 2002133848 A JP2002133848 A JP 2002133848A JP 2002133848 A JP2002133848 A JP 2002133848A JP 2003059721 A5 JP2003059721 A5 JP 2003059721A5
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JP
Japan
Prior art keywords
flexible
foil according
conductor foil
flexible conductor
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002133848A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003059721A (ja
Filing date
Publication date
Priority claimed from DE10122393A external-priority patent/DE10122393A1/de
Application filed filed Critical
Publication of JP2003059721A publication Critical patent/JP2003059721A/ja
Publication of JP2003059721A5 publication Critical patent/JP2003059721A5/ja
Withdrawn legal-status Critical Current

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JP2002133848A 2001-05-09 2002-05-09 電子回路を有する可撓性導体フォイル Withdrawn JP2003059721A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10122393A DE10122393A1 (de) 2001-05-09 2001-05-09 Flexible Leiterfolie mit einer elektronischen Schaltung
DE10122393.5 2001-05-09

Publications (2)

Publication Number Publication Date
JP2003059721A JP2003059721A (ja) 2003-02-28
JP2003059721A5 true JP2003059721A5 (https=) 2005-09-15

Family

ID=7684073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002133848A Withdrawn JP2003059721A (ja) 2001-05-09 2002-05-09 電子回路を有する可撓性導体フォイル

Country Status (6)

Country Link
US (1) US20020167783A1 (https=)
EP (1) EP1257156A3 (https=)
JP (1) JP2003059721A (https=)
KR (1) KR20020085814A (https=)
CN (1) CN1392756A (https=)
DE (1) DE10122393A1 (https=)

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TW200507131A (en) 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
KR20060101755A (ko) * 2003-08-26 2006-09-26 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 인쇄 회로 기판, 인덕터 및 인덕터 제조 방법
CN1842879A (zh) * 2003-08-26 2006-10-04 皇家飞利浦电子股份有限公司 具有集成电感器的印刷电路板
CN1860833A (zh) * 2003-09-29 2006-11-08 株式会社田村制作所 多层层叠电路基板
DE102004014583A1 (de) * 2004-03-25 2005-10-20 Bruker Daltonik Gmbh Gleichspannungszuführung zu Hochfrequenz-Elektrodensystemen
US7030472B2 (en) * 2004-04-01 2006-04-18 Agere Systems Inc. Integrated circuit device having flexible leadframe
EP1598637B1 (en) * 2004-05-21 2015-08-19 Prysmian Cables & Systems Limited Method and apparatus for determining the length of a passage along which an optical fibre is to be blown
DE102004026052B3 (de) * 2004-05-25 2005-08-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Induktives Koppelelement und Verfahren zur Herstellung desselben
JP4769033B2 (ja) * 2005-03-23 2011-09-07 スミダコーポレーション株式会社 インダクタ
DE102005026410B4 (de) * 2005-06-08 2007-06-21 Vacuumschmelze Gmbh & Co. Kg Anordnung mit einem induktiven Bauelement
DE102005037040A1 (de) * 2005-08-05 2007-02-08 Epcos Ag Elektrisches Bauelement
US8058951B2 (en) 2005-09-30 2011-11-15 Panasonic Corporation Sheet-like composite electronic component and method for manufacturing same
JP4965116B2 (ja) 2005-12-07 2012-07-04 スミダコーポレーション株式会社 可撓性コイル
JP5337026B2 (ja) * 2006-06-01 2013-11-06 コーニンクレッカ フィリップス エヌ ヴェ 変圧器
DE102008035102A1 (de) * 2008-07-28 2010-02-11 Epcos Ag Vielschichtbauelement
KR101771740B1 (ko) * 2012-11-13 2017-08-25 삼성전기주식회사 박막형 칩 소자 및 그 제조 방법
JP2015029040A (ja) * 2013-07-05 2015-02-12 サンケン電気株式会社 半導体モジュール、ｌｅｄ駆動装置及びｌｅｄ照明装置
KR20150048551A (ko) * 2013-10-28 2015-05-07 삼성전기주식회사 트랜스포머, 전원 공급 장치, 이를 포함하는 디스플레이 장치
EP3382409B1 (en) 2017-03-31 2022-04-27 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated flux gate sensor
FR3073354B1 (fr) * 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
DE102018009686A1 (de) * 2018-11-30 2020-06-04 KlEFEL GmbH Hochfrequenz-Planartransformator mit einem ultrapermittiven Dielektrikum
WO2026068713A1 (en) * 2024-09-30 2026-04-02 Valeo Eautomotive Germany Gmbh A capacitor integrated in a printed circuit board

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Publication number Priority date Publication date Assignee Title
DE7628700U1 (de) * 1976-09-14 1977-06-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektronische Baugruppe
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
US4626311A (en) * 1984-02-23 1986-12-02 Standard Textile Co., Inc. Cloth product having an antitheft device and method of making same
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
US5532711A (en) * 1991-09-27 1996-07-02 Inwave Corporation Lightweight display systems and methods for making and employing same
JPH06309610A (ja) * 1993-04-28 1994-11-04 Sony Corp 磁気ヘッド
JPH0851023A (ja) * 1994-08-05 1996-02-20 Kanegafuchi Chem Ind Co Ltd フレキシブルプリント配線板のコイルのインダクタンス増加方法及びこの方法を適用したフレキシブルプリント配線板並びに小型コイル
US5739560A (en) * 1994-09-22 1998-04-14 Nippon Telegraph And Telephone Corporation High frequency masterslice monolithic integrated circuit
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
JP3164000B2 (ja) * 1996-12-11 2001-05-08 株式会社村田製作所 積層型インダクタ
EP0902048B1 (en) * 1997-09-11 2005-11-23 E.I. Du Pont De Nemours And Company High dielectric constant flexible polyimide film and process of preparation
FR2771843B1 (fr) * 1997-11-28 2000-02-11 Sgs Thomson Microelectronics Transformateur en circuit integre
DE59803887D1 (de) * 1998-01-22 2002-05-23 Fraunhofer Ges Forschung Mikrosystem und verfahren zum herstellen eines mikrosystems
JPH11346104A (ja) * 1998-05-29 1999-12-14 Philips Japan Ltd 誘電体フィルタ
JP4061733B2 (ja) * 1998-09-28 2008-03-19 ソニー株式会社 カセットライブラリシステム
US6249205B1 (en) * 1998-11-20 2001-06-19 Steward, Inc. Surface mount inductor with flux gap and related fabrication methods
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
US6198374B1 (en) * 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
JP2001345212A (ja) * 2000-05-31 2001-12-14 Tdk Corp 積層電子部品

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