DE10122393A1 - Flexible Leiterfolie mit einer elektronischen Schaltung - Google Patents

Flexible Leiterfolie mit einer elektronischen Schaltung

Info

Publication number
DE10122393A1
DE10122393A1 DE10122393A DE10122393A DE10122393A1 DE 10122393 A1 DE10122393 A1 DE 10122393A1 DE 10122393 A DE10122393 A DE 10122393A DE 10122393 A DE10122393 A DE 10122393A DE 10122393 A1 DE10122393 A1 DE 10122393A1
Authority
DE
Germany
Prior art keywords
conductor foil
flexible
flexible conductor
foil according
line patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10122393A
Other languages
German (de)
English (en)
Inventor
Eberhard Waffenschmidt
Martin Elixmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Corporate Intellectual Property GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Corporate Intellectual Property GmbH filed Critical Philips Corporate Intellectual Property GmbH
Priority to DE10122393A priority Critical patent/DE10122393A1/de
Priority to KR1020020024762A priority patent/KR20020085814A/ko
Priority to CN02124529A priority patent/CN1392756A/zh
Priority to EP02100453A priority patent/EP1257156A3/de
Priority to US10/140,664 priority patent/US20020167783A1/en
Priority to JP2002133848A priority patent/JP2003059721A/ja
Publication of DE10122393A1 publication Critical patent/DE10122393A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/006—Printed inductances flexible printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE10122393A 2001-05-09 2001-05-09 Flexible Leiterfolie mit einer elektronischen Schaltung Withdrawn DE10122393A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE10122393A DE10122393A1 (de) 2001-05-09 2001-05-09 Flexible Leiterfolie mit einer elektronischen Schaltung
KR1020020024762A KR20020085814A (ko) 2001-05-09 2002-05-06 전자 회로를 갖는 가요성 도체 박
CN02124529A CN1392756A (zh) 2001-05-09 2002-05-06 带电子电路的柔性导体箔
EP02100453A EP1257156A3 (de) 2001-05-09 2002-05-07 Flexible Leiterfolie mit einer elektronischen Schaltung
US10/140,664 US20020167783A1 (en) 2001-05-09 2002-05-08 Flexible conductor foil with an electronic circuit
JP2002133848A JP2003059721A (ja) 2001-05-09 2002-05-09 電子回路を有する可撓性導体フォイル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10122393A DE10122393A1 (de) 2001-05-09 2001-05-09 Flexible Leiterfolie mit einer elektronischen Schaltung

Publications (1)

Publication Number Publication Date
DE10122393A1 true DE10122393A1 (de) 2002-11-14

Family

ID=7684073

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10122393A Withdrawn DE10122393A1 (de) 2001-05-09 2001-05-09 Flexible Leiterfolie mit einer elektronischen Schaltung

Country Status (6)

Country Link
US (1) US20020167783A1 (https=)
EP (1) EP1257156A3 (https=)
JP (1) JP2003059721A (https=)
KR (1) KR20020085814A (https=)
CN (1) CN1392756A (https=)
DE (1) DE10122393A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005032226A1 (ja) * 2003-09-29 2005-04-07 Tamura Corporation 多層積層回路基板
DE102005026410B4 (de) * 2005-06-08 2007-06-21 Vacuumschmelze Gmbh & Co. Kg Anordnung mit einem induktiven Bauelement

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TW200507131A (en) 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
KR20060101755A (ko) * 2003-08-26 2006-09-26 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 인쇄 회로 기판, 인덕터 및 인덕터 제조 방법
CN1842879A (zh) * 2003-08-26 2006-10-04 皇家飞利浦电子股份有限公司 具有集成电感器的印刷电路板
DE102004014583A1 (de) * 2004-03-25 2005-10-20 Bruker Daltonik Gmbh Gleichspannungszuführung zu Hochfrequenz-Elektrodensystemen
US7030472B2 (en) * 2004-04-01 2006-04-18 Agere Systems Inc. Integrated circuit device having flexible leadframe
EP1598637B1 (en) * 2004-05-21 2015-08-19 Prysmian Cables & Systems Limited Method and apparatus for determining the length of a passage along which an optical fibre is to be blown
DE102004026052B3 (de) * 2004-05-25 2005-08-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Induktives Koppelelement und Verfahren zur Herstellung desselben
JP4769033B2 (ja) * 2005-03-23 2011-09-07 スミダコーポレーション株式会社 インダクタ
DE102005037040A1 (de) * 2005-08-05 2007-02-08 Epcos Ag Elektrisches Bauelement
US8058951B2 (en) 2005-09-30 2011-11-15 Panasonic Corporation Sheet-like composite electronic component and method for manufacturing same
JP4965116B2 (ja) 2005-12-07 2012-07-04 スミダコーポレーション株式会社 可撓性コイル
JP5337026B2 (ja) * 2006-06-01 2013-11-06 コーニンクレッカ フィリップス エヌ ヴェ 変圧器
DE102008035102A1 (de) * 2008-07-28 2010-02-11 Epcos Ag Vielschichtbauelement
KR101771740B1 (ko) * 2012-11-13 2017-08-25 삼성전기주식회사 박막형 칩 소자 및 그 제조 방법
JP2015029040A (ja) * 2013-07-05 2015-02-12 サンケン電気株式会社 半導体モジュール、ｌｅｄ駆動装置及びｌｅｄ照明装置
KR20150048551A (ko) * 2013-10-28 2015-05-07 삼성전기주식회사 트랜스포머, 전원 공급 장치, 이를 포함하는 디스플레이 장치
EP3382409B1 (en) 2017-03-31 2022-04-27 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated flux gate sensor
FR3073354B1 (fr) * 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
DE102018009686A1 (de) * 2018-11-30 2020-06-04 KlEFEL GmbH Hochfrequenz-Planartransformator mit einem ultrapermittiven Dielektrikum
WO2026068713A1 (en) * 2024-09-30 2026-04-02 Valeo Eautomotive Germany Gmbh A capacitor integrated in a printed circuit board

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DE7628700U1 (de) * 1976-09-14 1977-06-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektronische Baugruppe
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
US4626311A (en) * 1984-02-23 1986-12-02 Standard Textile Co., Inc. Cloth product having an antitheft device and method of making same
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
US5532711A (en) * 1991-09-27 1996-07-02 Inwave Corporation Lightweight display systems and methods for making and employing same
JPH06309610A (ja) * 1993-04-28 1994-11-04 Sony Corp 磁気ヘッド
JPH0851023A (ja) * 1994-08-05 1996-02-20 Kanegafuchi Chem Ind Co Ltd フレキシブルプリント配線板のコイルのインダクタンス増加方法及びこの方法を適用したフレキシブルプリント配線板並びに小型コイル
US5739560A (en) * 1994-09-22 1998-04-14 Nippon Telegraph And Telephone Corporation High frequency masterslice monolithic integrated circuit
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
JP3164000B2 (ja) * 1996-12-11 2001-05-08 株式会社村田製作所 積層型インダクタ
EP0902048B1 (en) * 1997-09-11 2005-11-23 E.I. Du Pont De Nemours And Company High dielectric constant flexible polyimide film and process of preparation
FR2771843B1 (fr) * 1997-11-28 2000-02-11 Sgs Thomson Microelectronics Transformateur en circuit integre
DE59803887D1 (de) * 1998-01-22 2002-05-23 Fraunhofer Ges Forschung Mikrosystem und verfahren zum herstellen eines mikrosystems
JPH11346104A (ja) * 1998-05-29 1999-12-14 Philips Japan Ltd 誘電体フィルタ
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US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
US6198374B1 (en) * 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005032226A1 (ja) * 2003-09-29 2005-04-07 Tamura Corporation 多層積層回路基板
DE102005026410B4 (de) * 2005-06-08 2007-06-21 Vacuumschmelze Gmbh & Co. Kg Anordnung mit einem induktiven Bauelement

Also Published As

Publication number Publication date
JP2003059721A (ja) 2003-02-28
CN1392756A (zh) 2003-01-22
KR20020085814A (ko) 2002-11-16
EP1257156A2 (de) 2002-11-13
US20020167783A1 (en) 2002-11-14
EP1257156A3 (de) 2004-05-12

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH, 20

8139 Disposal/non-payment of the annual fee