KR20020085814A - 전자 회로를 갖는 가요성 도체 박 - Google Patents

전자 회로를 갖는 가요성 도체 박 Download PDF

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Publication number
KR20020085814A
KR20020085814A KR1020020024762A KR20020024762A KR20020085814A KR 20020085814 A KR20020085814 A KR 20020085814A KR 1020020024762 A KR1020020024762 A KR 1020020024762A KR 20020024762 A KR20020024762 A KR 20020024762A KR 20020085814 A KR20020085814 A KR 20020085814A
Authority
KR
South Korea
Prior art keywords
flexible
conductor
foil
conductor foil
flexible conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020020024762A
Other languages
English (en)
Korean (ko)
Inventor
바펜쉬미트에베르하드
엘릭스만마르틴
Original Assignee
코닌클리즈케 필립스 일렉트로닉스 엔.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닌클리즈케 필립스 일렉트로닉스 엔.브이. filed Critical 코닌클리즈케 필립스 일렉트로닉스 엔.브이.
Publication of KR20020085814A publication Critical patent/KR20020085814A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/006—Printed inductances flexible printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020020024762A 2001-05-09 2002-05-06 전자 회로를 갖는 가요성 도체 박 Withdrawn KR20020085814A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10122393A DE10122393A1 (de) 2001-05-09 2001-05-09 Flexible Leiterfolie mit einer elektronischen Schaltung
DE10122393.5 2001-05-09

Publications (1)

Publication Number Publication Date
KR20020085814A true KR20020085814A (ko) 2002-11-16

Family

ID=7684073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020024762A Withdrawn KR20020085814A (ko) 2001-05-09 2002-05-06 전자 회로를 갖는 가요성 도체 박

Country Status (6)

Country Link
US (1) US20020167783A1 (https=)
EP (1) EP1257156A3 (https=)
JP (1) JP2003059721A (https=)
KR (1) KR20020085814A (https=)
CN (1) CN1392756A (https=)
DE (1) DE10122393A1 (https=)

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TW200507131A (en) 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
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CN1842879A (zh) * 2003-08-26 2006-10-04 皇家飞利浦电子股份有限公司 具有集成电感器的印刷电路板
CN1860833A (zh) * 2003-09-29 2006-11-08 株式会社田村制作所 多层层叠电路基板
DE102004014583A1 (de) * 2004-03-25 2005-10-20 Bruker Daltonik Gmbh Gleichspannungszuführung zu Hochfrequenz-Elektrodensystemen
US7030472B2 (en) * 2004-04-01 2006-04-18 Agere Systems Inc. Integrated circuit device having flexible leadframe
EP1598637B1 (en) * 2004-05-21 2015-08-19 Prysmian Cables & Systems Limited Method and apparatus for determining the length of a passage along which an optical fibre is to be blown
DE102004026052B3 (de) * 2004-05-25 2005-08-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Induktives Koppelelement und Verfahren zur Herstellung desselben
JP4769033B2 (ja) * 2005-03-23 2011-09-07 スミダコーポレーション株式会社 インダクタ
DE102005026410B4 (de) * 2005-06-08 2007-06-21 Vacuumschmelze Gmbh & Co. Kg Anordnung mit einem induktiven Bauelement
DE102005037040A1 (de) * 2005-08-05 2007-02-08 Epcos Ag Elektrisches Bauelement
US8058951B2 (en) 2005-09-30 2011-11-15 Panasonic Corporation Sheet-like composite electronic component and method for manufacturing same
JP4965116B2 (ja) 2005-12-07 2012-07-04 スミダコーポレーション株式会社 可撓性コイル
JP5337026B2 (ja) * 2006-06-01 2013-11-06 コーニンクレッカ フィリップス エヌ ヴェ 変圧器
DE102008035102A1 (de) * 2008-07-28 2010-02-11 Epcos Ag Vielschichtbauelement
KR101771740B1 (ko) * 2012-11-13 2017-08-25 삼성전기주식회사 박막형 칩 소자 및 그 제조 방법
JP2015029040A (ja) * 2013-07-05 2015-02-12 サンケン電気株式会社 半導体モジュール、ｌｅｄ駆動装置及びｌｅｄ照明装置
KR20150048551A (ko) * 2013-10-28 2015-05-07 삼성전기주식회사 트랜스포머, 전원 공급 장치, 이를 포함하는 디스플레이 장치
EP3382409B1 (en) 2017-03-31 2022-04-27 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated flux gate sensor
FR3073354B1 (fr) * 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
DE102018009686A1 (de) * 2018-11-30 2020-06-04 KlEFEL GmbH Hochfrequenz-Planartransformator mit einem ultrapermittiven Dielektrikum
WO2026068713A1 (en) * 2024-09-30 2026-04-02 Valeo Eautomotive Germany Gmbh A capacitor integrated in a printed circuit board

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DE7628700U1 (de) * 1976-09-14 1977-06-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektronische Baugruppe
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
US4626311A (en) * 1984-02-23 1986-12-02 Standard Textile Co., Inc. Cloth product having an antitheft device and method of making same
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
US5532711A (en) * 1991-09-27 1996-07-02 Inwave Corporation Lightweight display systems and methods for making and employing same
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Also Published As

Publication number Publication date
JP2003059721A (ja) 2003-02-28
CN1392756A (zh) 2003-01-22
DE10122393A1 (de) 2002-11-14
EP1257156A2 (de) 2002-11-13
US20020167783A1 (en) 2002-11-14
EP1257156A3 (de) 2004-05-12

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000