JP2003059721A - 電子回路を有する可撓性導体フォイル - Google Patents

電子回路を有する可撓性導体フォイル

Info

Publication number
JP2003059721A
JP2003059721A JP2002133848A JP2002133848A JP2003059721A JP 2003059721 A JP2003059721 A JP 2003059721A JP 2002133848 A JP2002133848 A JP 2002133848A JP 2002133848 A JP2002133848 A JP 2002133848A JP 2003059721 A JP2003059721 A JP 2003059721A
Authority
JP
Japan
Prior art keywords
flexible
conductor foil
flexible conductor
foil according
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002133848A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003059721A5 (https=
Inventor
Eberhard Waffenschmidt
エベルハルト、バッフェンシュミット
Martin Elixmann
マルティン、エリクスマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of JP2003059721A publication Critical patent/JP2003059721A/ja
Publication of JP2003059721A5 publication Critical patent/JP2003059721A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/006—Printed inductances flexible printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2002133848A 2001-05-09 2002-05-09 電子回路を有する可撓性導体フォイル Withdrawn JP2003059721A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10122393A DE10122393A1 (de) 2001-05-09 2001-05-09 Flexible Leiterfolie mit einer elektronischen Schaltung
DE10122393.5 2001-05-09

Publications (2)

Publication Number Publication Date
JP2003059721A true JP2003059721A (ja) 2003-02-28
JP2003059721A5 JP2003059721A5 (https=) 2005-09-15

Family

ID=7684073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002133848A Withdrawn JP2003059721A (ja) 2001-05-09 2002-05-09 電子回路を有する可撓性導体フォイル

Country Status (6)

Country Link
US (1) US20020167783A1 (https=)
EP (1) EP1257156A3 (https=)
JP (1) JP2003059721A (https=)
KR (1) KR20020085814A (https=)
CN (1) CN1392756A (https=)
DE (1) DE10122393A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007040064A1 (ja) * 2005-09-30 2007-04-12 Matsushita Electric Industrial Co., Ltd. シート状複合電子部品とその製造方法
JP2011529278A (ja) * 2008-07-28 2011-12-01 エプコス アクチエンゲゼルシャフト 多層構成要素
JP2015029040A (ja) * 2013-07-05 2015-02-12 サンケン電気株式会社 半導体モジュール、ｌｅｄ駆動装置及びｌｅｄ照明装置
US9521755B2 (en) 2003-07-02 2016-12-13 Invensas Corporation Multilayer wiring board for an electronic device

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KR20060101755A (ko) * 2003-08-26 2006-09-26 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 인쇄 회로 기판, 인덕터 및 인덕터 제조 방법
CN1842879A (zh) * 2003-08-26 2006-10-04 皇家飞利浦电子股份有限公司 具有集成电感器的印刷电路板
CN1860833A (zh) * 2003-09-29 2006-11-08 株式会社田村制作所 多层层叠电路基板
DE102004014583A1 (de) * 2004-03-25 2005-10-20 Bruker Daltonik Gmbh Gleichspannungszuführung zu Hochfrequenz-Elektrodensystemen
US7030472B2 (en) * 2004-04-01 2006-04-18 Agere Systems Inc. Integrated circuit device having flexible leadframe
EP1598637B1 (en) * 2004-05-21 2015-08-19 Prysmian Cables & Systems Limited Method and apparatus for determining the length of a passage along which an optical fibre is to be blown
DE102004026052B3 (de) * 2004-05-25 2005-08-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Induktives Koppelelement und Verfahren zur Herstellung desselben
JP4769033B2 (ja) * 2005-03-23 2011-09-07 スミダコーポレーション株式会社 インダクタ
DE102005026410B4 (de) * 2005-06-08 2007-06-21 Vacuumschmelze Gmbh & Co. Kg Anordnung mit einem induktiven Bauelement
DE102005037040A1 (de) * 2005-08-05 2007-02-08 Epcos Ag Elektrisches Bauelement
JP4965116B2 (ja) 2005-12-07 2012-07-04 スミダコーポレーション株式会社 可撓性コイル
JP5337026B2 (ja) * 2006-06-01 2013-11-06 コーニンクレッカ フィリップス エヌ ヴェ 変圧器
KR101771740B1 (ko) * 2012-11-13 2017-08-25 삼성전기주식회사 박막형 칩 소자 및 그 제조 방법
KR20150048551A (ko) * 2013-10-28 2015-05-07 삼성전기주식회사 트랜스포머, 전원 공급 장치, 이를 포함하는 디스플레이 장치
EP3382409B1 (en) 2017-03-31 2022-04-27 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated flux gate sensor
FR3073354B1 (fr) * 2017-11-06 2019-10-18 Safran Piece composite a circuit electronique d'instrumentation integre et son procede de fabrication
DE102018009686A1 (de) * 2018-11-30 2020-06-04 KlEFEL GmbH Hochfrequenz-Planartransformator mit einem ultrapermittiven Dielektrikum
WO2026068713A1 (en) * 2024-09-30 2026-04-02 Valeo Eautomotive Germany Gmbh A capacitor integrated in a printed circuit board

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DE7628700U1 (de) * 1976-09-14 1977-06-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektronische Baugruppe
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
US4626311A (en) * 1984-02-23 1986-12-02 Standard Textile Co., Inc. Cloth product having an antitheft device and method of making same
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
US5532711A (en) * 1991-09-27 1996-07-02 Inwave Corporation Lightweight display systems and methods for making and employing same
JPH06309610A (ja) * 1993-04-28 1994-11-04 Sony Corp 磁気ヘッド
JPH0851023A (ja) * 1994-08-05 1996-02-20 Kanegafuchi Chem Ind Co Ltd フレキシブルプリント配線板のコイルのインダクタンス増加方法及びこの方法を適用したフレキシブルプリント配線板並びに小型コイル
US5739560A (en) * 1994-09-22 1998-04-14 Nippon Telegraph And Telephone Corporation High frequency masterslice monolithic integrated circuit
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
JP3164000B2 (ja) * 1996-12-11 2001-05-08 株式会社村田製作所 積層型インダクタ
EP0902048B1 (en) * 1997-09-11 2005-11-23 E.I. Du Pont De Nemours And Company High dielectric constant flexible polyimide film and process of preparation
FR2771843B1 (fr) * 1997-11-28 2000-02-11 Sgs Thomson Microelectronics Transformateur en circuit integre
DE59803887D1 (de) * 1998-01-22 2002-05-23 Fraunhofer Ges Forschung Mikrosystem und verfahren zum herstellen eines mikrosystems
JPH11346104A (ja) * 1998-05-29 1999-12-14 Philips Japan Ltd 誘電体フィルタ
JP4061733B2 (ja) * 1998-09-28 2008-03-19 ソニー株式会社 カセットライブラリシステム
US6249205B1 (en) * 1998-11-20 2001-06-19 Steward, Inc. Surface mount inductor with flux gap and related fabrication methods
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
US6198374B1 (en) * 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
JP2001345212A (ja) * 2000-05-31 2001-12-14 Tdk Corp 積層電子部品

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9521755B2 (en) 2003-07-02 2016-12-13 Invensas Corporation Multilayer wiring board for an electronic device
US10104785B2 (en) 2003-07-02 2018-10-16 Invensas Corporation Multilayer wiring board for an electronic device
WO2007040064A1 (ja) * 2005-09-30 2007-04-12 Matsushita Electric Industrial Co., Ltd. シート状複合電子部品とその製造方法
US8058951B2 (en) 2005-09-30 2011-11-15 Panasonic Corporation Sheet-like composite electronic component and method for manufacturing same
JP2011529278A (ja) * 2008-07-28 2011-12-01 エプコス アクチエンゲゼルシャフト 多層構成要素
JP2015029040A (ja) * 2013-07-05 2015-02-12 サンケン電気株式会社 半導体モジュール、ｌｅｄ駆動装置及びｌｅｄ照明装置

Also Published As

Publication number Publication date
CN1392756A (zh) 2003-01-22
DE10122393A1 (de) 2002-11-14
KR20020085814A (ko) 2002-11-16
EP1257156A2 (de) 2002-11-13
US20020167783A1 (en) 2002-11-14
EP1257156A3 (de) 2004-05-12

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