JP2003012763A5 - - Google Patents
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- Publication number
- JP2003012763A5 JP2003012763A5 JP2001194802A JP2001194802A JP2003012763A5 JP 2003012763 A5 JP2003012763 A5 JP 2003012763A5 JP 2001194802 A JP2001194802 A JP 2001194802A JP 2001194802 A JP2001194802 A JP 2001194802A JP 2003012763 A5 JP2003012763 A5 JP 2003012763A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- general formula
- aromatic compound
- curing
- epihalohydrin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 description 28
- 229920000647 polyepoxide Polymers 0.000 description 28
- 150000001491 aromatic compounds Chemical class 0.000 description 15
- 239000000203 mixture Substances 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- AZZWZMUXHALBCQ-UHFFFAOYSA-N 4-[(4-hydroxy-3,5-dimethylphenyl)methyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(CC=2C=C(C)C(O)=C(C)C=2)=C1 AZZWZMUXHALBCQ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- -1 diglycidyl ether compound Chemical class 0.000 description 2
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- 0 *c1cc(*c(cc2*)cc(I)c2O)cc(*)c1O Chemical compound *c1cc(*c(cc2*)cc(I)c2O)cc(*)c1O 0.000 description 1
- BFCOFCKCRLHGNP-UHFFFAOYSA-N 2-[4-(2-hydroxyphenyl)butyl]phenol Chemical compound OC1=CC=CC=C1CCCCC1=CC=CC=C1O BFCOFCKCRLHGNP-UHFFFAOYSA-N 0.000 description 1
- YGYPMFPGZQPETF-UHFFFAOYSA-N 4-(4-hydroxy-3,5-dimethylphenyl)-2,6-dimethylphenol Chemical group CC1=C(O)C(C)=CC(C=2C=C(C)C(O)=C(C)C=2)=C1 YGYPMFPGZQPETF-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001194802A JP5131506B2 (ja) | 2001-06-27 | 2001-06-27 | エポキシ樹脂 |
| US10/755,447 US7332557B2 (en) | 2001-06-27 | 2004-01-13 | Epoxy resin, epoxy resin composition thereof and cured product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001194802A JP5131506B2 (ja) | 2001-06-27 | 2001-06-27 | エポキシ樹脂 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003012763A JP2003012763A (ja) | 2003-01-15 |
| JP2003012763A5 true JP2003012763A5 (enExample) | 2007-12-06 |
| JP5131506B2 JP5131506B2 (ja) | 2013-01-30 |
Family
ID=19032878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001194802A Expired - Lifetime JP5131506B2 (ja) | 2001-06-27 | 2001-06-27 | エポキシ樹脂 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7332557B2 (enExample) |
| JP (1) | JP5131506B2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100168368A1 (en) * | 2004-06-17 | 2010-07-01 | Kukdo Chemical Co., Ltd. (Korean Corporation) | Epoxy Resin, Method for Producing Same and Epoxy Resin Composition Thereof |
| US7694894B2 (en) * | 2005-04-19 | 2010-04-13 | Warren Environmental, Inc. | Method and system for preheating epoxy coatings for spray application |
| US8919666B2 (en) * | 2005-04-19 | 2014-12-30 | Warren Environmental, Inc. | Method and system for preheating epoxy coatings for spray application |
| US9931653B2 (en) | 2005-04-19 | 2018-04-03 | Warren Environmental, Inc. | Method and system for preheating epoxy coatings for spray application |
| JP5371191B2 (ja) * | 2007-01-05 | 2013-12-18 | 日本特殊塗料株式会社 | 二液型常温硬化塗布型制振塗料組成物 |
| JP5136573B2 (ja) * | 2009-02-24 | 2013-02-06 | 日立化成工業株式会社 | ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板 |
| PL2558543T3 (pl) * | 2010-04-16 | 2018-01-31 | Swimc Llc | Kompozycja powłokowa do wyrobów opakowaniowych i sposoby powlekania |
| CN103097473B (zh) * | 2010-09-13 | 2016-03-30 | 住友金属矿山株式会社 | 底漆组合物 |
| NO2616520T3 (enExample) * | 2010-09-15 | 2018-07-21 | ||
| CA2825377C (en) * | 2011-02-07 | 2021-03-02 | Valspar Sourcing, Inc. | Coating compositions for containers and other articles and methods of coating |
| JP5995192B2 (ja) * | 2012-05-25 | 2016-09-21 | 株式会社大阪ソーダ | 導電性インク組成物 |
| US10526502B2 (en) | 2012-08-09 | 2020-01-07 | Swimc Llc | Container coating system |
| EP3483227B1 (en) | 2012-08-09 | 2020-12-16 | Swimc, LLC | Compositions for containers and other articles and methods of using same |
| EP2882818B1 (en) | 2012-08-09 | 2020-05-06 | Swimc Llc | Stabilizer and coating compositions thereof |
| CN104541210A (zh) | 2012-08-09 | 2015-04-22 | 威士伯采购公司 | 用于热响应记录材料的显影剂 |
| CN104582671B (zh) | 2012-08-09 | 2018-06-29 | 威士伯采购公司 | 牙科材料和制备方法 |
| EP2882792A4 (en) | 2012-08-09 | 2016-04-13 | Valspar Sourcing Inc | POLYCARBONATE |
| EP3122818B1 (en) | 2014-03-28 | 2022-08-31 | Swimc Llc | Polyester coating compositions containing polymers derived from cyclic carbonates |
| JP6746501B2 (ja) | 2014-04-14 | 2020-08-26 | ヴァルスパー・ソーシング・インコーポレーテッド | 容器及び他の物品のための組成物の調製方法並びにその使用方法 |
| TWI614275B (zh) | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | 用於製備聚合物的液體環氧樹脂組合物 |
| CN111031883B (zh) * | 2017-08-30 | 2022-04-01 | 富士胶片株式会社 | 内窥镜用粘接剂、固化物、内窥镜及内窥镜的制造方法 |
| KR102577534B1 (ko) * | 2018-12-21 | 2023-09-13 | 교세라 가부시키가이샤 | 반도체 밀봉용 성형 재료, 반도체 밀봉용 성형 재료의 제조 방법 및 그것을 사용한 반도체 장치 |
| CN114929773A (zh) * | 2019-11-21 | 2022-08-19 | Swimc有限公司 | 用于储存制品的粘附涂层的两部分环氧组合物 |
| TW202124498A (zh) * | 2019-12-25 | 2021-07-01 | 日商日鐵化學材料股份有限公司 | 環氧樹脂及其製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4072656A (en) * | 1976-05-24 | 1978-02-07 | Ici Americas Inc. | Glycidyl ethers derived from 3,3',5,5'-tetraalkyl-4,4'-dihydroxybiphenyl |
| JPH0689112B2 (ja) * | 1989-11-25 | 1994-11-09 | 松下電工株式会社 | 半導体封止用エポキシ樹脂組成物 |
| JPH04236215A (ja) * | 1991-01-16 | 1992-08-25 | Toshiba Chem Corp | 封止用樹脂組成物および半導体封止装置 |
| JP2888661B2 (ja) * | 1991-04-19 | 1999-05-10 | 株式会社東芝 | 注型用樹脂組成物 |
| JPH051210A (ja) * | 1991-06-25 | 1993-01-08 | Toshiba Chem Corp | 封止用樹脂組成物および半導体封止装置 |
| JPH0551431A (ja) * | 1991-08-26 | 1993-03-02 | Toray Ind Inc | 半導体封止用液状エポキシ樹脂組成物 |
| JPH0570562A (ja) * | 1991-09-10 | 1993-03-23 | Toshiba Chem Corp | 封止用樹脂組成物および半導体封止装置 |
| JP3115692B2 (ja) * | 1992-03-17 | 2000-12-11 | 東芝ケミカル株式会社 | エポキシ樹脂組成物および半導体封止装置 |
| JPH06239968A (ja) * | 1993-02-16 | 1994-08-30 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
| JPH0753669A (ja) * | 1993-08-11 | 1995-02-28 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
| JPH07316252A (ja) * | 1994-05-27 | 1995-12-05 | Sumitomo Chem Co Ltd | 誘電特性に優れるエポキシ樹脂の製造法および組成物 |
| JPH09249733A (ja) * | 1996-03-15 | 1997-09-22 | Toto Kasei Co Ltd | エポキシ樹脂及び該エポキシ樹脂を含有した硬化性組成物 |
| JP3641765B2 (ja) * | 1996-04-24 | 2005-04-27 | 東都化成株式会社 | エポキシ樹脂及び該エポキシ樹脂を含有した硬化性組成物 |
| JPH111544A (ja) * | 1997-04-18 | 1999-01-06 | Nippon Steel Chem Co Ltd | エポキシ樹脂組成物及び電子部品 |
| JP3933763B2 (ja) * | 1997-04-18 | 2007-06-20 | 新日鐵化学株式会社 | エポキシ樹脂組成物及び電子部品 |
| WO2002021620A1 (en) * | 2000-09-04 | 2002-03-14 | Nippon Steel Chemical Co., Ltd. | Separator for fuel cell, process for producing the same, and material therefor |
-
2001
- 2001-06-27 JP JP2001194802A patent/JP5131506B2/ja not_active Expired - Lifetime
-
2004
- 2004-01-13 US US10/755,447 patent/US7332557B2/en not_active Expired - Lifetime
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