JP2002543293A5 - - Google Patents

Download PDF

Info

Publication number
JP2002543293A5
JP2002543293A5 JP2000615426A JP2000615426A JP2002543293A5 JP 2002543293 A5 JP2002543293 A5 JP 2002543293A5 JP 2000615426 A JP2000615426 A JP 2000615426A JP 2000615426 A JP2000615426 A JP 2000615426A JP 2002543293 A5 JP2002543293 A5 JP 2002543293A5
Authority
JP
Japan
Prior art keywords
deposition surface
deposition
plasma
axis
beam axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000615426A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002543293A (ja
Filing date
Publication date
Priority claimed from CH00794/99A external-priority patent/CH694699A5/de
Application filed filed Critical
Publication of JP2002543293A publication Critical patent/JP2002543293A/ja
Publication of JP2002543293A5 publication Critical patent/JP2002543293A5/ja
Pending legal-status Critical Current

Links

JP2000615426A 1999-04-29 2000-04-11 材料のプラズマ利用反応性堆積方法の使用 Pending JP2002543293A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH00794/99A CH694699A5 (de) 1999-04-29 1999-04-29 Verfahren zur Herstellung von Silizium.
CH794/99 1999-04-29
PCT/CH2000/000208 WO2000066806A1 (de) 1999-04-29 2000-04-11 Verwendung eines verfahrens zur plasmaunterstützten reaktiven abscheidung von material

Publications (2)

Publication Number Publication Date
JP2002543293A JP2002543293A (ja) 2002-12-17
JP2002543293A5 true JP2002543293A5 (https=) 2007-05-31

Family

ID=4195351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000615426A Pending JP2002543293A (ja) 1999-04-29 2000-04-11 材料のプラズマ利用反応性堆積方法の使用

Country Status (8)

Country Link
US (1) US6685994B1 (https=)
EP (1) EP1187945B1 (https=)
JP (1) JP2002543293A (https=)
CH (1) CH694699A5 (https=)
DE (1) DE50009169D1 (https=)
HK (1) HK1044571B (https=)
TW (1) TW507020B (https=)
WO (1) WO2000066806A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10149588B4 (de) * 2001-10-08 2017-09-07 Oerlikon Trading Ag, Trübbach Verfahren zur Diamantbeschichtung von Substraten
DE102004061632B4 (de) * 2004-12-17 2009-06-18 Auer Lighting Gmbh Innenbeschichtung von Entladungsgefäßen, Entladungsgefäße aus Quarzglas und deren Verwendung
DE102006003847B4 (de) * 2006-01-26 2011-08-18 Siemens AG, 80333 Verfahren und Vorrichtung zum Herstellen eines polykristallinen Keramikfilms auf einem Substrat
KR101046520B1 (ko) 2007-09-07 2011-07-04 어플라이드 머티어리얼스, 인코포레이티드 내부 챔버 상의 부산물 막 증착을 제어하기 위한 pecvd 시스템에서의 소스 가스 흐름 경로 제어
JP2011021256A (ja) * 2009-07-16 2011-02-03 Kochi Univ Of Technology ナノ結晶シリコン薄膜の成膜方法及びナノ結晶シリコン薄膜、並びに該薄膜を成膜する成膜装置
US10011920B2 (en) * 2011-02-23 2018-07-03 International Business Machines Corporation Low-temperature selective epitaxial growth of silicon for device integration

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188670A (en) * 1981-05-13 1982-11-19 Hitachi Ltd Treatment of electrically conductive member
CH664768A5 (de) * 1985-06-20 1988-03-31 Balzers Hochvakuum Verfahren zur beschichtung von substraten in einer vakuumkammer.
DE4029270C1 (https=) * 1990-09-14 1992-04-09 Balzers Ag, Balzers, Li
US5453168A (en) * 1993-08-25 1995-09-26 Tulip Memory Systems, Inc. Method for forming protective overcoatings for metallic-film magnetic-recording mediums
US5433786A (en) * 1993-08-27 1995-07-18 The Dow Chemical Company Apparatus for plasma enhanced chemical vapor deposition comprising shower head electrode with magnet disposed therein
JP3166919B2 (ja) * 1993-10-29 2001-05-14 ウンアクシス バルツェルス アクチェンゲゼルシャフト 被覆体とこの被覆体を製造する方法およびその使用
US5888593A (en) * 1994-03-03 1999-03-30 Monsanto Company Ion beam process for deposition of highly wear-resistant optical coatings
DE59603312D1 (de) * 1995-01-25 1999-11-18 Balzers Ag Liechtenstein Verfahren zur reaktiven Schichtabscheidung
US5858477A (en) * 1996-12-10 1999-01-12 Akashic Memories Corporation Method for producing recording media having protective overcoats of highly tetrahedral amorphous carbon
JP2965293B1 (ja) * 1998-11-10 1999-10-18 川崎重工業株式会社 電子ビーム励起プラズマ発生装置

Similar Documents

Publication Publication Date Title
US4471003A (en) Magnetoplasmadynamic apparatus and process for the separation and deposition of materials
TWI252523B (en) Method for passivating a semiconductor substrate
TW316324B (https=)
JP2011508434A5 (https=)
EP2422359A2 (en) Enhanced scavenging of residual fluorine radicals using silicon coating on process chamber walls
JPS593018A (ja) プラズマデポジシヨンによるシリコン系膜の製造方法
KR102244994B1 (ko) AlN을 함유한 압전막을 증착하는 방법 및 AlN을 함유한 압전막
WO2010110099A1 (ja) プラズマ処理装置およびこれを用いたアモルファスシリコン薄膜の製造方法
JPH06252059A (ja) 成膜方法及び成膜装置
Wagner et al. Kinetic study of the heterogeneous Si/H system under low-pressure plasma conditions by means of mass spectrometry
JP2002543293A5 (https=)
Xu et al. Characterization of CNx films prepared by twinned ECR plasma source enhanced DC magnetron sputtering
JP2003504515A5 (https=)
Pribil et al. Deposition of electronic quality amorphous silicon, a-Si: H, thin films by a hollow cathode plasma-jet reactive sputtering system
JP3647507B2 (ja) ガスクラスターおよびガスクラスターイオンの 形成方法
Lisovskiy et al. Rf discharge dissociative mode in NF3 and SiH4
Takagi et al. Film formation technique by ionized-cluster beam
HK1044571A1 (en) Method for the plasma-supported reactive deposition of a material
JP2832385B2 (ja) シリコン系薄膜の形成方法
JP2002030432A (ja) スパッタリング装置およびスパッタリング方法
CN1363722A (zh) 用电子回旋共振微波等离子体制备超薄氮化硅薄膜
JPH06280027A (ja) プラズマ処理方法及び装置
JPS6348817A (ja) エピタキシヤル成長方法
JP3007579B2 (ja) シリコン薄膜の製造方法
JPS6150372B2 (https=)