HK1044571B - 等離子體材料活性沉積的方法 - Google Patents
等離子體材料活性沉積的方法Info
- Publication number
- HK1044571B HK1044571B HK02106186.9A HK02106186A HK1044571B HK 1044571 B HK1044571 B HK 1044571B HK 02106186 A HK02106186 A HK 02106186A HK 1044571 B HK1044571 B HK 1044571B
- Authority
- HK
- Hong Kong
- Prior art keywords
- plasma
- reactive deposition
- supported reactive
- supported
- deposition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/503—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using dc or ac discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00794/99A CH694699A5 (de) | 1999-04-29 | 1999-04-29 | Verfahren zur Herstellung von Silizium. |
PCT/CH2000/000208 WO2000066806A1 (de) | 1999-04-29 | 2000-04-11 | Verwendung eines verfahrens zur plasmaunterstützten reaktiven abscheidung von material |
Publications (2)
Publication Number | Publication Date |
---|---|
HK1044571A1 HK1044571A1 (en) | 2002-10-25 |
HK1044571B true HK1044571B (zh) | 2005-08-05 |
Family
ID=4195351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02106186.9A HK1044571B (zh) | 1999-04-29 | 2002-08-22 | 等離子體材料活性沉積的方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6685994B1 (zh) |
EP (1) | EP1187945B1 (zh) |
JP (1) | JP2002543293A (zh) |
CH (1) | CH694699A5 (zh) |
DE (1) | DE50009169D1 (zh) |
HK (1) | HK1044571B (zh) |
TW (1) | TW507020B (zh) |
WO (1) | WO2000066806A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10149588B4 (de) * | 2001-10-08 | 2017-09-07 | Oerlikon Trading Ag, Trübbach | Verfahren zur Diamantbeschichtung von Substraten |
DE102004061632B4 (de) * | 2004-12-17 | 2009-06-18 | Auer Lighting Gmbh | Innenbeschichtung von Entladungsgefäßen, Entladungsgefäße aus Quarzglas und deren Verwendung |
DE102006003847B4 (de) * | 2006-01-26 | 2011-08-18 | Siemens AG, 80333 | Verfahren und Vorrichtung zum Herstellen eines polykristallinen Keramikfilms auf einem Substrat |
KR101046520B1 (ko) | 2007-09-07 | 2011-07-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 챔버 상의 부산물 막 증착을 제어하기 위한 pecvd 시스템에서의 소스 가스 흐름 경로 제어 |
JP2011021256A (ja) * | 2009-07-16 | 2011-02-03 | Kochi Univ Of Technology | ナノ結晶シリコン薄膜の成膜方法及びナノ結晶シリコン薄膜、並びに該薄膜を成膜する成膜装置 |
US10011920B2 (en) * | 2011-02-23 | 2018-07-03 | International Business Machines Corporation | Low-temperature selective epitaxial growth of silicon for device integration |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188670A (en) * | 1981-05-13 | 1982-11-19 | Hitachi Ltd | Treatment of electrically conductive member |
CH664768A5 (de) * | 1985-06-20 | 1988-03-31 | Balzers Hochvakuum | Verfahren zur beschichtung von substraten in einer vakuumkammer. |
DE4029270C1 (zh) * | 1990-09-14 | 1992-04-09 | Balzers Ag, Balzers, Li | |
US5453168A (en) * | 1993-08-25 | 1995-09-26 | Tulip Memory Systems, Inc. | Method for forming protective overcoatings for metallic-film magnetic-recording mediums |
US5433786A (en) * | 1993-08-27 | 1995-07-18 | The Dow Chemical Company | Apparatus for plasma enhanced chemical vapor deposition comprising shower head electrode with magnet disposed therein |
PL314108A1 (en) * | 1993-10-29 | 1996-08-19 | Balzers Hochvakuum | Coated formpiece, method of making same and application thereof |
US5888593A (en) * | 1994-03-03 | 1999-03-30 | Monsanto Company | Ion beam process for deposition of highly wear-resistant optical coatings |
DE59603312D1 (de) * | 1995-01-25 | 1999-11-18 | Balzers Ag Liechtenstein | Verfahren zur reaktiven Schichtabscheidung |
US5858477A (en) * | 1996-12-10 | 1999-01-12 | Akashic Memories Corporation | Method for producing recording media having protective overcoats of highly tetrahedral amorphous carbon |
JP2965293B1 (ja) * | 1998-11-10 | 1999-10-18 | 川崎重工業株式会社 | 電子ビーム励起プラズマ発生装置 |
-
1999
- 1999-04-29 CH CH00794/99A patent/CH694699A5/de not_active IP Right Cessation
-
2000
- 2000-04-11 DE DE50009169T patent/DE50009169D1/de not_active Expired - Lifetime
- 2000-04-11 US US10/031,258 patent/US6685994B1/en not_active Expired - Fee Related
- 2000-04-11 WO PCT/CH2000/000208 patent/WO2000066806A1/de active IP Right Grant
- 2000-04-11 JP JP2000615426A patent/JP2002543293A/ja active Pending
- 2000-04-11 EP EP00914006A patent/EP1187945B1/de not_active Expired - Lifetime
- 2000-04-20 TW TW089107450A patent/TW507020B/zh not_active IP Right Cessation
-
2002
- 2002-08-22 HK HK02106186.9A patent/HK1044571B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1187945A1 (de) | 2002-03-20 |
CH694699A5 (de) | 2005-06-15 |
TW507020B (en) | 2002-10-21 |
WO2000066806A1 (de) | 2000-11-09 |
JP2002543293A (ja) | 2002-12-17 |
DE50009169D1 (de) | 2005-02-10 |
EP1187945B1 (de) | 2005-01-05 |
HK1044571A1 (en) | 2002-10-25 |
US6685994B1 (en) | 2004-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20100411 |