JP2002530205A - レーザーアブレーションによる特徴部形成装置 - Google Patents

レーザーアブレーションによる特徴部形成装置

Info

Publication number
JP2002530205A
JP2002530205A JP2000583667A JP2000583667A JP2002530205A JP 2002530205 A JP2002530205 A JP 2002530205A JP 2000583667 A JP2000583667 A JP 2000583667A JP 2000583667 A JP2000583667 A JP 2000583667A JP 2002530205 A JP2002530205 A JP 2002530205A
Authority
JP
Japan
Prior art keywords
disk
substrate
laser
nozzles
longitudinal axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000583667A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002530205A5 (enExample
Inventor
ダニエル・ジェイ・トレッドウェル
カーティス・エル・シューメイカー
Original Assignee
ミネソタ マイニング アンド マニュファクチャリング カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミネソタ マイニング アンド マニュファクチャリング カンパニー filed Critical ミネソタ マイニング アンド マニュファクチャリング カンパニー
Publication of JP2002530205A publication Critical patent/JP2002530205A/ja
Publication of JP2002530205A5 publication Critical patent/JP2002530205A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2000583667A 1998-11-20 1999-03-17 レーザーアブレーションによる特徴部形成装置 Withdrawn JP2002530205A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/197,127 1998-11-20
US09/197,127 US6120976A (en) 1998-11-20 1998-11-20 Laser ablated feature formation method
PCT/US1999/005771 WO2000030800A1 (en) 1998-11-20 1999-03-17 Laser ablated feature formation device

Publications (2)

Publication Number Publication Date
JP2002530205A true JP2002530205A (ja) 2002-09-17
JP2002530205A5 JP2002530205A5 (enExample) 2006-05-11

Family

ID=22728155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000583667A Withdrawn JP2002530205A (ja) 1998-11-20 1999-03-17 レーザーアブレーションによる特徴部形成装置

Country Status (7)

Country Link
US (1) US6120976A (enExample)
EP (1) EP1131183B1 (enExample)
JP (1) JP2002530205A (enExample)
CN (1) CN1326392A (enExample)
AU (1) AU3187999A (enExample)
DE (1) DE69904753T2 (enExample)
WO (1) WO2000030800A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129249A1 (ja) * 2014-02-25 2015-09-03 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッドおよびレーザ加工システム
JPWO2015141196A1 (ja) * 2014-03-17 2017-04-06 パナソニックＩｐマネジメント株式会社 レーザ加工ロボット
JP2017164754A (ja) * 2016-03-14 2017-09-21 株式会社ディスコ レーザー加工装置およびレーザー加工方法
WO2018139019A1 (ja) * 2017-01-25 2018-08-02 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッド及びそれを用いたレーザ加工装置

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555449B1 (en) * 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
US6426481B1 (en) * 1999-06-29 2002-07-30 Canon Kabushiki Kaisha Method for manufacturing discharge nozzle of liquid jet recording head and method for manufacturing the same head
US6573531B1 (en) * 1999-09-03 2003-06-03 The Trustees Of Columbia University In The City Of New York Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures
US7700270B1 (en) * 2000-01-04 2010-04-20 University Of Central Florida Research Foundation, Inc. Double-bragg-grating scanning transmitter/receiver
US6830993B1 (en) 2000-03-21 2004-12-14 The Trustees Of Columbia University In The City Of New York Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
US6433303B1 (en) * 2000-03-31 2002-08-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus using laser pulses to make an array of microcavity holes
US7115503B2 (en) 2000-10-10 2006-10-03 The Trustees Of Columbia University In The City Of New York Method and apparatus for processing thin metal layers
CN1200320C (zh) * 2000-11-27 2005-05-04 纽约市哥伦比亚大学托管会 用激光结晶化法加工衬底上半导体薄膜区域的方法和掩模投影系统
NL1016735C2 (nl) * 2000-11-29 2002-05-31 Ocu Technologies B V Werkwijze voor het vormen van een nozzle in een orgaan voor een inkjet printkop, een nozzle-orgaan, een inkjet printkop voorzien van dit nozzle-orgaan en een inkjet printer voorzien van een dergelijke printkop.
US6621044B2 (en) * 2001-01-18 2003-09-16 Anvik Corporation Dual-beam materials-processing system
TW556350B (en) * 2001-08-27 2003-10-01 Univ Columbia A method to increase device-to-device uniformity for polycrystalline thin-film transistors by deliberately mis-aligning the microstructure relative to the channel region
SG96643A1 (en) * 2001-09-10 2003-06-16 Inst Data Storage Method and apparatus for cleaning inkjet cartridges
US6577448B2 (en) 2001-09-25 2003-06-10 Siemens Dematic Electronic Assembly Systems, Inc. Laser system by modulation of power and energy
WO2003084688A2 (en) * 2002-04-01 2003-10-16 The Trustees Of Columbia University In The City Of New York Method and system for providing a thin film
US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining
JP4879486B2 (ja) * 2002-08-19 2012-02-22 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 基板上のフィルム領域をレーザ結晶化処理してほぼ均一にするプロセス及びシステム、及びこのフィルム領域の構造
AU2003258289A1 (en) 2002-08-19 2004-03-03 The Trustees Of Columbia University In The City Of New York A single-shot semiconductor processing system and method having various irradiation patterns
WO2004017381A2 (en) * 2002-08-19 2004-02-26 The Trustees Of Columbia University In The City Of New York Process and system for laser crystallization processing of film regions on a substrate to minimize edge areas, and structure of such film regions
WO2004017382A2 (en) * 2002-08-19 2004-02-26 The Trustees Of Columbia University In The City Of New York Process and system for laser crystallization processing of film regions on a substrate to provide substantial uniformity within areas in such regions and edge areas thereof, and a structure of such film regions
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
WO2004075263A2 (en) 2003-02-19 2004-09-02 The Trustees Of Columbia University In The City Of New York System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
US7364952B2 (en) 2003-09-16 2008-04-29 The Trustees Of Columbia University In The City Of New York Systems and methods for processing thin films
WO2005029550A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for producing crystalline thin films with a uniform crystalline orientation
WO2005029549A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for facilitating bi-directional growth
WO2005029546A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
US7318866B2 (en) 2003-09-16 2008-01-15 The Trustees Of Columbia University In The City Of New York Systems and methods for inducing crystallization of thin films using multiple optical paths
WO2005029551A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions
WO2005029548A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York System and process for providing multiple beam sequential lateral solidification
TWI366859B (en) 2003-09-16 2012-06-21 Univ Columbia System and method of enhancing the width of polycrystalline grains produced via sequential lateral solidification using a modified mask pattern
US7164152B2 (en) * 2003-09-16 2007-01-16 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
WO2005034193A2 (en) 2003-09-19 2005-04-14 The Trustees Of Columbia University In The City Ofnew York Single scan irradiation for crystallization of thin films
DE102004042337A1 (de) * 2004-09-01 2006-03-30 Innovavent Gmbh Vorrichtung und Verfahren zum Homogenisieren von Laserstrahlung sowie eine Laseranlage unter Verwendung einer solchen Vorrichtung und eines solchen Verfahrens
US7645337B2 (en) 2004-11-18 2010-01-12 The Trustees Of Columbia University In The City Of New York Systems and methods for creating crystallographic-orientation controlled poly-silicon films
US8221544B2 (en) 2005-04-06 2012-07-17 The Trustees Of Columbia University In The City Of New York Line scan sequential lateral solidification of thin films
US8598588B2 (en) 2005-12-05 2013-12-03 The Trustees Of Columbia University In The City Of New York Systems and methods for processing a film, and thin films
US8614471B2 (en) 2007-09-21 2013-12-24 The Trustees Of Columbia University In The City Of New York Collections of laterally crystallized semiconductor islands for use in thin film transistors
US8415670B2 (en) 2007-09-25 2013-04-09 The Trustees Of Columbia University In The City Of New York Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films
US8012861B2 (en) 2007-11-21 2011-09-06 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
WO2009067688A1 (en) 2007-11-21 2009-05-28 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
US8557040B2 (en) 2007-11-21 2013-10-15 The Trustees Of Columbia University In The City Of New York Systems and methods for preparation of epitaxially textured thick films
WO2009111340A2 (en) 2008-02-29 2009-09-11 The Trustees Of Columbia University In The City Of New York Flash lamp annealing crystallization for large area thin films
WO2010056990A1 (en) 2008-11-14 2010-05-20 The Trustees Of Columbia University In The City Of New York Systems and methods for the crystallization of thin films
US9087696B2 (en) 2009-11-03 2015-07-21 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse partial melt film processing
US9646831B2 (en) 2009-11-03 2017-05-09 The Trustees Of Columbia University In The City Of New York Advanced excimer laser annealing for thin films
EP2504059A4 (en) 2009-11-24 2014-01-22 Univ Columbia SYSTEMS AND METHOD FOR SEQUENTIAL SIDE FIXING WITH NONPERIODIC IMPULSES
DE102010049460A1 (de) 2010-09-13 2012-03-15 Laser- Und Medizin-Technologie Gmbh, Berlin Trepanieroptik
DE102012111771B4 (de) 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
US9914985B2 (en) * 2014-09-09 2018-03-13 G.C. Laser Systems, Inc. Laser ablation and processing methods and systems

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1818410A (en) * 1927-02-07 1931-08-11 First Nat Bank Of Chattanooga Optical apparatus
GB1521931A (en) * 1976-01-31 1978-08-16 Ferranti Ltd Optical apparatus
SU934820A1 (ru) * 1980-07-23 1985-09-30 Горьковский государственный университет им.Н.И.Лобачевского Устройство сканировани лазерного пучка
US4733944A (en) * 1986-01-24 1988-03-29 Xmr, Inc. Optical beam integration system
US4923772A (en) * 1986-10-29 1990-05-08 Kirch Steven J High energy laser mask and method of making same
EP0280414A1 (en) * 1987-02-02 1988-08-31 Taunton Technologies, Inc. Sculpture apparatus for correcting curvature of the cornea
JPS6448693A (en) * 1987-08-20 1989-02-23 Mitsubishi Electric Corp Laser beam machine
US4871904A (en) * 1987-12-28 1989-10-03 Symbol Technologies, Inc. Multidirectional optical scanner
US4822974A (en) * 1988-02-18 1989-04-18 United Technologies Corporation Laser hold drilling system with lens and two wedge prisms including axial displacement of at least one prism
US4940881A (en) * 1989-09-28 1990-07-10 Tamarack Scientific Co., Inc. Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions
JP2599513B2 (ja) * 1990-06-25 1997-04-09 インターナショナル・ビジネス・マシーンズ・コーポレイション アブレーション・マスク
JPH04344337A (ja) * 1991-05-21 1992-11-30 Toshiba Corp 光学装置
IL100664A0 (en) * 1992-01-15 1992-09-06 Laser Ind Ltd Method and apparatus for controlling a laser beam
GB9202434D0 (en) * 1992-02-05 1992-03-18 Xaar Ltd Method of and apparatus for forming nozzles
DE4220705C2 (de) * 1992-06-24 2003-03-13 Lambda Physik Ag Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen
US5378137A (en) * 1993-05-10 1995-01-03 Hewlett-Packard Company Mask design for forming tapered inkjet nozzles
EP0633541A1 (en) * 1993-07-06 1995-01-11 Opticon Sensors Europe B.V. Scanning device
US5610733A (en) * 1994-02-28 1997-03-11 Digital Optics Corporation Beam-homogenizer
US5742426A (en) * 1995-05-25 1998-04-21 York; Kenneth K. Laser beam treatment pattern smoothing device and laser beam treatment pattern modulator
US5609778A (en) * 1995-06-02 1997-03-11 International Business Machines Corporation Process for high contrast marking on surfaces using lasers

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129249A1 (ja) * 2014-02-25 2015-09-03 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッドおよびレーザ加工システム
JPWO2015129249A1 (ja) * 2014-02-25 2017-03-30 パナソニックＩｐマネジメント株式会社 レーザ加工システム
US9889522B2 (en) 2014-02-25 2018-02-13 Panasonic Intellectual Property Management Co., Ltd. Laser processing system
JPWO2015141196A1 (ja) * 2014-03-17 2017-04-06 パナソニックＩｐマネジメント株式会社 レーザ加工ロボット
US10101724B2 (en) 2014-03-17 2018-10-16 Panasonic Intellectual Property Management Co., Ltd. Laser machining robot
JP2017164754A (ja) * 2016-03-14 2017-09-21 株式会社ディスコ レーザー加工装置およびレーザー加工方法
WO2018139019A1 (ja) * 2017-01-25 2018-08-02 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッド及びそれを用いたレーザ加工装置
JPWO2018139019A1 (ja) * 2017-01-25 2019-11-14 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッド及びそれを用いたレーザ加工装置

Also Published As

Publication number Publication date
EP1131183A1 (en) 2001-09-12
US6120976A (en) 2000-09-19
WO2000030800A1 (en) 2000-06-02
EP1131183B1 (en) 2003-01-02
DE69904753D1 (de) 2003-02-06
AU3187999A (en) 2000-06-13
CN1326392A (zh) 2001-12-12
DE69904753T2 (de) 2003-10-16

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