JP2002530205A - レーザーアブレーションによる特徴部形成装置 - Google Patents

レーザーアブレーションによる特徴部形成装置

Info

Publication number
JP2002530205A
JP2002530205A JP2000583667A JP2000583667A JP2002530205A JP 2002530205 A JP2002530205 A JP 2002530205A JP 2000583667 A JP2000583667 A JP 2000583667A JP 2000583667 A JP2000583667 A JP 2000583667A JP 2002530205 A JP2002530205 A JP 2002530205A
Authority
JP
Japan
Prior art keywords
disk
substrate
laser
nozzles
longitudinal axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000583667A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002530205A5 (enExample
Inventor
ダニエル・ジェイ・トレッドウェル
カーティス・エル・シューメイカー
Original Assignee
ミネソタ マイニング アンド マニュファクチャリング カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミネソタ マイニング アンド マニュファクチャリング カンパニー filed Critical ミネソタ マイニング アンド マニュファクチャリング カンパニー
Publication of JP2002530205A publication Critical patent/JP2002530205A/ja
Publication of JP2002530205A5 publication Critical patent/JP2002530205A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • B41J2/1634Manufacturing processes machining laser machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/162Manufacturing of the nozzle plates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2000583667A 1998-11-20 1999-03-17 レーザーアブレーションによる特徴部形成装置 Withdrawn JP2002530205A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/197,127 1998-11-20
US09/197,127 US6120976A (en) 1998-11-20 1998-11-20 Laser ablated feature formation method
PCT/US1999/005771 WO2000030800A1 (en) 1998-11-20 1999-03-17 Laser ablated feature formation device

Publications (2)

Publication Number Publication Date
JP2002530205A true JP2002530205A (ja) 2002-09-17
JP2002530205A5 JP2002530205A5 (enExample) 2006-05-11

Family

ID=22728155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000583667A Withdrawn JP2002530205A (ja) 1998-11-20 1999-03-17 レーザーアブレーションによる特徴部形成装置

Country Status (7)

Country Link
US (1) US6120976A (enExample)
EP (1) EP1131183B1 (enExample)
JP (1) JP2002530205A (enExample)
CN (1) CN1326392A (enExample)
AU (1) AU3187999A (enExample)
DE (1) DE69904753T2 (enExample)
WO (1) WO2000030800A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129249A1 (ja) * 2014-02-25 2015-09-03 パナソニックIpマネジメント株式会社 レーザ加工ヘッドおよびレーザ加工システム
JPWO2015141196A1 (ja) * 2014-03-17 2017-04-06 パナソニックIpマネジメント株式会社 レーザ加工ロボット
JP2017164754A (ja) * 2016-03-14 2017-09-21 株式会社ディスコ レーザー加工装置およびレーザー加工方法
WO2018139019A1 (ja) * 2017-01-25 2018-08-02 パナソニックIpマネジメント株式会社 レーザ加工ヘッド及びそれを用いたレーザ加工装置

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WO2015129249A1 (ja) * 2014-02-25 2015-09-03 パナソニックIpマネジメント株式会社 レーザ加工ヘッドおよびレーザ加工システム
JPWO2015129249A1 (ja) * 2014-02-25 2017-03-30 パナソニックIpマネジメント株式会社 レーザ加工システム
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JPWO2015141196A1 (ja) * 2014-03-17 2017-04-06 パナソニックIpマネジメント株式会社 レーザ加工ロボット
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JP2017164754A (ja) * 2016-03-14 2017-09-21 株式会社ディスコ レーザー加工装置およびレーザー加工方法
WO2018139019A1 (ja) * 2017-01-25 2018-08-02 パナソニックIpマネジメント株式会社 レーザ加工ヘッド及びそれを用いたレーザ加工装置
JPWO2018139019A1 (ja) * 2017-01-25 2019-11-14 パナソニックIpマネジメント株式会社 レーザ加工ヘッド及びそれを用いたレーザ加工装置

Also Published As

Publication number Publication date
US6120976A (en) 2000-09-19
AU3187999A (en) 2000-06-13
CN1326392A (zh) 2001-12-12
EP1131183B1 (en) 2003-01-02
DE69904753D1 (de) 2003-02-06
EP1131183A1 (en) 2001-09-12
DE69904753T2 (de) 2003-10-16
WO2000030800A1 (en) 2000-06-02

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