CN1326392A - 激光烧蚀特征形成装置 - Google Patents

激光烧蚀特征形成装置 Download PDF

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Publication number
CN1326392A
CN1326392A CN99813422A CN99813422A CN1326392A CN 1326392 A CN1326392 A CN 1326392A CN 99813422 A CN99813422 A CN 99813422A CN 99813422 A CN99813422 A CN 99813422A CN 1326392 A CN1326392 A CN 1326392A
Authority
CN
China
Prior art keywords
substrate
nozzle
disks
dish
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN99813422A
Other languages
English (en)
Chinese (zh)
Inventor
D·J·特雷德韦尔
C·L·休梅克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of CN1326392A publication Critical patent/CN1326392A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
CN99813422A 1998-11-20 1999-03-17 激光烧蚀特征形成装置 Pending CN1326392A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/197,127 1998-11-20
US09/197,127 US6120976A (en) 1998-11-20 1998-11-20 Laser ablated feature formation method

Publications (1)

Publication Number Publication Date
CN1326392A true CN1326392A (zh) 2001-12-12

Family

ID=22728155

Family Applications (1)

Application Number Title Priority Date Filing Date
CN99813422A Pending CN1326392A (zh) 1998-11-20 1999-03-17 激光烧蚀特征形成装置

Country Status (7)

Country Link
US (1) US6120976A (enExample)
EP (1) EP1131183B1 (enExample)
JP (1) JP2002530205A (enExample)
CN (1) CN1326392A (enExample)
AU (1) AU3187999A (enExample)
DE (1) DE69904753T2 (enExample)
WO (1) WO2000030800A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106029290A (zh) * 2014-02-25 2016-10-12 松下知识产权经营株式会社 激光加工头以及激光加工系统
CN110198804A (zh) * 2017-01-25 2019-09-03 松下知识产权经营株式会社 激光加工头以及使用其的激光加工装置

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555449B1 (en) 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
US6426481B1 (en) * 1999-06-29 2002-07-30 Canon Kabushiki Kaisha Method for manufacturing discharge nozzle of liquid jet recording head and method for manufacturing the same head
US6573531B1 (en) * 1999-09-03 2003-06-03 The Trustees Of Columbia University In The City Of New York Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures
US7700270B1 (en) * 2000-01-04 2010-04-20 University Of Central Florida Research Foundation, Inc. Double-bragg-grating scanning transmitter/receiver
US6830993B1 (en) * 2000-03-21 2004-12-14 The Trustees Of Columbia University In The City Of New York Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
US6433303B1 (en) * 2000-03-31 2002-08-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus using laser pulses to make an array of microcavity holes
MXPA02005590A (es) * 2000-10-10 2002-09-30 Univ Columbia Metodo y aparato para procesar capas de metal delgadas.
TW546684B (en) * 2000-11-27 2003-08-11 Univ Columbia Process and mask projection system for laser crystallization processing of semiconductor film regions on a substrate
NL1016735C2 (nl) * 2000-11-29 2002-05-31 Ocu Technologies B V Werkwijze voor het vormen van een nozzle in een orgaan voor een inkjet printkop, een nozzle-orgaan, een inkjet printkop voorzien van dit nozzle-orgaan en een inkjet printer voorzien van een dergelijke printkop.
US6621044B2 (en) * 2001-01-18 2003-09-16 Anvik Corporation Dual-beam materials-processing system
JP2005525689A (ja) * 2001-08-27 2005-08-25 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク ミクロ構造の非整列による多結晶薄膜トランジスタの均一性の改善
SG96643A1 (en) * 2001-09-10 2003-06-16 Inst Data Storage Method and apparatus for cleaning inkjet cartridges
US6577448B2 (en) 2001-09-25 2003-06-10 Siemens Dematic Electronic Assembly Systems, Inc. Laser system by modulation of power and energy
AU2003220611A1 (en) * 2002-04-01 2003-10-20 The Trustees Of Columbia University In The City Of New York Method and system for providing a thin film
US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining
AU2003258288A1 (en) * 2002-08-19 2004-03-03 The Trustees Of Columbia University In The City Of New York Process and system for processing a thin film sample and thin film structure
TWI378307B (en) * 2002-08-19 2012-12-01 Univ Columbia Process and system for laser crystallization processing of film regions on a substrate to minimize edge areas, and structure of such film regions
AU2003258289A1 (en) 2002-08-19 2004-03-03 The Trustees Of Columbia University In The City Of New York A single-shot semiconductor processing system and method having various irradiation patterns
JP5030382B2 (ja) * 2002-08-19 2012-09-19 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 基板上のフィルム領域を処理して、こうした領域内及びその端部領域をほぼ均一にするレーザ結晶化プロセス及びシステム
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
JP5164378B2 (ja) * 2003-02-19 2013-03-21 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 逐次的横方向結晶化技術を用いて結晶化させた複数の半導体薄膜フィルムを処理するシステム及びプロセス
WO2005029546A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
WO2005029551A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions
US7318866B2 (en) 2003-09-16 2008-01-15 The Trustees Of Columbia University In The City Of New York Systems and methods for inducing crystallization of thin films using multiple optical paths
WO2005029547A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Enhancing the width of polycrystalline grains with mask
WO2005029549A2 (en) 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for facilitating bi-directional growth
US7164152B2 (en) * 2003-09-16 2007-01-16 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
US7364952B2 (en) 2003-09-16 2008-04-29 The Trustees Of Columbia University In The City Of New York Systems and methods for processing thin films
WO2005029550A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for producing crystalline thin films with a uniform crystalline orientation
WO2005029548A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York System and process for providing multiple beam sequential lateral solidification
WO2005034193A2 (en) 2003-09-19 2005-04-14 The Trustees Of Columbia University In The City Ofnew York Single scan irradiation for crystallization of thin films
DE102004042337A1 (de) * 2004-09-01 2006-03-30 Innovavent Gmbh Vorrichtung und Verfahren zum Homogenisieren von Laserstrahlung sowie eine Laseranlage unter Verwendung einer solchen Vorrichtung und eines solchen Verfahrens
US7645337B2 (en) 2004-11-18 2010-01-12 The Trustees Of Columbia University In The City Of New York Systems and methods for creating crystallographic-orientation controlled poly-silicon films
US8221544B2 (en) 2005-04-06 2012-07-17 The Trustees Of Columbia University In The City Of New York Line scan sequential lateral solidification of thin films
WO2007067541A2 (en) 2005-12-05 2007-06-14 The Trustees Of Columbia University In The City Of New York Systems and methods for processing a film, and thin films
TW200942935A (en) 2007-09-21 2009-10-16 Univ Columbia Collections of laterally crystallized semiconductor islands for use in thin film transistors and systems and methods for making same
WO2009042784A1 (en) 2007-09-25 2009-04-02 The Trustees Of Columbia University In The City Of New York Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films
WO2009067688A1 (en) 2007-11-21 2009-05-28 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
US8012861B2 (en) 2007-11-21 2011-09-06 The Trustees Of Columbia University In The City Of New York Systems and methods for preparing epitaxially textured polycrystalline films
EP2212913A4 (en) 2007-11-21 2013-10-30 Univ Columbia SYSTEMS AND METHOD FOR PRODUCING EPITACTIC STRUCTURED THICK FILMS
WO2009111340A2 (en) 2008-02-29 2009-09-11 The Trustees Of Columbia University In The City Of New York Flash lamp annealing crystallization for large area thin films
KR20110094022A (ko) 2008-11-14 2011-08-19 더 트러스티이스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 박막 결정화를 위한 시스템 및 방법
US9087696B2 (en) 2009-11-03 2015-07-21 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse partial melt film processing
US8440581B2 (en) 2009-11-24 2013-05-14 The Trustees Of Columbia University In The City Of New York Systems and methods for non-periodic pulse sequential lateral solidification
US9646831B2 (en) 2009-11-03 2017-05-09 The Trustees Of Columbia University In The City Of New York Advanced excimer laser annealing for thin films
DE102010049460A1 (de) 2010-09-13 2012-03-15 Laser- Und Medizin-Technologie Gmbh, Berlin Trepanieroptik
DE102012111771B4 (de) 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
CN106103015B (zh) 2014-03-17 2019-05-10 松下知识产权经营株式会社 激光加工机器人
US9914985B2 (en) * 2014-09-09 2018-03-13 G.C. Laser Systems, Inc. Laser ablation and processing methods and systems
JP2017164754A (ja) * 2016-03-14 2017-09-21 株式会社ディスコ レーザー加工装置およびレーザー加工方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1818410A (en) * 1927-02-07 1931-08-11 First Nat Bank Of Chattanooga Optical apparatus
GB1521931A (en) * 1976-01-31 1978-08-16 Ferranti Ltd Optical apparatus
SU934820A1 (ru) * 1980-07-23 1985-09-30 Горьковский государственный университет им.Н.И.Лобачевского Устройство сканировани лазерного пучка
US4733944A (en) * 1986-01-24 1988-03-29 Xmr, Inc. Optical beam integration system
US4923772A (en) * 1986-10-29 1990-05-08 Kirch Steven J High energy laser mask and method of making same
EP0280414A1 (en) * 1987-02-02 1988-08-31 Taunton Technologies, Inc. Sculpture apparatus for correcting curvature of the cornea
JPS6448693A (en) * 1987-08-20 1989-02-23 Mitsubishi Electric Corp Laser beam machine
US4871904A (en) * 1987-12-28 1989-10-03 Symbol Technologies, Inc. Multidirectional optical scanner
US4822974A (en) * 1988-02-18 1989-04-18 United Technologies Corporation Laser hold drilling system with lens and two wedge prisms including axial displacement of at least one prism
US4940881A (en) * 1989-09-28 1990-07-10 Tamarack Scientific Co., Inc. Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions
JP2599513B2 (ja) * 1990-06-25 1997-04-09 インターナショナル・ビジネス・マシーンズ・コーポレイション アブレーション・マスク
JPH04344337A (ja) * 1991-05-21 1992-11-30 Toshiba Corp 光学装置
IL100664A0 (en) * 1992-01-15 1992-09-06 Laser Ind Ltd Method and apparatus for controlling a laser beam
GB9202434D0 (en) * 1992-02-05 1992-03-18 Xaar Ltd Method of and apparatus for forming nozzles
DE4220705C2 (de) * 1992-06-24 2003-03-13 Lambda Physik Ag Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen
US5378137A (en) * 1993-05-10 1995-01-03 Hewlett-Packard Company Mask design for forming tapered inkjet nozzles
EP0633541A1 (en) * 1993-07-06 1995-01-11 Opticon Sensors Europe B.V. Scanning device
US5610733A (en) * 1994-02-28 1997-03-11 Digital Optics Corporation Beam-homogenizer
US5742426A (en) * 1995-05-25 1998-04-21 York; Kenneth K. Laser beam treatment pattern smoothing device and laser beam treatment pattern modulator
US5609778A (en) * 1995-06-02 1997-03-11 International Business Machines Corporation Process for high contrast marking on surfaces using lasers

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106029290A (zh) * 2014-02-25 2016-10-12 松下知识产权经营株式会社 激光加工头以及激光加工系统
US9889522B2 (en) 2014-02-25 2018-02-13 Panasonic Intellectual Property Management Co., Ltd. Laser processing system
CN106029290B (zh) * 2014-02-25 2019-12-20 松下知识产权经营株式会社 激光加工系统
CN110198804A (zh) * 2017-01-25 2019-09-03 松下知识产权经营株式会社 激光加工头以及使用其的激光加工装置
CN110198804B (zh) * 2017-01-25 2020-12-08 松下知识产权经营株式会社 激光加工头以及使用其的激光加工装置

Also Published As

Publication number Publication date
US6120976A (en) 2000-09-19
AU3187999A (en) 2000-06-13
EP1131183B1 (en) 2003-01-02
DE69904753D1 (de) 2003-02-06
JP2002530205A (ja) 2002-09-17
EP1131183A1 (en) 2001-09-12
DE69904753T2 (de) 2003-10-16
WO2000030800A1 (en) 2000-06-02

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