JP2002513204A5 - - Google Patents

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Publication number
JP2002513204A5
JP2002513204A5 JP2000546223A JP2000546223A JP2002513204A5 JP 2002513204 A5 JP2002513204 A5 JP 2002513204A5 JP 2000546223 A JP2000546223 A JP 2000546223A JP 2000546223 A JP2000546223 A JP 2000546223A JP 2002513204 A5 JP2002513204 A5 JP 2002513204A5
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JP
Japan
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JP2000546223A
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Japanese (ja)
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JP5060684B2 (ja
JP2002513204A (ja
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Priority claimed from US09/070,437 external-priority patent/US6020957A/en
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JP2000546223A 1998-04-30 1999-04-30 半導体ウェーハを検査するシステム及び方法 Expired - Lifetime JP5060684B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/070,437 US6020957A (en) 1998-04-30 1998-04-30 System and method for inspecting semiconductor wafers
US09/070,437 1998-04-30
PCT/US1999/009555 WO1999056113A1 (en) 1998-04-30 1999-04-30 A system and method for inspecting semiconductor wafers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010131351A Division JP5663207B2 (ja) 1998-04-30 2010-06-08 モジュラ光学検査システム

Publications (3)

Publication Number Publication Date
JP2002513204A JP2002513204A (ja) 2002-05-08
JP2002513204A5 true JP2002513204A5 (enExample) 2006-06-22
JP5060684B2 JP5060684B2 (ja) 2012-10-31

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JP2000546223A Expired - Lifetime JP5060684B2 (ja) 1998-04-30 1999-04-30 半導体ウェーハを検査するシステム及び方法
JP2010131351A Expired - Lifetime JP5663207B2 (ja) 1998-04-30 2010-06-08 モジュラ光学検査システム

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JP2010131351A Expired - Lifetime JP5663207B2 (ja) 1998-04-30 2010-06-08 モジュラ光学検査システム

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US (2) US6020957A (enExample)
EP (1) EP1075652B1 (enExample)
JP (2) JP5060684B2 (enExample)
AU (1) AU3875899A (enExample)
WO (1) WO1999056113A1 (enExample)

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