JP2002510434A - フラット・ファン熱交換器 - Google Patents

フラット・ファン熱交換器

Info

Publication number
JP2002510434A
JP2002510434A JP54924298A JP54924298A JP2002510434A JP 2002510434 A JP2002510434 A JP 2002510434A JP 54924298 A JP54924298 A JP 54924298A JP 54924298 A JP54924298 A JP 54924298A JP 2002510434 A JP2002510434 A JP 2002510434A
Authority
JP
Japan
Prior art keywords
fan
housing
computer
heat exchanger
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP54924298A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002510434A5 (enExample
Inventor
バーシャ，ラケッシュ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of JP2002510434A publication Critical patent/JP2002510434A/ja
Publication of JP2002510434A5 publication Critical patent/JP2002510434A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/02—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps having non-centrifugal stages, e.g. centripetal
    • F04D17/04—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps having non-centrifugal stages, e.g. centripetal of transverse-flow type
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP54924298A 1997-05-15 1998-04-16 フラット・ファン熱交換器 Pending JP2002510434A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/857,710 US6111748A (en) 1997-05-15 1997-05-15 Flat fan heat exchanger and use thereof in a computing device
US08/857,710 1997-05-15
PCT/US1998/007875 WO1998052397A1 (en) 1997-05-15 1998-04-16 A flat fan heat exchanger

Publications (2)

Publication Number Publication Date
JP2002510434A true JP2002510434A (ja) 2002-04-02
JP2002510434A5 JP2002510434A5 (enExample) 2005-12-02

Family

ID=25326574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54924298A Pending JP2002510434A (ja) 1997-05-15 1998-04-16 フラット・ファン熱交換器

Country Status (5)

Country Link
US (1) US6111748A (enExample)
JP (1) JP2002510434A (enExample)
AU (1) AU7135798A (enExample)
TW (1) TW463082B (enExample)
WO (1) WO1998052397A1 (enExample)

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US6653755B2 (en) * 2001-05-30 2003-11-25 Intel Corporation Radial air flow fan assembly having stator fins surrounding rotor blades
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US7416481B2 (en) * 2006-03-06 2008-08-26 International Business Machines Corporation Blower exhaust backflow damper
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US7434610B2 (en) * 2006-07-13 2008-10-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus
US20080043436A1 (en) * 2006-08-21 2008-02-21 Foxconn Technology Co., Ltd. Thermal module
CN101166406B (zh) * 2006-10-18 2010-09-29 富准精密工业(深圳)有限公司 鳍片组及具有该鳍片组的散热装置
US20080158805A1 (en) * 2006-12-27 2008-07-03 Mazen Waheeb El Bteddini Small portable multipurpose pc unit insertable into a multitude of operating stations
TWM325535U (en) * 2007-06-29 2008-01-11 Cooler Master Co Ltd Diffusion type heat dissipation device
EP3597251B1 (en) 2008-06-05 2023-04-26 ResMed Pty Ltd Treatment of respiratory conditions
US10914308B2 (en) * 2009-01-05 2021-02-09 Intel Corporation Crossflow blower apparatus and system
EP2317150B1 (en) 2009-10-29 2019-12-18 ResMed Pty Ltd Patient ventilation device and components thereof
US9249803B2 (en) 2010-06-30 2016-02-02 Intel Corporation Integrated crossflow blower motor apparatus and system
US20120000491A1 (en) * 2010-07-01 2012-01-05 Lenovo (Singapore) Pte. Ltd. Apparatus and Method for Cleaning an Electronic Device
US9845805B2 (en) * 2010-07-29 2017-12-19 Dell Products, L.P. Dual operation centrifugal fan apparatus and methods of using same
TWI426861B (zh) * 2011-04-08 2014-02-11 Sunonwealth Electr Mach Ind Co 具有水平對流扇之散熱系統
TWI495792B (zh) * 2012-01-04 2015-08-11 Forcecon Technology Co Ltd With a supercharged effect of the thin cross-flow fan
CN102536860B (zh) * 2012-01-11 2014-01-08 苏州聚力电机有限公司 一种具有出风增压效果的薄型横流式风扇
TWI505073B (zh) 2012-03-22 2015-10-21 Compal Electronics Inc 電子裝置
WO2014031626A1 (en) * 2012-08-20 2014-02-27 Thomson Licensing Hard drive system with blower or fan
US9239060B2 (en) * 2012-09-28 2016-01-19 Intel Corporation Blower assembly for electronic device
US9252074B2 (en) * 2013-01-23 2016-02-02 Amtek Semiconductors Co., Ltd. Heat dissipating device
WO2014190478A1 (en) 2013-05-28 2014-12-04 Empire Technology Development Llc Evaporation-condensation systems and methods of manufacturing and using the same
WO2014190484A1 (en) 2013-05-28 2014-12-04 Empire Technology Development Llc Thin film systems and methods for using and making same
WO2014190479A1 (en) * 2013-05-28 2014-12-04 Empire Technology Development Llc Systems and methods for controlling non-condensable gases
US9291170B2 (en) * 2013-06-28 2016-03-22 Intel Corporation Blower assembly for electronic device
US10436223B2 (en) 2014-03-24 2019-10-08 Delta Electronics, Inc. Fan
US9655278B2 (en) * 2014-06-05 2017-05-16 Asia Vital Components Co., Ltd. Slim fan structure
CN110017293B (zh) * 2014-11-25 2021-07-30 台达电子工业股份有限公司 离心式风扇
US10718342B2 (en) 2014-11-25 2020-07-21 Delta Electronics, Inc. Centrifugal fan comprising a sidewall and plurality of air deflectors forming a plurality of airflow entry tunnels to sequentially expand a flow channel outwardly in a radial direction
US9797408B2 (en) * 2015-11-25 2017-10-24 Corsair Memory, Inc. Blower fan cooling system
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Also Published As

Publication number Publication date
WO1998052397A1 (en) 1998-11-19
TW463082B (en) 2001-11-11
US6111748A (en) 2000-08-29
AU7135798A (en) 1998-12-08

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