JP2002502111A - 基板を処理する装置および方法 - Google Patents

基板を処理する装置および方法

Info

Publication number
JP2002502111A
JP2002502111A JP2000528999A JP2000528999A JP2002502111A JP 2002502111 A JP2002502111 A JP 2002502111A JP 2000528999 A JP2000528999 A JP 2000528999A JP 2000528999 A JP2000528999 A JP 2000528999A JP 2002502111 A JP2002502111 A JP 2002502111A
Authority
JP
Japan
Prior art keywords
substrate
processing
processing fluid
dimensions
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000528999A
Other languages
English (en)
Japanese (ja)
Inventor
シュトルツ ミヒャエル
レープシュトック ルッツ
フィンガーホルツ オーレリア
Original Assignee
ステアーグ ミクロテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ステアーグ ミクロテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング filed Critical ステアーグ ミクロテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング
Publication of JP2002502111A publication Critical patent/JP2002502111A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
JP2000528999A 1998-01-23 1998-12-28 基板を処理する装置および方法 Pending JP2002502111A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19802579.3 1998-01-23
DE19802579A DE19802579A1 (de) 1998-01-23 1998-01-23 Vorrichtung und Verfahren zur Behandlung von Substraten
PCT/EP1998/008469 WO1999038198A1 (fr) 1998-01-23 1998-12-28 Dispositif et procede pour le traitement de substrats

Publications (1)

Publication Number Publication Date
JP2002502111A true JP2002502111A (ja) 2002-01-22

Family

ID=7855502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000528999A Pending JP2002502111A (ja) 1998-01-23 1998-12-28 基板を処理する装置および方法

Country Status (6)

Country Link
EP (1) EP1050069A1 (fr)
JP (1) JP2002502111A (fr)
KR (1) KR20010024876A (fr)
DE (1) DE19802579A1 (fr)
TW (1) TW447032B (fr)
WO (1) WO1999038198A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031549A (ja) * 2001-07-16 2003-01-31 Toshiba Ceramics Co Ltd 半導体ウェーハのエッチング装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3376985B2 (ja) * 2000-02-25 2003-02-17 日本電気株式会社 ウェット処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers
JP2538589B2 (ja) * 1987-04-07 1996-09-25 株式会社東芝 半導体ウエハ処理装置
JP2656041B2 (ja) * 1987-07-06 1997-09-24 ティーディーケイ株式会社 圧電磁器分極方法及び装置
DE3733670C1 (de) * 1987-10-05 1988-12-15 Nukem Gmbh Verfahren und Vorrichtung zum Reinigen insbesondere von scheibenfoermigen oxidischen Substraten
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031549A (ja) * 2001-07-16 2003-01-31 Toshiba Ceramics Co Ltd 半導体ウェーハのエッチング装置

Also Published As

Publication number Publication date
KR20010024876A (ko) 2001-03-26
DE19802579A1 (de) 1999-07-29
TW447032B (en) 2001-07-21
EP1050069A1 (fr) 2000-11-08
WO1999038198A1 (fr) 1999-07-29

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