KR20010024876A - 기판을 처리하기 위한 장치 및 방법 - Google Patents
기판을 처리하기 위한 장치 및 방법 Download PDFInfo
- Publication number
- KR20010024876A KR20010024876A KR1020007008012A KR20007008012A KR20010024876A KR 20010024876 A KR20010024876 A KR 20010024876A KR 1020007008012 A KR1020007008012 A KR 1020007008012A KR 20007008012 A KR20007008012 A KR 20007008012A KR 20010024876 A KR20010024876 A KR 20010024876A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- size
- wafer
- hood
- receptacle
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000012545 processing Methods 0.000 claims abstract description 48
- 230000000630 rising effect Effects 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 29
- 230000001174 ascending effect Effects 0.000 claims description 4
- 238000000605 extraction Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 55
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19802579.3 | 1998-01-23 | ||
| DE19802579A DE19802579A1 (de) | 1998-01-23 | 1998-01-23 | Vorrichtung und Verfahren zur Behandlung von Substraten |
| PCT/EP1998/008469 WO1999038198A1 (fr) | 1998-01-23 | 1998-12-28 | Dispositif et procede pour le traitement de substrats |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010024876A true KR20010024876A (ko) | 2001-03-26 |
Family
ID=7855502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020007008012A KR20010024876A (ko) | 1998-01-23 | 1998-12-28 | 기판을 처리하기 위한 장치 및 방법 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1050069A1 (fr) |
| JP (1) | JP2002502111A (fr) |
| KR (1) | KR20010024876A (fr) |
| DE (1) | DE19802579A1 (fr) |
| TW (1) | TW447032B (fr) |
| WO (1) | WO1999038198A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3376985B2 (ja) * | 2000-02-25 | 2003-02-17 | 日本電気株式会社 | ウェット処理装置 |
| JP2003031549A (ja) * | 2001-07-16 | 2003-01-31 | Toshiba Ceramics Co Ltd | 半導体ウェーハのエッチング装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4722752A (en) * | 1986-06-16 | 1988-02-02 | Robert F. Orr | Apparatus and method for rinsing and drying silicon wafers |
| JP2538589B2 (ja) * | 1987-04-07 | 1996-09-25 | 株式会社東芝 | 半導体ウエハ処理装置 |
| JP2656041B2 (ja) * | 1987-07-06 | 1997-09-24 | ティーディーケイ株式会社 | 圧電磁器分極方法及び装置 |
| DE3733670C1 (de) * | 1987-10-05 | 1988-12-15 | Nukem Gmbh | Verfahren und Vorrichtung zum Reinigen insbesondere von scheibenfoermigen oxidischen Substraten |
| NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
-
1998
- 1998-01-23 DE DE19802579A patent/DE19802579A1/de not_active Withdrawn
- 1998-12-28 KR KR1020007008012A patent/KR20010024876A/ko not_active Application Discontinuation
- 1998-12-28 JP JP2000528999A patent/JP2002502111A/ja active Pending
- 1998-12-28 WO PCT/EP1998/008469 patent/WO1999038198A1/fr not_active Application Discontinuation
- 1998-12-28 EP EP98966678A patent/EP1050069A1/fr not_active Withdrawn
-
1999
- 1999-01-21 TW TW088100877A patent/TW447032B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1050069A1 (fr) | 2000-11-08 |
| JP2002502111A (ja) | 2002-01-22 |
| WO1999038198A1 (fr) | 1999-07-29 |
| TW447032B (en) | 2001-07-21 |
| DE19802579A1 (de) | 1999-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0105 | International application |
Patent event date: 20000721 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20020510 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20020723 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20020510 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |