JP2002359321A - 電力増幅モジュール、回路要素集合基板及び回路要素特性調整方法 - Google Patents
電力増幅モジュール、回路要素集合基板及び回路要素特性調整方法Info
- Publication number
- JP2002359321A JP2002359321A JP2001165649A JP2001165649A JP2002359321A JP 2002359321 A JP2002359321 A JP 2002359321A JP 2001165649 A JP2001165649 A JP 2001165649A JP 2001165649 A JP2001165649 A JP 2001165649A JP 2002359321 A JP2002359321 A JP 2002359321A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric layer
- measurement
- circuit
- power amplification
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims description 17
- 230000001105 regulatory effect Effects 0.000 title 1
- 239000003990 capacitor Substances 0.000 claims abstract description 67
- 239000010410 layer Substances 0.000 claims description 155
- 230000003321 amplification Effects 0.000 claims description 79
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 79
- 238000005259 measurement Methods 0.000 claims description 70
- 239000000463 material Substances 0.000 claims description 24
- 239000012792 core layer Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000000843 powder Substances 0.000 claims description 13
- 238000009966 trimming Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 9
- 239000003365 glass fiber Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000012044 organic layer Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 12
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 11
- 238000001514 detection method Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 8
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 6
- -1 benzyl ether compound Chemical class 0.000 description 6
- 238000010295 mobile communication Methods 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- 102100032533 ADP/ATP translocase 1 Human genes 0.000 description 5
- 101000768061 Escherichia phage P1 Antirepressor protein 1 Proteins 0.000 description 5
- 101000796932 Homo sapiens ADP/ATP translocase 1 Proteins 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 241001125929 Trisopterus luscus Species 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 102100026396 ADP/ATP translocase 2 Human genes 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 101000718417 Homo sapiens ADP/ATP translocase 2 Proteins 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- QDBBMDIJZASVDT-UHFFFAOYSA-N [Nd].[Ba].[Ti] Chemical compound [Nd].[Ba].[Ti] QDBBMDIJZASVDT-UHFFFAOYSA-N 0.000 description 1
- FYIJOBXRDKUVAB-UHFFFAOYSA-N [Sn].[Ba].[Ti] Chemical compound [Sn].[Ba].[Ti] FYIJOBXRDKUVAB-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Amplifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001165649A JP2002359321A (ja) | 2001-05-31 | 2001-05-31 | 電力増幅モジュール、回路要素集合基板及び回路要素特性調整方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001165649A JP2002359321A (ja) | 2001-05-31 | 2001-05-31 | 電力増幅モジュール、回路要素集合基板及び回路要素特性調整方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002359321A true JP2002359321A (ja) | 2002-12-13 |
| JP2002359321A5 JP2002359321A5 (https=) | 2004-08-26 |
Family
ID=19008295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001165649A Pending JP2002359321A (ja) | 2001-05-31 | 2001-05-31 | 電力増幅モジュール、回路要素集合基板及び回路要素特性調整方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002359321A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2008126468A1 (ja) * | 2007-03-30 | 2010-07-22 | 日本電気株式会社 | 半導体装置及び半導体装置の製造方法 |
| JPWO2010026956A1 (ja) * | 2008-09-02 | 2012-02-02 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| WO2014083876A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社村田製作所 | 電力増幅回路及び電力増幅モジュール |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11214851A (ja) * | 1994-05-23 | 1999-08-06 | Tdk Corp | 高周波モジュール |
| JP2000252744A (ja) * | 1999-02-26 | 2000-09-14 | Ngk Spark Plug Co Ltd | 高周波発振器 |
| JP2000332422A (ja) * | 1999-05-20 | 2000-11-30 | Sony Corp | 多層回路基板及びその製造方法 |
| JP2000340749A (ja) * | 1999-05-27 | 2000-12-08 | Tdk Corp | 高周波ic部品及びその製造方法 |
| JP2001068858A (ja) * | 1999-08-27 | 2001-03-16 | Shinko Electric Ind Co Ltd | 多層配線基板及びその製造方法並びに半導体装置 |
-
2001
- 2001-05-31 JP JP2001165649A patent/JP2002359321A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11214851A (ja) * | 1994-05-23 | 1999-08-06 | Tdk Corp | 高周波モジュール |
| JP2000252744A (ja) * | 1999-02-26 | 2000-09-14 | Ngk Spark Plug Co Ltd | 高周波発振器 |
| JP2000332422A (ja) * | 1999-05-20 | 2000-11-30 | Sony Corp | 多層回路基板及びその製造方法 |
| JP2000340749A (ja) * | 1999-05-27 | 2000-12-08 | Tdk Corp | 高周波ic部品及びその製造方法 |
| JP2001068858A (ja) * | 1999-08-27 | 2001-03-16 | Shinko Electric Ind Co Ltd | 多層配線基板及びその製造方法並びに半導体装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2008126468A1 (ja) * | 2007-03-30 | 2010-07-22 | 日本電気株式会社 | 半導体装置及び半導体装置の製造方法 |
| JPWO2010026956A1 (ja) * | 2008-09-02 | 2012-02-02 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| WO2014083876A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社村田製作所 | 電力増幅回路及び電力増幅モジュール |
| US9331639B2 (en) | 2012-11-30 | 2016-05-03 | Murata Manufacturing Co., Ltd. | Power amplification circuit and power amplification module |
| JP5983968B2 (ja) * | 2012-11-30 | 2016-09-06 | 株式会社村田製作所 | 電力増幅回路及び電力増幅モジュール |
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Legal Events
| Date | Code | Title | Description |
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| A977 | Report on retrieval |
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