JP2002223054A - 積層基板の製造方法 - Google Patents
積層基板の製造方法Info
- Publication number
- JP2002223054A JP2002223054A JP2001344992A JP2001344992A JP2002223054A JP 2002223054 A JP2002223054 A JP 2002223054A JP 2001344992 A JP2001344992 A JP 2001344992A JP 2001344992 A JP2001344992 A JP 2001344992A JP 2002223054 A JP2002223054 A JP 2002223054A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- sheet
- laminated substrate
- insulating layer
- resin insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 119
- 238000000034 method Methods 0.000 title claims abstract description 99
- 229920005989 resin Polymers 0.000 claims abstract description 258
- 239000011347 resin Substances 0.000 claims abstract description 258
- 239000002184 metal Substances 0.000 claims abstract description 162
- 229910052751 metal Inorganic materials 0.000 claims abstract description 162
- 230000002093 peripheral effect Effects 0.000 claims abstract description 33
- 239000010410 layer Substances 0.000 claims description 810
- 239000000758 substrate Substances 0.000 claims description 379
- 238000007747 plating Methods 0.000 claims description 138
- 239000011888 foil Substances 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 10
- 238000004299 exfoliation Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 43
- 239000011889 copper foil Substances 0.000 description 32
- 238000010586 diagram Methods 0.000 description 21
- 239000000654 additive Substances 0.000 description 12
- 239000010949 copper Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 238000009413 insulation Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 7
- 238000007772 electroless plating Methods 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001344992A JP2002223054A (ja) | 1999-03-31 | 2001-11-09 | 積層基板の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-91578 | 1999-03-31 | ||
| JP9157899 | 1999-03-31 | ||
| JP2001344992A JP2002223054A (ja) | 1999-03-31 | 2001-11-09 | 積層基板の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17844299A Division JP3357012B2 (ja) | 1999-03-31 | 1999-06-24 | 積層基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002223054A true JP2002223054A (ja) | 2002-08-09 |
| JP2002223054A5 JP2002223054A5 (enExample) | 2005-10-20 |
Family
ID=26433022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001344992A Pending JP2002223054A (ja) | 1999-03-31 | 2001-11-09 | 積層基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002223054A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009089223A (ja) * | 2007-10-02 | 2009-04-23 | Mitsubishi Electric Corp | 積層構造体 |
| JP2009184172A (ja) * | 2008-02-05 | 2009-08-20 | Asahi Glass Co Ltd | ガラス積層体、支持体付き表示装置用パネル、およびそれらの製造方法 |
| JP2010041443A (ja) * | 2008-08-06 | 2010-02-18 | Mitsubishi Electric Corp | 中空積層構造体及び中空積層構造体を利用した導波路構造、アンテナ及び車載用電波レーダ |
| JP2011091835A (ja) * | 2010-11-29 | 2011-05-06 | Mitsubishi Electric Corp | 積層構造体 |
| JP2020160325A (ja) * | 2019-03-27 | 2020-10-01 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| CN113632595B (en) * | 2019-03-27 | 2025-12-16 | 日东电工株式会社 | Wired circuit board and method for manufacturing the same |
-
2001
- 2001-11-09 JP JP2001344992A patent/JP2002223054A/ja active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009089223A (ja) * | 2007-10-02 | 2009-04-23 | Mitsubishi Electric Corp | 積層構造体 |
| US8795815B2 (en) | 2007-10-02 | 2014-08-05 | Mitsubishi Electric Corporation | Laminated structure |
| JP2009184172A (ja) * | 2008-02-05 | 2009-08-20 | Asahi Glass Co Ltd | ガラス積層体、支持体付き表示装置用パネル、およびそれらの製造方法 |
| JP2010041443A (ja) * | 2008-08-06 | 2010-02-18 | Mitsubishi Electric Corp | 中空積層構造体及び中空積層構造体を利用した導波路構造、アンテナ及び車載用電波レーダ |
| JP2011091835A (ja) * | 2010-11-29 | 2011-05-06 | Mitsubishi Electric Corp | 積層構造体 |
| WO2020195669A1 (ja) * | 2019-03-27 | 2020-10-01 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| JP2020160325A (ja) * | 2019-03-27 | 2020-10-01 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| CN113632595A (zh) * | 2019-03-27 | 2021-11-09 | 日东电工株式会社 | 布线电路基板及其制造方法 |
| KR20210142626A (ko) * | 2019-03-27 | 2021-11-25 | 닛토덴코 가부시키가이샤 | 배선 회로 기판 및 그 제조 방법 |
| US20220192010A1 (en) * | 2019-03-27 | 2022-06-16 | Nitto Denko Corporation | Wiring circuit board and producing method thereof |
| JP7291514B2 (ja) | 2019-03-27 | 2023-06-15 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| US11825598B2 (en) | 2019-03-27 | 2023-11-21 | Nitto Denko Corporation | Wiring circuit board and producing method thereof |
| TWI851689B (zh) * | 2019-03-27 | 2024-08-11 | 日商日東電工股份有限公司 | 配線電路基板及其製造方法 |
| KR102849257B1 (ko) * | 2019-03-27 | 2025-08-21 | 닛토덴코 가부시키가이샤 | 배선 회로 기판 및 그 제조 방법 |
| CN113632595B (en) * | 2019-03-27 | 2025-12-16 | 日东电工株式会社 | Wired circuit board and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050701 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050701 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080513 |
|
| A02 | Decision of refusal |
Effective date: 20081104 Free format text: JAPANESE INTERMEDIATE CODE: A02 |