JP2002201271A5 - - Google Patents
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- Publication number
- JP2002201271A5 JP2002201271A5 JP2001390598A JP2001390598A JP2002201271A5 JP 2002201271 A5 JP2002201271 A5 JP 2002201271A5 JP 2001390598 A JP2001390598 A JP 2001390598A JP 2001390598 A JP2001390598 A JP 2001390598A JP 2002201271 A5 JP2002201271 A5 JP 2002201271A5
- Authority
- JP
- Japan
- Prior art keywords
- segment
- bis
- dianhydride
- apb
- benzene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002253 acid Substances 0.000 claims 38
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims 27
- 150000004985 diamines Chemical class 0.000 claims 20
- 239000004642 Polyimide Substances 0.000 claims 17
- 229920001721 polyimide Polymers 0.000 claims 17
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims 13
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical group C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims 10
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims 10
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims 8
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims 8
- 239000000376 reactant Substances 0.000 claims 8
- 229920005575 poly(amic acid) Polymers 0.000 claims 7
- 239000000178 monomer Substances 0.000 claims 6
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 claims 5
- -1 Carboxyphenyl Chemical group 0.000 claims 5
- 229920001577 copolymer Polymers 0.000 claims 5
- 150000008065 acid anhydrides Chemical class 0.000 claims 4
- WOYZXEVUWXQVNV-UHFFFAOYSA-N 4-phenoxyaniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1 WOYZXEVUWXQVNV-UHFFFAOYSA-N 0.000 claims 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims 3
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- NMFFUUFPJJOWHK-UHFFFAOYSA-N 2-phenoxyaniline Chemical compound NC1=CC=CC=C1OC1=CC=CC=C1 NMFFUUFPJJOWHK-UHFFFAOYSA-N 0.000 claims 2
- 125000003368 amide group Chemical group 0.000 claims 2
- 150000001412 amines Chemical class 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- UCSYVYFGMFODMY-UHFFFAOYSA-N 3-phenoxyaniline Chemical compound NC1=CC=CC(OC=2C=CC=CC=2)=C1 UCSYVYFGMFODMY-UHFFFAOYSA-N 0.000 claims 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 claims 1
- 238000000113 differential scanning calorimetry Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/741941 | 2000-12-21 | ||
| US09/741,941 US6444783B1 (en) | 2000-12-21 | 2000-12-21 | Melt-processible semicrystalline block copolyimides |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002201271A JP2002201271A (ja) | 2002-07-19 |
| JP2002201271A5 true JP2002201271A5 (enExample) | 2005-07-28 |
| JP4031241B2 JP4031241B2 (ja) | 2008-01-09 |
Family
ID=24982864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001390598A Expired - Fee Related JP4031241B2 (ja) | 2000-12-21 | 2001-12-21 | 溶融加工性半晶質ブロックコポリイミド |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6444783B1 (enExample) |
| EP (1) | EP1219663B1 (enExample) |
| JP (1) | JP4031241B2 (enExample) |
| DE (1) | DE60110195T2 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1561786A4 (en) * | 2002-10-16 | 2007-07-18 | Pi R & D Co Ltd | COMPOSITIONS OF COPOLYIMIDE SEQUENCES COMPRISING PYROMELLIIC DIANHYDRIDE AND PROCESS FOR PRODUCING THE SAME |
| US20040132900A1 (en) * | 2003-01-08 | 2004-07-08 | International Business Machines Corporation | Polyimide compositions and use thereof in ceramic product defect repair |
| US7129318B2 (en) * | 2003-09-02 | 2006-10-31 | I.S.T. (Ma) Corporation | RTM and RI processable polyimide resins |
| EP1910078A4 (en) * | 2005-08-02 | 2012-06-06 | Nexolve Corp | HETEROPOLYMERIC COMPOSITIONS OF POLYIMIDE POLYMER |
| KR101115058B1 (ko) * | 2008-07-09 | 2012-02-13 | 주식회사 엘지화학 | 폴리이미드-폴리아믹산 공중합체, 이의 제조방법, 이를포함하는 감광성 조성물 및 이에 의해 제공된 보호막 |
| FR2980203B1 (fr) * | 2011-09-20 | 2014-12-26 | Rhodia Operations | Copolyimides thermoplastiques |
| WO2013130724A2 (en) | 2012-02-28 | 2013-09-06 | Corning Incorporated | Glass articles with low-friction coatings |
| US11497681B2 (en) | 2012-02-28 | 2022-11-15 | Corning Incorporated | Glass articles with low-friction coatings |
| US10737973B2 (en) | 2012-02-28 | 2020-08-11 | Corning Incorporated | Pharmaceutical glass coating for achieving particle reduction |
| US10273048B2 (en) | 2012-06-07 | 2019-04-30 | Corning Incorporated | Delamination resistant glass containers with heat-tolerant coatings |
| RU2674269C2 (ru) | 2012-06-07 | 2018-12-06 | Корнинг Инкорпорейтед | Стойкие к расслаиванию стеклянные контейнеры |
| US9034442B2 (en) | 2012-11-30 | 2015-05-19 | Corning Incorporated | Strengthened borosilicate glass containers with improved damage tolerance |
| US10117806B2 (en) | 2012-11-30 | 2018-11-06 | Corning Incorporated | Strengthened glass containers resistant to delamination and damage |
| CN107074628B (zh) | 2014-09-05 | 2020-05-19 | 康宁股份有限公司 | 玻璃制品和用于改善玻璃制品的可靠性的方法 |
| US10065884B2 (en) | 2014-11-26 | 2018-09-04 | Corning Incorporated | Methods for producing strengthened and durable glass containers |
| EP3150564B1 (en) | 2015-09-30 | 2018-12-05 | Corning Incorporated | Halogenated polyimide siloxane chemical compositions and glass articles with halogenated polylmide siloxane low-friction coatings |
| MX2018005349A (es) | 2015-10-30 | 2018-05-17 | Corning Inc | Articulos de vidrio con revestimientos de oxido de metal y polimero mezclados. |
| EP3246298A1 (en) | 2016-05-12 | 2017-11-22 | Corning Incorporated | Pharmaceutical glass coating for achieving particle reduction |
| CN109661576A (zh) | 2016-09-02 | 2019-04-19 | 康宁股份有限公司 | 用于检测玻璃包装工艺中的挥发性有机化合物的方法和设备 |
| US20190161399A1 (en) | 2017-11-30 | 2019-05-30 | Corning Incorporated | Glass articles with low-friction coatings and methods for coating glass articles |
| KR102813830B1 (ko) * | 2018-12-28 | 2025-05-28 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름 |
| WO2021173321A1 (en) | 2020-02-25 | 2021-09-02 | Corning Incorporated | High efficiency pharmaceutical filling line |
| WO2021210640A1 (ja) * | 2020-04-16 | 2021-10-21 | 三菱瓦斯化学株式会社 | イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム |
| WO2021210641A1 (ja) * | 2020-04-16 | 2021-10-21 | 三菱瓦斯化学株式会社 | イミド－アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム |
| MX2023002689A (es) | 2020-09-04 | 2023-05-25 | Corning Inc | Empaques farmaceuticos recubiertos con bloqueo de luz ultravioleta. |
| WO2022211086A1 (ja) * | 2021-04-02 | 2022-10-06 | 旭化成株式会社 | ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法 |
| JP2023047875A (ja) * | 2021-09-27 | 2023-04-06 | 株式会社カネカ | ポリイミド前駆体とポリイミド、ポリイミドフィルムならびに多層フィルム |
| WO2025239165A1 (ja) * | 2024-05-17 | 2025-11-20 | Jnc株式会社 | ポリイミド前駆体、熱硬化性樹脂組成物、硬化膜、基板、電子部品およびポリイミド前駆体の製造方法 |
| CN119613719A (zh) * | 2024-12-19 | 2025-03-14 | 香港中文大学（深圳） | 一种基于序列调控的含氟聚酰胺酸、聚酰亚胺薄膜及其制备方法 |
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|---|---|---|---|---|
| US3489725A (en) | 1965-10-12 | 1970-01-13 | American Cyanamid Co | Process for the preparation of polyimides using a melt polymerization technique |
| US3803085A (en) | 1972-12-29 | 1974-04-09 | Gen Electric | Method for making polyetherimides |
| US4073773A (en) | 1976-12-30 | 1978-02-14 | General Electric Company | Melt polymerization method for making polyetherimides |
| US4281100A (en) | 1979-05-09 | 1981-07-28 | General Electric Company | Injection moldable polyetherimide oligomers and method for making |
| US4485140A (en) | 1983-09-21 | 1984-11-27 | E. I. Du Pont De Nemours And Company | Melt-fusible polyimides |
| US4590258A (en) | 1983-12-30 | 1986-05-20 | International Business Machines Corporation | Polyamic acid copolymer system for improved semiconductor manufacturing |
| US4552931A (en) | 1984-09-11 | 1985-11-12 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process of end-capping a polyimide system |
| US4883718A (en) | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
| GB2174399B (en) | 1985-03-10 | 1988-05-18 | Nitto Electric Ind Co | Colorless transparent polyimide shaped articles and their production |
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| US4839232A (en) | 1985-10-31 | 1989-06-13 | Mitsui Toatsu Chemicals, Incorporated | Flexible laminate printed-circuit board and methods of making same |
| JP2622678B2 (ja) | 1987-01-12 | 1997-06-18 | チッソ株式会社 | 溶融成形可能な結晶性ポリイミド重合体 |
| JP2809396B2 (ja) | 1987-06-17 | 1998-10-08 | 鐘淵化学工業株式会社 | ポリイミド共重合体膜の製造方法 |
| JP2766640B2 (ja) | 1987-06-17 | 1998-06-18 | 鐘淵化学工業株式会社 | 新規ポリイミド共重合体とその製造方法 |
| JP2810661B2 (ja) | 1987-06-17 | 1998-10-15 | 鐘淵化学工業株式会社 | ポリアミド酸共重合体の製造方法 |
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| US5171828A (en) | 1989-10-26 | 1992-12-15 | Occidental Chemical Corporation | Copolyimide ODPA/BPDA/4,4'-ODA or P-PDA |
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| US5166308A (en) | 1990-04-30 | 1992-11-24 | E. I. Du Pont De Nemours And Company | Copolyimide film with improved properties |
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| US5484879A (en) | 1990-12-17 | 1996-01-16 | Occidental Chemical Corporation | Polyimides containing fluorine |
| EP0518543B1 (en) | 1991-06-10 | 1997-03-12 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide and process for the preparation thereof |
| US5406124A (en) | 1992-12-04 | 1995-04-11 | Mitsui Toatsu Chemicals, Inc. | Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
| US5302652A (en) | 1992-12-15 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Process for preparing a pigmented polyimide shaped article |
| US5478913A (en) | 1993-12-22 | 1995-12-26 | E. I. Du Pont De Nemours And Company | Melt-processible polyimides with high Tg |
| US5502157A (en) | 1994-08-31 | 1996-03-26 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Copolyimides prepared from ODPA, BTDA and 3,4'-ODA |
| US5478916A (en) | 1994-09-01 | 1995-12-26 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Solvent resistant copolyimide |
| US5464928A (en) | 1994-09-01 | 1995-11-07 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Direct process for preparing semi-crystalline polyimides |
-
2000
- 2000-12-21 US US09/741,941 patent/US6444783B1/en not_active Expired - Fee Related
-
2001
- 2001-10-29 DE DE60110195T patent/DE60110195T2/de not_active Expired - Fee Related
- 2001-10-29 EP EP01125758A patent/EP1219663B1/en not_active Expired - Lifetime
- 2001-12-21 JP JP2001390598A patent/JP4031241B2/ja not_active Expired - Fee Related
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