JP2002158205A - ワークの乾燥装置 - Google Patents
ワークの乾燥装置Info
- Publication number
- JP2002158205A JP2002158205A JP2000349868A JP2000349868A JP2002158205A JP 2002158205 A JP2002158205 A JP 2002158205A JP 2000349868 A JP2000349868 A JP 2000349868A JP 2000349868 A JP2000349868 A JP 2000349868A JP 2002158205 A JP2002158205 A JP 2002158205A
- Authority
- JP
- Japan
- Prior art keywords
- work
- drying
- gas
- air
- clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims abstract description 60
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 238000009423 ventilation Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 abstract description 12
- 238000004140 cleaning Methods 0.000 abstract description 9
- 238000012546 transfer Methods 0.000 abstract description 6
- 238000007781 pre-processing Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 101100214868 Autographa californica nuclear polyhedrosis virus AC54 gene Proteins 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 101100434205 Solanum tuberosum AC75 gene Proteins 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000349868A JP2002158205A (ja) | 2000-11-16 | 2000-11-16 | ワークの乾燥装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000349868A JP2002158205A (ja) | 2000-11-16 | 2000-11-16 | ワークの乾燥装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002158205A true JP2002158205A (ja) | 2002-05-31 |
| JP2002158205A5 JP2002158205A5 (enrdf_load_stackoverflow) | 2007-11-08 |
Family
ID=18823193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000349868A Pending JP2002158205A (ja) | 2000-11-16 | 2000-11-16 | ワークの乾燥装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002158205A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107604556A (zh) * | 2017-10-16 | 2018-01-19 | 浙江雅力士自动化设备科技有限公司 | 缩水粘合一体机中的烘干装置 |
| KR20210102050A (ko) | 2020-02-10 | 2021-08-19 | 에바라코포레이숀 | 기판 건조 장치 |
| JP7660548B2 (ja) | 2021-12-24 | 2025-04-11 | セメス カンパニー，リミテッド | 基板処理装置及び基板処理方法 |
-
2000
- 2000-11-16 JP JP2000349868A patent/JP2002158205A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107604556A (zh) * | 2017-10-16 | 2018-01-19 | 浙江雅力士自动化设备科技有限公司 | 缩水粘合一体机中的烘干装置 |
| KR20210102050A (ko) | 2020-02-10 | 2021-08-19 | 에바라코포레이숀 | 기판 건조 장치 |
| JP2021125672A (ja) * | 2020-02-10 | 2021-08-30 | 株式会社荏原製作所 | 基板乾燥装置 |
| JP7356368B2 (ja) | 2020-02-10 | 2023-10-04 | 株式会社荏原製作所 | 基板乾燥装置 |
| US12094731B2 (en) | 2020-02-10 | 2024-09-17 | Ebara Corporation | Substrate drying apparatus |
| JP7660548B2 (ja) | 2021-12-24 | 2025-04-11 | セメス カンパニー，リミテッド | 基板処理装置及び基板処理方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5485644A (en) | Substrate treating apparatus | |
| JP3888608B2 (ja) | 基板両面処理装置 | |
| CN101499413B (zh) | 单个晶片的干燥装置和干燥方法 | |
| CN101930184B (zh) | 显影处理装置 | |
| TWI629741B (zh) | 基板液體處理裝置 | |
| JPH0536658A (ja) | 基板洗浄・乾燥装置 | |
| JP2001232250A (ja) | 膜形成装置 | |
| US20060219275A1 (en) | Device for cleaning wafers after a cmp process | |
| JPH07130693A (ja) | 枚葉式両面洗浄装置 | |
| JP2002158205A (ja) | ワークの乾燥装置 | |
| JP3730829B2 (ja) | 現像処理方法及び現像処理装置 | |
| JP3977948B2 (ja) | 基板処理装置 | |
| JP2543007B2 (ja) | ウエ−ハ枚葉洗浄装置 | |
| JP4762850B2 (ja) | 回転ロールの洗浄機構及び回転ロールの洗浄方法 | |
| JPH07297155A (ja) | 基板処理装置 | |
| JPH11204489A (ja) | 基板乾燥装置及び基板乾燥方法 | |
| JP4213805B2 (ja) | 乾燥処理装置 | |
| JPS6126226A (ja) | スクラビング装置 | |
| JP4663919B2 (ja) | 基板乾燥装置 | |
| KR0135394B1 (ko) | 기판처리장치 | |
| JPH09306974A (ja) | ワーク保持装置 | |
| KR100825310B1 (ko) | 기판 세정장비의 브러싱장치 | |
| JP2001176781A (ja) | 膜形成装置 | |
| JP2920855B2 (ja) | 洗浄処理装置 | |
| JP2005138053A (ja) | 基板洗浄装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070921 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070921 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20070921 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070921 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090807 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090901 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20100119 |